JP7327715B1 - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP7327715B1
JP7327715B1 JP2023529936A JP2023529936A JP7327715B1 JP 7327715 B1 JP7327715 B1 JP 7327715B1 JP 2023529936 A JP2023529936 A JP 2023529936A JP 2023529936 A JP2023529936 A JP 2023529936A JP 7327715 B1 JP7327715 B1 JP 7327715B1
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JP
Japan
Prior art keywords
semiconductor
semiconductor device
semiconductor chip
substrate
side wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023529936A
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English (en)
Japanese (ja)
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JPWO2024142212A5 (https=
JPWO2024142212A1 (https=
Inventor
隆行 日坂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Application granted granted Critical
Publication of JP7327715B1 publication Critical patent/JP7327715B1/ja
Publication of JPWO2024142212A1 publication Critical patent/JPWO2024142212A1/ja
Publication of JPWO2024142212A5 publication Critical patent/JPWO2024142212A5/ja
Active legal-status Critical Current
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/157—Containers comprising an insulating or insulated base having interconnections parallel to the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Pressure Sensors (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2023529936A 2022-12-27 2022-12-27 半導体装置 Active JP7327715B1 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2022/048098 WO2024142212A1 (ja) 2022-12-27 2022-12-27 半導体装置

Publications (3)

Publication Number Publication Date
JP7327715B1 true JP7327715B1 (ja) 2023-08-16
JPWO2024142212A1 JPWO2024142212A1 (https=) 2024-07-04
JPWO2024142212A5 JPWO2024142212A5 (https=) 2024-11-26

Family

ID=87563009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023529936A Active JP7327715B1 (ja) 2022-12-27 2022-12-27 半導体装置

Country Status (5)

Country Link
US (1) US20260082989A1 (https=)
JP (1) JP7327715B1 (https=)
CN (1) CN120457539A (https=)
TW (2) TW202531518A (https=)
WO (1) WO2024142212A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04256346A (ja) * 1991-02-08 1992-09-11 Fujitsu Ltd 浸漬冷却用電子部品構造
JP2008227482A (ja) * 2007-02-16 2008-09-25 Yamaha Corp 半導体装置
WO2009011140A1 (ja) * 2007-07-19 2009-01-22 Fujikura Ltd. 半導体パッケージとその製造方法
JP2009253206A (ja) * 2008-04-10 2009-10-29 Sharp Corp 樹脂封止型半導体装置およびその実装構造

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI236116B (en) * 2004-11-04 2005-07-11 Advanced Semiconductor Eng High heat dissipation flip chip package structure
CN105378912B (zh) * 2014-06-09 2018-12-28 三菱电机株式会社 半导体封装件的制造方法以及半导体封装件
US9761540B2 (en) * 2015-06-24 2017-09-12 Micron Technology, Inc. Wafer level package and fabrication method thereof
DE102015223399B4 (de) * 2015-11-26 2018-11-08 Robert Bosch Gmbh Verfahren zum Verpacken mindestens eines Halbleiterbauteils und Halbleitervorrichtung
TWI848937B (zh) * 2018-07-24 2024-07-21 日商拓自達電線股份有限公司 屏蔽封裝體及屏蔽封裝體之製造方法
KR102711765B1 (ko) * 2019-03-06 2024-09-27 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US11538731B2 (en) * 2019-03-28 2022-12-27 Intel Corporation Thermal solutions for package on package (PoP) architectures

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04256346A (ja) * 1991-02-08 1992-09-11 Fujitsu Ltd 浸漬冷却用電子部品構造
JP2008227482A (ja) * 2007-02-16 2008-09-25 Yamaha Corp 半導体装置
WO2009011140A1 (ja) * 2007-07-19 2009-01-22 Fujikura Ltd. 半導体パッケージとその製造方法
JP2009253206A (ja) * 2008-04-10 2009-10-29 Sharp Corp 樹脂封止型半導体装置およびその実装構造

Also Published As

Publication number Publication date
TW202441721A (zh) 2024-10-16
US20260082989A1 (en) 2026-03-19
JPWO2024142212A1 (https=) 2024-07-04
WO2024142212A1 (ja) 2024-07-04
TW202531518A (zh) 2025-08-01
TWI897117B (zh) 2025-09-11
CN120457539A (zh) 2025-08-08

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