JPWO2024116924A5 - - Google Patents

Info

Publication number
JPWO2024116924A5
JPWO2024116924A5 JP2024561383A JP2024561383A JPWO2024116924A5 JP WO2024116924 A5 JPWO2024116924 A5 JP WO2024116924A5 JP 2024561383 A JP2024561383 A JP 2024561383A JP 2024561383 A JP2024561383 A JP 2024561383A JP WO2024116924 A5 JPWO2024116924 A5 JP WO2024116924A5
Authority
JP
Japan
Prior art keywords
conductive member
semiconductor device
die pad
main surface
thickness direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024561383A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024116924A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/041573 external-priority patent/WO2024116924A1/ja
Publication of JPWO2024116924A1 publication Critical patent/JPWO2024116924A1/ja
Publication of JPWO2024116924A5 publication Critical patent/JPWO2024116924A5/ja
Pending legal-status Critical Current

Links

JP2024561383A 2022-12-02 2023-11-20 Pending JPWO2024116924A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022193473 2022-12-02
PCT/JP2023/041573 WO2024116924A1 (ja) 2022-12-02 2023-11-20 半導体装置、および、半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024116924A1 JPWO2024116924A1 (https=) 2024-06-06
JPWO2024116924A5 true JPWO2024116924A5 (https=) 2025-08-08

Family

ID=91323694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024561383A Pending JPWO2024116924A1 (https=) 2022-12-02 2023-11-20

Country Status (2)

Country Link
JP (1) JPWO2024116924A1 (https=)
WO (1) WO2024116924A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4426955B2 (ja) * 2004-11-30 2010-03-03 株式会社ルネサステクノロジ 半導体装置
JP2017050441A (ja) * 2015-09-03 2017-03-09 ローム株式会社 半導体装置
US11211312B2 (en) * 2017-11-20 2021-12-28 Rohm Co., Ltd. Semiconductor device
JP2021190505A (ja) * 2020-05-27 2021-12-13 ローム株式会社 半導体装置

Similar Documents

Publication Publication Date Title
JP6305302B2 (ja) 半導体装置およびその製造方法
US10264677B2 (en) Electronic component and manufacturing method therefor
JPS6333320B2 (https=)
JP2003258166A (ja) 半導体装置
CN110620045A (zh) 用于半导体器件的引线框架组件
JPWO2021193823A5 (https=)
JP2022181822A5 (https=)
CN110634812A (zh) 具有夹互连和双侧冷却的半导体器件封装
JP2021002644A5 (https=)
JPWO2024116924A5 (https=)
JPWO2023112662A5 (https=)
JPWO2023100659A5 (https=)
JP4631205B2 (ja) 半導体装置及びその製造方法
JPWO2023047881A5 (https=)
TWI243437B (en) Sliding type thin fingerprint sensor package
JPWO2024018790A5 (https=)
JPWO2024029336A5 (https=)
JPWO2024116933A5 (https=)
JP4049167B2 (ja) 蓋体フレーム、半導体装置、及びその製造方法
JP2019102467A (ja) 半導体装置
JPWO2023100733A5 (https=)
JPWO2024252845A5 (https=)
JP4609478B2 (ja) 蓋体フレーム及びその製造方法
US20250285944A1 (en) Semiconductor device and method for manufacturing semiconductor device
JPWO2022259825A5 (https=)