JPWO2023021643A1 - - Google Patents
Info
- Publication number
- JPWO2023021643A1 JPWO2023021643A1 JP2021576940A JP2021576940A JPWO2023021643A1 JP WO2023021643 A1 JPWO2023021643 A1 JP WO2023021643A1 JP 2021576940 A JP2021576940 A JP 2021576940A JP 2021576940 A JP2021576940 A JP 2021576940A JP WO2023021643 A1 JPWO2023021643 A1 JP WO2023021643A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/121—Arrangements for protection of devices protecting against mechanical damage
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/60—Seals
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/030314 WO2023021643A1 (ja) | 2021-08-19 | 2021-08-19 | 応力緩和構造 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7118298B1 JP7118298B1 (ja) | 2022-08-15 |
| JPWO2023021643A1 true JPWO2023021643A1 (https=) | 2023-02-23 |
| JPWO2023021643A5 JPWO2023021643A5 (https=) | 2023-07-26 |
Family
ID=82847600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021576940A Active JP7118298B1 (ja) | 2021-08-19 | 2021-08-19 | 応力緩和構造および応力緩和構造の製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240243023A1 (https=) |
| JP (1) | JP7118298B1 (https=) |
| CN (1) | CN117813682A (https=) |
| DE (1) | DE112021008123T5 (https=) |
| WO (1) | WO2023021643A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001085802A (ja) * | 1999-09-16 | 2001-03-30 | Hitachi Cable Ltd | 配線基板及びそれを用いた電子装置及びその製造方法 |
| JP2006277954A (ja) * | 2005-03-28 | 2006-10-12 | Jfe Steel Kk | 断路端子台 |
| JP2008241641A (ja) | 2007-03-29 | 2008-10-09 | Sumitomo Electric Ind Ltd | インターポーザおよびその製造方法 |
| JP2008277954A (ja) * | 2007-04-26 | 2008-11-13 | Fujitsu Media Device Kk | パッケージデバイス |
| JP6205914B2 (ja) | 2013-07-08 | 2017-10-04 | 三菱電機株式会社 | モジュール構造 |
| JP6481409B2 (ja) * | 2015-02-19 | 2019-03-13 | 三菱マテリアル株式会社 | パワーモジュール用基板及びパワーモジュール |
| CA3055274C (en) * | 2017-03-03 | 2021-07-27 | Hiroaki Nakaya | Thermoelectric conversion module provided with photothermal conversion substrate |
| JP7347735B2 (ja) * | 2019-11-11 | 2023-09-20 | 株式会社ディスコ | チャックテーブルおよびチャックテーブルの製造方法 |
-
2021
- 2021-08-19 US US18/576,116 patent/US20240243023A1/en active Pending
- 2021-08-19 WO PCT/JP2021/030314 patent/WO2023021643A1/ja not_active Ceased
- 2021-08-19 JP JP2021576940A patent/JP7118298B1/ja active Active
- 2021-08-19 DE DE112021008123.3T patent/DE112021008123T5/de active Pending
- 2021-08-19 CN CN202180101444.2A patent/CN117813682A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7118298B1 (ja) | 2022-08-15 |
| US20240243023A1 (en) | 2024-07-18 |
| CN117813682A (zh) | 2024-04-02 |
| DE112021008123T5 (de) | 2024-05-29 |
| WO2023021643A1 (ja) | 2023-02-23 |
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