KR20250048688A - 수지 조성물과, 이를 사용한 경화물, 프리프레그, 프린트 배선 기판, 및 고주파용 전자 부품 - Google Patents

수지 조성물과, 이를 사용한 경화물, 프리프레그, 프린트 배선 기판, 및 고주파용 전자 부품 Download PDF

Info

Publication number
KR20250048688A
KR20250048688A KR1020257001768A KR20257001768A KR20250048688A KR 20250048688 A KR20250048688 A KR 20250048688A KR 1020257001768 A KR1020257001768 A KR 1020257001768A KR 20257001768 A KR20257001768 A KR 20257001768A KR 20250048688 A KR20250048688 A KR 20250048688A
Authority
KR
South Korea
Prior art keywords
resin composition
component
mass
resin
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020257001768A
Other languages
English (en)
Korean (ko)
Inventor
마사키 요시다
츠요시 구로카와
Original Assignee
나믹스 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 나믹스 가부시끼가이샤 filed Critical 나믹스 가부시끼가이샤
Publication of KR20250048688A publication Critical patent/KR20250048688A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C08F290/062—Polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06—Polymers provided for in subclass C08G
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020257001768A 2022-08-09 2023-07-26 수지 조성물과, 이를 사용한 경화물, 프리프레그, 프린트 배선 기판, 및 고주파용 전자 부품 Pending KR20250048688A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-127086 2022-08-09
JP2022127086 2022-08-09
PCT/JP2023/027332 WO2024034398A1 (ja) 2022-08-09 2023-07-26 樹脂組成物、並びにこれを用いた硬化物、プリプレグ、プリント配線基板及び高周波向け電子部品

Publications (1)

Publication Number Publication Date
KR20250048688A true KR20250048688A (ko) 2025-04-10

Family

ID=89851576

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020257001768A Pending KR20250048688A (ko) 2022-08-09 2023-07-26 수지 조성물과, 이를 사용한 경화물, 프리프레그, 프린트 배선 기판, 및 고주파용 전자 부품

Country Status (5)

Country Link
JP (1) JPWO2024034398A1 (https=)
KR (1) KR20250048688A (https=)
CN (1) CN119677789A (https=)
TW (1) TW202411282A (https=)
WO (1) WO2024034398A1 (https=)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008018483A1 (en) 2006-08-08 2008-02-14 Namics Corporation Thermosetting resin composition and unhardened film composed of the same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11702507B2 (en) * 2019-03-28 2023-07-18 Shikoku Chemicals Corporation Resin composition and use thereof
TWI736897B (zh) * 2019-05-31 2021-08-21 台燿科技股份有限公司 樹脂組合物及其應用
TWI912346B (zh) * 2020-09-01 2026-01-21 日商Ｊｓｒ股份有限公司 預浸體、覆金屬積層板及印刷配線板
CN115916535A (zh) * 2020-09-01 2023-04-04 松下知识产权经营株式会社 树脂组合物、和使用其的预浸料、带树脂的膜、带树脂的金属箔、覆金属箔层压板及布线板
KR20240055726A (ko) * 2021-09-14 2024-04-29 나믹스 가부시끼가이샤 수지 조성물과, 이를 사용한 프린트 배선 기판, 경화물, 프리프레그, 및 고주파용 전자 부품
CN118103421A (zh) * 2021-11-19 2024-05-28 松下知识产权经营株式会社 树脂组合物、具有树脂的膜、具有树脂的金属箔、覆金属层压体和印刷线路板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008018483A1 (en) 2006-08-08 2008-02-14 Namics Corporation Thermosetting resin composition and unhardened film composed of the same

Also Published As

Publication number Publication date
WO2024034398A1 (ja) 2024-02-15
JPWO2024034398A1 (https=) 2024-02-15
TW202411282A (zh) 2024-03-16
CN119677789A (zh) 2025-03-21

Similar Documents

Publication Publication Date Title
TWI572651B (zh) 樹脂組成物、預浸體及疊層板
TWI657108B (zh) 環氧樹脂組合物、預浸料、層壓板和印刷電路板
TW201400547A (zh) 低介電樹脂組成物及應用其之銅箔基板及印刷電路板
CN110204862B (zh) 树脂组合物、预浸料、层压板、覆金属箔层压板以及印刷线路板
EP3211035B1 (en) Epoxy resin composition as well as prepreg and laminated board using the same
TWI730608B (zh) 用於半導體封裝之熱固性樹脂組成物以及使用其之預浸材和金屬包層層合物
TW202028329A (zh) 樹脂組成物、包含其的預浸材、包含其的層疊板、包含其的樹脂覆蓋式金屬箔
KR102715224B1 (ko) 열경화성 수지 조성물, 절연성 필름, 층간 절연성 필름, 다층 배선판, 및 반도체 장치
US12398226B2 (en) Resin composition
JP2024116204A (ja) 熱硬化性樹脂組成物、プリプレグ、樹脂付き金属箔、積層体、プリント配線板及び半導体パッケージ
JP6848215B2 (ja) 熱硬化性樹脂組成物、プリプレグ、積層板及びプリント配線板
WO2023042578A1 (ja) 樹脂組成物、並びにこれを用いたプリント配線基板、硬化物、プリプレグ及び高周波向け電子部品
CN109535628B (zh) 一种阻燃型树脂预聚物及使用其制备的热固性树脂组合物、半固化片和层压板
JP6422230B2 (ja) プリント回路基板用絶縁樹脂組成物およびこれを用いた製品
JP2024011810A (ja) 熱硬化性樹脂組成物、熱硬化性樹脂組成物を用いたプリプレグ、及び熱硬化性樹脂組成物の硬化物を有する基板
KR20250048688A (ko) 수지 조성물과, 이를 사용한 경화물, 프리프레그, 프린트 배선 기판, 및 고주파용 전자 부품
TW202003690A (zh) 熱硬化性樹脂組成物、包含其之薄膜，以及使用該等之多層配線板
CN101845200A (zh) 无卤热固性树脂组合物及由其制得的预浸料和层压板
JP4639439B2 (ja) エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
JP2002105287A (ja) インターポーザ用エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
TWI435909B (zh) Epoxy resin composition and the application of its low dielectric constant insulation material
CN108025532B (zh) 带树脂的金属箔、以及使用其的覆金属层叠板和布线板
JP7807849B2 (ja) 樹脂組成物、並びに接着フィルム、積層基板、電子部品、及び半導体装置
JP4156180B2 (ja) エポキシ樹脂組成物、プリプレグ及びそれを用いた銅張積層板
TWI917598B (zh) 樹脂組合物、片材硬化物、複合成形體及半導體裝置

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20250117

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application