CN120457539A - 半导体装置 - Google Patents

半导体装置

Info

Publication number
CN120457539A
CN120457539A CN202280101341.0A CN202280101341A CN120457539A CN 120457539 A CN120457539 A CN 120457539A CN 202280101341 A CN202280101341 A CN 202280101341A CN 120457539 A CN120457539 A CN 120457539A
Authority
CN
China
Prior art keywords
semiconductor device
semiconductor
substrate
semiconductor chip
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280101341.0A
Other languages
English (en)
Chinese (zh)
Inventor
日坂隆行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of CN120457539A publication Critical patent/CN120457539A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Pressure Sensors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
CN202280101341.0A 2022-12-27 2022-12-27 半导体装置 Pending CN120457539A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/048098 WO2024142212A1 (ja) 2022-12-27 2022-12-27 半導体装置

Publications (1)

Publication Number Publication Date
CN120457539A true CN120457539A (zh) 2025-08-08

Family

ID=87563009

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280101341.0A Pending CN120457539A (zh) 2022-12-27 2022-12-27 半导体装置

Country Status (5)

Country Link
US (1) US20260082989A1 (https=)
JP (1) JP7327715B1 (https=)
CN (1) CN120457539A (https=)
TW (2) TW202531518A (https=)
WO (1) WO2024142212A1 (https=)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04256346A (ja) * 1991-02-08 1992-09-11 Fujitsu Ltd 浸漬冷却用電子部品構造
TWI236116B (en) * 2004-11-04 2005-07-11 Advanced Semiconductor Eng High heat dissipation flip chip package structure
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
EP2172970A4 (en) * 2007-07-19 2012-04-04 Fujikura Ltd SEMICONDUCTOR HOUSING AND METHOD FOR MANUFACTURING THE SAME
JP2009253206A (ja) * 2008-04-10 2009-10-29 Sharp Corp 樹脂封止型半導体装置およびその実装構造
CN105378912B (zh) * 2014-06-09 2018-12-28 三菱电机株式会社 半导体封装件的制造方法以及半导体封装件
US9761540B2 (en) * 2015-06-24 2017-09-12 Micron Technology, Inc. Wafer level package and fabrication method thereof
DE102015223399B4 (de) * 2015-11-26 2018-11-08 Robert Bosch Gmbh Verfahren zum Verpacken mindestens eines Halbleiterbauteils und Halbleitervorrichtung
TWI848937B (zh) * 2018-07-24 2024-07-21 日商拓自達電線股份有限公司 屏蔽封裝體及屏蔽封裝體之製造方法
KR102711765B1 (ko) * 2019-03-06 2024-09-27 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US11538731B2 (en) * 2019-03-28 2022-12-27 Intel Corporation Thermal solutions for package on package (PoP) architectures

Also Published As

Publication number Publication date
TW202441721A (zh) 2024-10-16
JP7327715B1 (ja) 2023-08-16
US20260082989A1 (en) 2026-03-19
JPWO2024142212A1 (https=) 2024-07-04
WO2024142212A1 (ja) 2024-07-04
TW202531518A (zh) 2025-08-01
TWI897117B (zh) 2025-09-11

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