JPWO2024142212A1 - - Google Patents
Info
- Publication number
- JPWO2024142212A1 JPWO2024142212A1 JP2023529936A JP2023529936A JPWO2024142212A1 JP WO2024142212 A1 JPWO2024142212 A1 JP WO2024142212A1 JP 2023529936 A JP2023529936 A JP 2023529936A JP 2023529936 A JP2023529936 A JP 2023529936A JP WO2024142212 A1 JPWO2024142212 A1 JP WO2024142212A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/15—Containers comprising an insulating or insulated base
- H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
- H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
- H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2022/048098 WO2024142212A1 (ja) | 2022-12-27 | 2022-12-27 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7327715B1 JP7327715B1 (ja) | 2023-08-16 |
| JPWO2024142212A1 true JPWO2024142212A1 (https=) | 2024-07-04 |
| JPWO2024142212A5 JPWO2024142212A5 (https=) | 2024-11-26 |
Family
ID=87563009
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023529936A Active JP7327715B1 (ja) | 2022-12-27 | 2022-12-27 | 半導体装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20260082989A1 (https=) |
| JP (1) | JP7327715B1 (https=) |
| CN (1) | CN120457539A (https=) |
| TW (2) | TW202531518A (https=) |
| WO (1) | WO2024142212A1 (https=) |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04256346A (ja) * | 1991-02-08 | 1992-09-11 | Fujitsu Ltd | 浸漬冷却用電子部品構造 |
| TWI236116B (en) * | 2004-11-04 | 2005-07-11 | Advanced Semiconductor Eng | High heat dissipation flip chip package structure |
| US7607355B2 (en) * | 2007-02-16 | 2009-10-27 | Yamaha Corporation | Semiconductor device |
| EP2172970A4 (en) * | 2007-07-19 | 2012-04-04 | Fujikura Ltd | SEMICONDUCTOR HOUSING AND METHOD FOR MANUFACTURING THE SAME |
| JP2009253206A (ja) * | 2008-04-10 | 2009-10-29 | Sharp Corp | 樹脂封止型半導体装置およびその実装構造 |
| CN105378912B (zh) * | 2014-06-09 | 2018-12-28 | 三菱电机株式会社 | 半导体封装件的制造方法以及半导体封装件 |
| US9761540B2 (en) * | 2015-06-24 | 2017-09-12 | Micron Technology, Inc. | Wafer level package and fabrication method thereof |
| DE102015223399B4 (de) * | 2015-11-26 | 2018-11-08 | Robert Bosch Gmbh | Verfahren zum Verpacken mindestens eines Halbleiterbauteils und Halbleitervorrichtung |
| TWI848937B (zh) * | 2018-07-24 | 2024-07-21 | 日商拓自達電線股份有限公司 | 屏蔽封裝體及屏蔽封裝體之製造方法 |
| KR102711765B1 (ko) * | 2019-03-06 | 2024-09-27 | 삼성전기주식회사 | 전자 소자 모듈 및 그 제조 방법 |
| US11538731B2 (en) * | 2019-03-28 | 2022-12-27 | Intel Corporation | Thermal solutions for package on package (PoP) architectures |
-
2022
- 2022-12-27 JP JP2023529936A patent/JP7327715B1/ja active Active
- 2022-12-27 WO PCT/JP2022/048098 patent/WO2024142212A1/ja not_active Ceased
- 2022-12-27 US US19/108,684 patent/US20260082989A1/en active Pending
- 2022-12-27 CN CN202280101341.0A patent/CN120457539A/zh active Pending
-
2023
- 2023-11-29 TW TW114113511A patent/TW202531518A/zh unknown
- 2023-11-29 TW TW112146287A patent/TWI897117B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| TW202441721A (zh) | 2024-10-16 |
| JP7327715B1 (ja) | 2023-08-16 |
| US20260082989A1 (en) | 2026-03-19 |
| WO2024142212A1 (ja) | 2024-07-04 |
| TW202531518A (zh) | 2025-08-01 |
| TWI897117B (zh) | 2025-09-11 |
| CN120457539A (zh) | 2025-08-08 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20230517 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20230517 |
|
| A871 | Explanation of circumstances concerning accelerated examination |
Free format text: JAPANESE INTERMEDIATE CODE: A871 Effective date: 20230517 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20230704 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20230717 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 7327715 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |