CN117242537A - 半导体装置以及模块 - Google Patents

半导体装置以及模块 Download PDF

Info

Publication number
CN117242537A
CN117242537A CN202280032222.4A CN202280032222A CN117242537A CN 117242537 A CN117242537 A CN 117242537A CN 202280032222 A CN202280032222 A CN 202280032222A CN 117242537 A CN117242537 A CN 117242537A
Authority
CN
China
Prior art keywords
layer
substrate
resin body
external electrode
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280032222.4A
Other languages
English (en)
Chinese (zh)
Inventor
伊藤是清
原田真臣
今村勇太
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN117242537A publication Critical patent/CN117242537A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/224—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10977—Encapsulated connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Semiconductor Integrated Circuits (AREA)
CN202280032222.4A 2021-05-10 2022-05-09 半导体装置以及模块 Pending CN117242537A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-079845 2021-05-10
JP2021079845 2021-05-10
PCT/JP2022/019612 WO2022239711A1 (ja) 2021-05-10 2022-05-09 半導体装置及びモジュール

Publications (1)

Publication Number Publication Date
CN117242537A true CN117242537A (zh) 2023-12-15

Family

ID=84029605

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280032222.4A Pending CN117242537A (zh) 2021-05-10 2022-05-09 半导体装置以及模块

Country Status (4)

Country Link
US (1) US12431290B2 (https=)
JP (1) JP7683684B2 (https=)
CN (1) CN117242537A (https=)
WO (1) WO2022239711A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58157146A (ja) * 1982-03-12 1983-09-19 Fujitsu Ltd 半導体装置
JP3298174B2 (ja) * 1992-09-14 2002-07-02 富士通株式会社 半導体装置およびその製造方法
JP3063839B2 (ja) * 1997-11-18 2000-07-12 日本電気株式会社 実装部品の実装構造および実装方法
JP2002208657A (ja) 2001-11-28 2002-07-26 Fujitsu Ltd 半導体装置及び半導体装置実装用基板
US7161793B2 (en) * 2002-11-14 2007-01-09 Fujitsu Limited Layer capacitor element and production process as well as electronic device
JP2006210852A (ja) * 2005-01-31 2006-08-10 Toshiba Corp 表面実装型回路部品を実装する回路基板及びその製造方法
WO2006117912A1 (ja) * 2005-04-27 2006-11-09 Murata Manufacturing Co., Ltd 薄膜キャパシタおよびその製造方法
JP5017930B2 (ja) 2006-06-01 2012-09-05 富士通株式会社 半導体装置、はんだバンプ接続用基板の製造方法及び半導体装置の製造方法
US8470680B2 (en) * 2008-07-28 2013-06-25 Kemet Electronics Corporation Substrate with embedded patterned capacitance
US20110317373A1 (en) * 2010-06-23 2011-12-29 Mcdermid William James Method and Apparatus for Interconnecting Circuit Boards
JP5445357B2 (ja) 2010-06-30 2014-03-19 Ｔｄｋ株式会社 電子部品及び電子デバイス
JP2012015299A (ja) 2010-06-30 2012-01-19 Tdk Corp 電子部品及び電子デバイス
JP5505171B2 (ja) * 2010-07-30 2014-05-28 富士通株式会社 回路基板ユニット、回路基板ユニットの製造方法、及び電子装置
JP2017220576A (ja) 2016-06-08 2017-12-14 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPWO2022239711A1 (https=) 2022-11-17
WO2022239711A1 (ja) 2022-11-17
US12431290B2 (en) 2025-09-30
JP7683684B2 (ja) 2025-05-27
US20240071687A1 (en) 2024-02-29

Similar Documents

Publication Publication Date Title
KR100906065B1 (ko) 반도체칩, 이의 제조 방법 및 이를 가지는 적층 패키지
US12464740B2 (en) Semiconductor device and module
US7898792B2 (en) Thin-film capacitor
US8416578B2 (en) Manufacturing method for an electronic substrate
TWI398903B (zh) 線路元件製程及其結構
US8410577B2 (en) Semiconductor device
US7723837B2 (en) Semiconductor device
KR100879191B1 (ko) 반도체 패키지 및 그 제조 방법
JP7363928B2 (ja) 半導体装置及び容量装置
US20110011630A1 (en) Semiconductor device and method of manufacturing the same
US20190206627A1 (en) Electronic component
CN117242537A (zh) 半导体装置以及模块
US20240063252A1 (en) Semiconductor device and module
JP7647880B2 (ja) 半導体装置
US7544598B2 (en) Semiconductor device and method of manufacturing the same
US20220181277A1 (en) Semiconductor device package
KR102068809B1 (ko) 박막 커패시터 및 박막 커패시터의 제조방법
US12431858B2 (en) Electronic structure and method of manufacturing the same
JP2026012046A (ja) 半導体パッケージ
CN118524776A (zh) 半导体装置及半导体模块
JP2009277879A (ja) 半導体装置
JP2006344850A (ja) 電子部品

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination