CN119677789A - 树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件 - Google Patents

树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件 Download PDF

Info

Publication number
CN119677789A
CN119677789A CN202380058119.1A CN202380058119A CN119677789A CN 119677789 A CN119677789 A CN 119677789A CN 202380058119 A CN202380058119 A CN 202380058119A CN 119677789 A CN119677789 A CN 119677789A
Authority
CN
China
Prior art keywords
resin composition
component
mass
resin
composition according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202380058119.1A
Other languages
English (en)
Chinese (zh)
Inventor
吉田真树
黑川津与志
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Namics Corp
Original Assignee
Namics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Namics Corp filed Critical Namics Corp
Publication of CN119677789A publication Critical patent/CN119677789A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
CN202380058119.1A 2022-08-09 2023-07-26 树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件 Pending CN119677789A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022-127086 2022-08-09
JP2022127086 2022-08-09
PCT/JP2023/027332 WO2024034398A1 (ja) 2022-08-09 2023-07-26 樹脂組成物、並びにこれを用いた硬化物、プリプレグ、プリント配線基板及び高周波向け電子部品

Publications (1)

Publication Number Publication Date
CN119677789A true CN119677789A (zh) 2025-03-21

Family

ID=89851576

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202380058119.1A Pending CN119677789A (zh) 2022-08-09 2023-07-26 树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件

Country Status (5)

Country Link
JP (1) JPWO2024034398A1 (https=)
KR (1) KR20250048688A (https=)
CN (1) CN119677789A (https=)
TW (1) TW202411282A (https=)
WO (1) WO2024034398A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008018483A1 (en) 2006-08-08 2008-02-14 Namics Corporation Thermosetting resin composition and unhardened film composed of the same
US11702507B2 (en) * 2019-03-28 2023-07-18 Shikoku Chemicals Corporation Resin composition and use thereof
TWI736897B (zh) * 2019-05-31 2021-08-21 台燿科技股份有限公司 樹脂組合物及其應用
TWI912346B (zh) * 2020-09-01 2026-01-21 日商Ｊｓｒ股份有限公司 預浸體、覆金屬積層板及印刷配線板
CN115916535A (zh) * 2020-09-01 2023-04-04 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
KR20240055726A (ko) * 2021-09-14 2024-04-29 나믹스 가부시끼가이샤 수지 조성물과, 이를 사용한 프린트 배선 기판, 경화물, 프리프레그, 및 고주파용 전자 부품
CN118103421A (zh) * 2021-11-19 2024-05-28 松下知识产权经营株式会社 树脂组合物、具有树脂的膜、具有树脂的金属箔、覆金属层压体和印刷线路板

Also Published As

Publication number Publication date
KR20250048688A (ko) 2025-04-10
WO2024034398A1 (ja) 2024-02-15
JPWO2024034398A1 (https=) 2024-02-15
TW202411282A (zh) 2024-03-16

Similar Documents

Publication Publication Date Title
TWI570200B (zh) 熱硬化性接著劑組成物、熱硬化性接著薄膜及複合薄膜
CN109312156B (zh) 热固化性树脂组合物、预浸渍体、层叠板、印刷线路板和高速通信应对模块
TWI657108B (zh) 環氧樹脂組合物、預浸料、層壓板和印刷電路板
KR20210004954A (ko) 열경화성 조성물, 프리프레그, 금속박 피복 적층판, 수지 시트 및 프린트 배선판
CN110204862B (zh) 树脂组合物、预浸料、层压板、覆金属箔层压板以及印刷线路板
TWI809006B (zh) 熱硬化性樹脂組成物、絕緣性膜、層間絕緣性膜、多層配線板及半導體裝置
TWI906464B (zh) 樹脂組成物、預浸體、樹脂片、疊層板、覆金屬箔疊層板、以及印刷配線板
JP2024116204A (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂付き金属箔、積層体、プリント配線板及び半導体パッケージ
WO2023042578A1 (ja) 樹脂組成物、並びにこれを用いたプリント配線基板、硬化物、プリプレグ及び高周波向け電子部品
KR20220057549A (ko) 폴리올레핀계 접착제 조성물
CN100369964C (zh) 树脂组合物及使用该组合物的预成型料和层合板
TWI818994B (zh) 熱硬化性樹脂組成物、包含其之薄膜，以及使用該等之多層配線板
CN116003987A (zh) 一种树脂组合物及其制备方法和应用
CN119677789A (zh) 树脂组合物、以及使用其的固化物、预浸料、印刷布线基板和高频用电子部件
JP2021025016A (ja) 熱硬化性接着剤組成物および積層フィルム
KR100523913B1 (ko) 동박 부착 접착시트용 조성물 및 이를 이용한 동박 부착접착시트의 제조방법
JP5309788B2 (ja) エポキシ樹脂組成物、その硬化物、プリプレグ、銅張積層板、及びビルドアップ接着フィルム用樹脂組成物
JP2005209489A (ja) 絶縁シート
KR102657819B1 (ko) 열경화성 수지 조성물, 절연성 필름, 층간 절연성 필름, 다층 배선판, 및 반도체 장치
CN108025532B (zh) 带树脂的金属箔、以及使用其的覆金属层叠板和布线板
TWI921950B (zh) 硬化性樹脂組成物、硬化物、清漆、預浸漬物及電路基板
TWI917598B (zh) 樹脂組合物、片材硬化物、複合成形體及半導體裝置
JP3618290B2 (ja) 硬化性ポリビニルベンジルエーテル樹脂組成物
CN121610055A (zh) 树脂组合物、半固化片及其应用
CN117532991A (zh) 一种覆铜板及其制备方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination