JPWO2024034398A5 - - Google Patents

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Publication number
JPWO2024034398A5
JPWO2024034398A5 JP2024540363A JP2024540363A JPWO2024034398A5 JP WO2024034398 A5 JPWO2024034398 A5 JP WO2024034398A5 JP 2024540363 A JP2024540363 A JP 2024540363A JP 2024540363 A JP2024540363 A JP 2024540363A JP WO2024034398 A5 JPWO2024034398 A5 JP WO2024034398A5
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JP
Japan
Prior art keywords
resin composition
composition according
mass
resin
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024540363A
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English (en)
Japanese (ja)
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JPWO2024034398A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/027332 external-priority patent/WO2024034398A1/ja
Publication of JPWO2024034398A1 publication Critical patent/JPWO2024034398A1/ja
Publication of JPWO2024034398A5 publication Critical patent/JPWO2024034398A5/ja
Pending legal-status Critical Current

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JP2024540363A 2022-08-09 2023-07-26 Pending JPWO2024034398A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022127086 2022-08-09
PCT/JP2023/027332 WO2024034398A1 (ja) 2022-08-09 2023-07-26 樹脂組成物、並びにこれを用いた硬化物、プリプレグ、プリント配線基板及び高周波向け電子部品

Publications (2)

Publication Number Publication Date
JPWO2024034398A1 JPWO2024034398A1 (https=) 2024-02-15
JPWO2024034398A5 true JPWO2024034398A5 (https=) 2025-05-16

Family

ID=89851576

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024540363A Pending JPWO2024034398A1 (https=) 2022-08-09 2023-07-26

Country Status (5)

Country Link
JP (1) JPWO2024034398A1 (https=)
KR (1) KR20250048688A (https=)
CN (1) CN119677789A (https=)
TW (1) TW202411282A (https=)
WO (1) WO2024034398A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008018483A1 (en) 2006-08-08 2008-02-14 Namics Corporation Thermosetting resin composition and unhardened film composed of the same
US11702507B2 (en) * 2019-03-28 2023-07-18 Shikoku Chemicals Corporation Resin composition and use thereof
TWI736897B (zh) * 2019-05-31 2021-08-21 台燿科技股份有限公司 樹脂組合物及其應用
TWI912346B (zh) * 2020-09-01 2026-01-21 日商Ｊｓｒ股份有限公司 預浸體、覆金屬積層板及印刷配線板
CN115916535A (zh) * 2020-09-01 2023-04-04 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
KR20240055726A (ko) * 2021-09-14 2024-04-29 나믹스 가부시끼가이샤 수지 조성물과, 이를 사용한 프린트 배선 기판, 경화물, 프리프레그, 및 고주파용 전자 부품
CN118103421A (zh) * 2021-11-19 2024-05-28 松下知识产权经营株式会社 树脂组合物、具有树脂的膜、具有树脂的金属箔、覆金属层压体和印刷线路板

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