JPWO2022239711A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022239711A5
JPWO2022239711A5 JP2023521000A JP2023521000A JPWO2022239711A5 JP WO2022239711 A5 JPWO2022239711 A5 JP WO2022239711A5 JP 2023521000 A JP2023521000 A JP 2023521000A JP 2023521000 A JP2023521000 A JP 2023521000A JP WO2022239711 A5 JPWO2022239711 A5 JP WO2022239711A5
Authority
JP
Japan
Prior art keywords
external electrode
substrate
resin body
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023521000A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022239711A1 (https=
JP7683684B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/019612 external-priority patent/WO2022239711A1/ja
Publication of JPWO2022239711A1 publication Critical patent/JPWO2022239711A1/ja
Publication of JPWO2022239711A5 publication Critical patent/JPWO2022239711A5/ja
Application granted granted Critical
Publication of JP7683684B2 publication Critical patent/JP7683684B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2023521000A 2021-05-10 2022-05-09 半導体装置及びモジュール Active JP7683684B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079845 2021-05-10
JP2021079845 2021-05-10
PCT/JP2022/019612 WO2022239711A1 (ja) 2021-05-10 2022-05-09 半導体装置及びモジュール

Publications (3)

Publication Number Publication Date
JPWO2022239711A1 JPWO2022239711A1 (https=) 2022-11-17
JPWO2022239711A5 true JPWO2022239711A5 (https=) 2024-02-13
JP7683684B2 JP7683684B2 (ja) 2025-05-27

Family

ID=84029605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521000A Active JP7683684B2 (ja) 2021-05-10 2022-05-09 半導体装置及びモジュール

Country Status (4)

Country Link
US (1) US12431290B2 (https=)
JP (1) JP7683684B2 (https=)
CN (1) CN117242537A (https=)
WO (1) WO2022239711A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157146A (ja) * 1982-03-12 1983-09-19 Fujitsu Ltd 半導体装置
JP3298174B2 (ja) * 1992-09-14 2002-07-02 富士通株式会社 半導体装置およびその製造方法
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
JP2002208657A (ja) 2001-11-28 2002-07-26 Fujitsu Ltd 半導体装置及び半導体装置実装用基板
US7161793B2 (en) * 2002-11-14 2007-01-09 Fujitsu Limited Layer capacitor element and production process as well as electronic device
JP2006210852A (ja) * 2005-01-31 2006-08-10 Toshiba Corp 表面実装型回路部品を実装する回路基板及びその製造方法
WO2006117912A1 (ja) * 2005-04-27 2006-11-09 Murata Manufacturing Co., Ltd 薄膜キャパシタおよびその製造方法
JP5017930B2 (ja) 2006-06-01 2012-09-05 富士通株式会社 半導体装置、はんだバンプ接続用基板の製造方法及び半導体装置の製造方法
US8470680B2 (en) * 2008-07-28 2013-06-25 Kemet Electronics Corporation Substrate with embedded patterned capacitance
US20110317373A1 (en) * 2010-06-23 2011-12-29 Mcdermid William James Method and Apparatus for Interconnecting Circuit Boards
JP5445357B2 (ja) 2010-06-30 2014-03-19 Ｔｄｋ株式会社 電子部品及び電子デバイス
JP2012015299A (ja) 2010-06-30 2012-01-19 Tdk Corp 電子部品及び電子デバイス
JP5505171B2 (ja) * 2010-07-30 2014-05-28 富士通株式会社 回路基板ユニット、回路基板ユニットの製造方法、及び電子装置
JP2017220576A (ja) 2016-06-08 2017-12-14 三菱電機株式会社 半導体装置

Similar Documents

Publication Publication Date Title
KR102154039B1 (ko) 접속 조인트부의 크랙이 억제된 칩 내장형 패키지
KR900005576A (ko) 반도체 집적회로 장치
JP2006128455A5 (https=)
KR100910231B1 (ko) 웨이퍼 레벨 반도체 패키지 및 이의 제조 방법
JP2017135290A5 (https=)
JPWO2021111604A5 (https=)
JPWO2023106055A5 (https=)
JPWO2022239711A5 (https=)
JP2002093949A5 (https=)
TWI493668B (zh) 接墊結構、線路載板及積體電路晶片
JPS6011809B2 (ja) 混成集積回路
JP4083142B2 (ja) 半導体装置
TW200843077A (en) Package structure of memory
JP2006196874A5 (https=)
TW201822327A (zh) 薄膜覆晶封裝結構
JPWO2022239718A5 (https=)
JP3829562B2 (ja) マルチチップ、マルチチップパッケージ、半導体装置および電子機器
JP2002093918A5 (https=)
JP4305674B2 (ja) 半導体装置
KR20090105570A (ko) 적층 반도체 패키지
JP5069387B2 (ja) 集積回路パッケージ
JP2009038279A5 (https=)
KR20100086851A (ko) 반도체 패키지
JPWO2023195174A5 (https=)
JPWO2024029628A5 (https=)