DE112021008123T5 - Spannungsentlastungsstruktur - Google Patents

Spannungsentlastungsstruktur Download PDF

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Publication number
DE112021008123T5
DE112021008123T5 DE112021008123.3T DE112021008123T DE112021008123T5 DE 112021008123 T5 DE112021008123 T5 DE 112021008123T5 DE 112021008123 T DE112021008123 T DE 112021008123T DE 112021008123 T5 DE112021008123 T5 DE 112021008123T5
Authority
DE
Germany
Prior art keywords
electronic substrate
porous layer
stress relief
relief structure
metal pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112021008123.3T
Other languages
German (de)
English (en)
Inventor
Yoshiyuki KAMO
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE112021008123T5 publication Critical patent/DE112021008123T5/de
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112021008123.3T 2021-08-19 2021-08-19 Spannungsentlastungsstruktur Pending DE112021008123T5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/030314 WO2023021643A1 (ja) 2021-08-19 2021-08-19 応力緩和構造

Publications (1)

Publication Number Publication Date
DE112021008123T5 true DE112021008123T5 (de) 2024-05-29

Family

ID=82847600

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112021008123.3T Pending DE112021008123T5 (de) 2021-08-19 2021-08-19 Spannungsentlastungsstruktur

Country Status (5)

Country Link
US (1) US20240243023A1 (https=)
JP (1) JP7118298B1 (https=)
CN (1) CN117813682A (https=)
DE (1) DE112021008123T5 (https=)
WO (1) WO2023021643A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008241641A (ja) 2007-03-29 2008-10-09 Sumitomo Electric Ind Ltd インターポーザおよびその製造方法
JP2015015434A (ja) 2013-07-08 2015-01-22 三菱電機株式会社 モジュール構造

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085802A (ja) * 1999-09-16 2001-03-30 Hitachi Cable Ltd 配線基板及びそれを用いた電子装置及びその製造方法
JP2006277954A (ja) * 2005-03-28 2006-10-12 Jfe Steel Kk 断路端子台
JP2008277954A (ja) * 2007-04-26 2008-11-13 Fujitsu Media Device Kk パッケージデバイス
JP6481409B2 (ja) * 2015-02-19 2019-03-13 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
CA3055274C (en) * 2017-03-03 2021-07-27 Hiroaki Nakaya Thermoelectric conversion module provided with photothermal conversion substrate
JP7347735B2 (ja) * 2019-11-11 2023-09-20 株式会社ディスコ チャックテーブルおよびチャックテーブルの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008241641A (ja) 2007-03-29 2008-10-09 Sumitomo Electric Ind Ltd インターポーザおよびその製造方法
JP2015015434A (ja) 2013-07-08 2015-01-22 三菱電機株式会社 モジュール構造

Also Published As

Publication number Publication date
JP7118298B1 (ja) 2022-08-15
US20240243023A1 (en) 2024-07-18
JPWO2023021643A1 (https=) 2023-02-23
CN117813682A (zh) 2024-04-02
WO2023021643A1 (ja) 2023-02-23

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R012 Request for examination validly filed
R084 Declaration of willingness to licence
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0023100000

Ipc: H10W0076600000