JPWO2024252845A5 - - Google Patents

Info

Publication number
JPWO2024252845A5
JPWO2024252845A5 JP2025526000A JP2025526000A JPWO2024252845A5 JP WO2024252845 A5 JPWO2024252845 A5 JP WO2024252845A5 JP 2025526000 A JP2025526000 A JP 2025526000A JP 2025526000 A JP2025526000 A JP 2025526000A JP WO2024252845 A5 JPWO2024252845 A5 JP WO2024252845A5
Authority
JP
Japan
Prior art keywords
electrode
thickness direction
conductive member
conductive
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025526000A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024252845A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/017398 external-priority patent/WO2024252845A1/ja
Publication of JPWO2024252845A1 publication Critical patent/JPWO2024252845A1/ja
Publication of JPWO2024252845A5 publication Critical patent/JPWO2024252845A5/ja
Pending legal-status Critical Current

Links

JP2025526000A 2023-06-08 2024-05-10 Pending JPWO2024252845A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023094659 2023-06-08
PCT/JP2024/017398 WO2024252845A1 (ja) 2023-06-08 2024-05-10 半導体装置、および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024252845A1 JPWO2024252845A1 (https=) 2024-12-12
JPWO2024252845A5 true JPWO2024252845A5 (https=) 2026-03-10

Family

ID=93795292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025526000A Pending JPWO2024252845A1 (https=) 2023-06-08 2024-05-10

Country Status (3)

Country Link
US (1) US20260101798A1 (https=)
JP (1) JPWO2024252845A1 (https=)
WO (1) WO2024252845A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080036078A1 (en) * 2006-08-14 2008-02-14 Ciclon Semiconductor Device Corp. Wirebond-less semiconductor package
US8253225B2 (en) * 2008-02-22 2012-08-28 Infineon Technologies Ag Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof
US8373257B2 (en) * 2008-09-25 2013-02-12 Alpha & Omega Semiconductor Incorporated Top exposed clip with window array
CN110637366B (zh) * 2017-09-29 2022-12-06 日立金属株式会社 半导体器件及其制造方法

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