CN109312156B - 热固化性树脂组合物、预浸渍体、层叠板、印刷线路板和高速通信应对模块 - Google Patents
热固化性树脂组合物、预浸渍体、层叠板、印刷线路板和高速通信应对模块 Download PDFInfo
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- C08L25/02—Homopolymers or copolymers of hydrocarbons
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- C08L25/06—Polystyrene
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Reinforced Plastic Materials (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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Abstract
Description
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2016110868 | 2016-06-02 | ||
JP2016-110868 | 2016-06-02 | ||
PCT/JP2017/020043 WO2017209108A1 (ja) | 2016-06-02 | 2017-05-30 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
Publications (2)
Publication Number | Publication Date |
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CN109312156A CN109312156A (zh) | 2019-02-05 |
CN109312156B true CN109312156B (zh) | 2022-02-22 |
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Application Number | Title | Priority Date | Filing Date |
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CN201780033444.7A Active CN109312156B (zh) | 2016-06-02 | 2017-05-30 | 热固化性树脂组合物、预浸渍体、层叠板、印刷线路板和高速通信应对模块 |
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US (1) | US10876000B2 (zh) |
EP (1) | EP3467038B1 (zh) |
JP (2) | JP6927206B2 (zh) |
KR (1) | KR102327243B1 (zh) |
CN (1) | CN109312156B (zh) |
TW (1) | TWI751169B (zh) |
WO (1) | WO2017209108A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20190015190A (ko) * | 2016-05-31 | 2019-02-13 | 미츠비시 가스 가가쿠 가부시키가이샤 | 수지 조성물, 적층체, 수지 조성물층이 부착된 반도체 웨이퍼, 수지 조성물층이 부착된 반도체 탑재용 기판 및 반도체 장치 |
JP7056201B2 (ja) * | 2018-02-14 | 2022-04-19 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
CN112105677B (zh) * | 2018-04-26 | 2023-03-28 | 琳得科株式会社 | 树脂组合物、树脂片及层叠体 |
EP3805293A4 (en) * | 2018-06-01 | 2022-03-16 | Mitsubishi Gas Chemical Company, Inc. | COMPOSITION OF RESIN, PREPREG, LAMINATE SHEET REINFORCED WITH METALLIC FOIL, RESIN SHEET AND PRINTED CIRCUIT BOARD |
JP7511163B2 (ja) * | 2019-07-17 | 2024-07-05 | パナソニックIpマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板 |
EP3896043A1 (en) * | 2020-04-17 | 2021-10-20 | Depco-Trh Pty Ltd | High opacity laminate surface |
KR20240031943A (ko) * | 2021-07-09 | 2024-03-08 | 도요보 엠씨 가부시키가이샤 | 접착제 조성물, 접착 시트, 전자파 실드재, 적층체 및 프린트 배선판 |
CN115806737B (zh) * | 2021-09-13 | 2024-05-14 | 中山台光电子材料有限公司 | 树脂组合物及其制品 |
WO2023085079A1 (ja) | 2021-11-10 | 2023-05-19 | 株式会社Nttドコモ | 端末及び通信方法 |
CN118240374A (zh) * | 2022-12-23 | 2024-06-25 | 广东生益科技股份有限公司 | 一种树脂组合物及其应用 |
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US3985928A (en) * | 1974-06-03 | 1976-10-12 | Sumitomo Bakelite Company, Limited | Heat-resistant laminating resin composition and method for using same |
CN1693352A (zh) * | 2001-09-18 | 2005-11-09 | Jsr株式会社 | 热塑性弹性体组合物及其制造方法 |
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JP7151834B2 (ja) | 2022-10-12 |
JP6927206B2 (ja) | 2021-08-25 |
CN109312156A (zh) | 2019-02-05 |
JPWO2017209108A1 (ja) | 2019-03-28 |
EP3467038A1 (en) | 2019-04-10 |
US10876000B2 (en) | 2020-12-29 |
US20190169432A1 (en) | 2019-06-06 |
TWI751169B (zh) | 2022-01-01 |
TW201821538A (zh) | 2018-06-16 |
JP2021183696A (ja) | 2021-12-02 |
EP3467038A4 (en) | 2020-03-11 |
EP3467038B1 (en) | 2023-09-06 |
KR20190013797A (ko) | 2019-02-11 |
KR102327243B1 (ko) | 2021-11-16 |
WO2017209108A1 (ja) | 2017-12-07 |
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