JP7118298B1 - 応力緩和構造および応力緩和構造の製造方法 - Google Patents

応力緩和構造および応力緩和構造の製造方法 Download PDF

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Publication number
JP7118298B1
JP7118298B1 JP2021576940A JP2021576940A JP7118298B1 JP 7118298 B1 JP7118298 B1 JP 7118298B1 JP 2021576940 A JP2021576940 A JP 2021576940A JP 2021576940 A JP2021576940 A JP 2021576940A JP 7118298 B1 JP7118298 B1 JP 7118298B1
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Prior art keywords
electronic substrate
metal pattern
porous layer
electronic
stress relaxation
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JP2021576940A
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Japanese (ja)
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JPWO2023021643A1 (https=
JPWO2023021643A5 (https=
Inventor
芳幸 加茂
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of JPWO2023021643A5 publication Critical patent/JPWO2023021643A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/121—Arrangements for protection of devices protecting against mechanical damage
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2021576940A 2021-08-19 2021-08-19 応力緩和構造および応力緩和構造の製造方法 Active JP7118298B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/030314 WO2023021643A1 (ja) 2021-08-19 2021-08-19 応力緩和構造

Publications (3)

Publication Number Publication Date
JP7118298B1 true JP7118298B1 (ja) 2022-08-15
JPWO2023021643A1 JPWO2023021643A1 (https=) 2023-02-23
JPWO2023021643A5 JPWO2023021643A5 (https=) 2023-07-26

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ID=82847600

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JP2021576940A Active JP7118298B1 (ja) 2021-08-19 2021-08-19 応力緩和構造および応力緩和構造の製造方法

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Country Link
US (1) US20240243023A1 (https=)
JP (1) JP7118298B1 (https=)
CN (1) CN117813682A (https=)
DE (1) DE112021008123T5 (https=)
WO (1) WO2023021643A1 (https=)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085802A (ja) * 1999-09-16 2001-03-30 Hitachi Cable Ltd 配線基板及びそれを用いた電子装置及びその製造方法
JP2006277954A (ja) * 2005-03-28 2006-10-12 Jfe Steel Kk 断路端子台
JP2008277954A (ja) * 2007-04-26 2008-11-13 Fujitsu Media Device Kk パッケージデバイス
JP2016152386A (ja) * 2015-02-19 2016-08-22 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
WO2018159696A1 (ja) * 2017-03-03 2018-09-07 浩明 中弥 光熱変換基板を備えた熱電変換モジュール
JP2021077781A (ja) * 2019-11-11 2021-05-20 株式会社ディスコ チャックテーブルおよびチャックテーブルの製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008241641A (ja) 2007-03-29 2008-10-09 Sumitomo Electric Ind Ltd インターポーザおよびその製造方法
JP6205914B2 (ja) 2013-07-08 2017-10-04 三菱電機株式会社 モジュール構造

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001085802A (ja) * 1999-09-16 2001-03-30 Hitachi Cable Ltd 配線基板及びそれを用いた電子装置及びその製造方法
JP2006277954A (ja) * 2005-03-28 2006-10-12 Jfe Steel Kk 断路端子台
JP2008277954A (ja) * 2007-04-26 2008-11-13 Fujitsu Media Device Kk パッケージデバイス
JP2016152386A (ja) * 2015-02-19 2016-08-22 三菱マテリアル株式会社 パワーモジュール用基板及びパワーモジュール
WO2018159696A1 (ja) * 2017-03-03 2018-09-07 浩明 中弥 光熱変換基板を備えた熱電変換モジュール
JP2021077781A (ja) * 2019-11-11 2021-05-20 株式会社ディスコ チャックテーブルおよびチャックテーブルの製造方法

Also Published As

Publication number Publication date
US20240243023A1 (en) 2024-07-18
JPWO2023021643A1 (https=) 2023-02-23
CN117813682A (zh) 2024-04-02
DE112021008123T5 (de) 2024-05-29
WO2023021643A1 (ja) 2023-02-23

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