JP7683684B2 - 半導体装置及びモジュール - Google Patents

半導体装置及びモジュール Download PDF

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Publication number
JP7683684B2
JP7683684B2 JP2023521000A JP2023521000A JP7683684B2 JP 7683684 B2 JP7683684 B2 JP 7683684B2 JP 2023521000 A JP2023521000 A JP 2023521000A JP 2023521000 A JP2023521000 A JP 2023521000A JP 7683684 B2 JP7683684 B2 JP 7683684B2
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Japan
Prior art keywords
substrate
layer
resin body
external electrode
electrode
Prior art date
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Active
Application number
JP2023521000A
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English (en)
Japanese (ja)
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JPWO2022239711A1 (https=
JPWO2022239711A5 (https=
Inventor
是清 伊藤
真臣 原田
勇太 今村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Publication date
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Publication of JPWO2022239711A5 publication Critical patent/JPWO2022239711A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2023521000A 2021-05-10 2022-05-09 半導体装置及びモジュール Active JP7683684B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021079845 2021-05-10
JP2021079845 2021-05-10
PCT/JP2022/019612 WO2022239711A1 (ja) 2021-05-10 2022-05-09 半導体装置及びモジュール

Publications (3)

Publication Number Publication Date
JPWO2022239711A1 JPWO2022239711A1 (https=) 2022-11-17
JPWO2022239711A5 JPWO2022239711A5 (https=) 2024-02-13
JP7683684B2 true JP7683684B2 (ja) 2025-05-27

Family

ID=84029605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521000A Active JP7683684B2 (ja) 2021-05-10 2022-05-09 半導体装置及びモジュール

Country Status (4)

Country Link
US (1) US12431290B2 (https=)
JP (1) JP7683684B2 (https=)
CN (1) CN117242537A (https=)
WO (1) WO2022239711A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208657A (ja) 2001-11-28 2002-07-26 Fujitsu Ltd 半導体装置及び半導体装置実装用基板
JP2007324418A (ja) 2006-06-01 2007-12-13 Fujitsu Ltd 半導体装置、はんだバンプ接続用基板の製造方法及び半導体装置の製造方法
JP2012015299A (ja) 2010-06-30 2012-01-19 Tdk Corp 電子部品及び電子デバイス
JP2012015333A (ja) 2010-06-30 2012-01-19 Tdk Corp 電子部品及び電子デバイス
JP2017220576A (ja) 2016-06-08 2017-12-14 三菱電機株式会社 半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157146A (ja) * 1982-03-12 1983-09-19 Fujitsu Ltd 半導体装置
JP3298174B2 (ja) * 1992-09-14 2002-07-02 富士通株式会社 半導体装置およびその製造方法
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
US7161793B2 (en) * 2002-11-14 2007-01-09 Fujitsu Limited Layer capacitor element and production process as well as electronic device
JP2006210852A (ja) * 2005-01-31 2006-08-10 Toshiba Corp 表面実装型回路部品を実装する回路基板及びその製造方法
WO2006117912A1 (ja) * 2005-04-27 2006-11-09 Murata Manufacturing Co., Ltd 薄膜キャパシタおよびその製造方法
US8470680B2 (en) * 2008-07-28 2013-06-25 Kemet Electronics Corporation Substrate with embedded patterned capacitance
US20110317373A1 (en) * 2010-06-23 2011-12-29 Mcdermid William James Method and Apparatus for Interconnecting Circuit Boards
JP5505171B2 (ja) * 2010-07-30 2014-05-28 富士通株式会社 回路基板ユニット、回路基板ユニットの製造方法、及び電子装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002208657A (ja) 2001-11-28 2002-07-26 Fujitsu Ltd 半導体装置及び半導体装置実装用基板
JP2007324418A (ja) 2006-06-01 2007-12-13 Fujitsu Ltd 半導体装置、はんだバンプ接続用基板の製造方法及び半導体装置の製造方法
JP2012015299A (ja) 2010-06-30 2012-01-19 Tdk Corp 電子部品及び電子デバイス
JP2012015333A (ja) 2010-06-30 2012-01-19 Tdk Corp 電子部品及び電子デバイス
JP2017220576A (ja) 2016-06-08 2017-12-14 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPWO2022239711A1 (https=) 2022-11-17
WO2022239711A1 (ja) 2022-11-17
US12431290B2 (en) 2025-09-30
CN117242537A (zh) 2023-12-15
US20240071687A1 (en) 2024-02-29

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