JPWO2023171733A5 - - Google Patents
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- Publication number
- JPWO2023171733A5 JPWO2023171733A5 JP2024506387A JP2024506387A JPWO2023171733A5 JP WO2023171733 A5 JPWO2023171733 A5 JP WO2023171733A5 JP 2024506387 A JP2024506387 A JP 2024506387A JP 2024506387 A JP2024506387 A JP 2024506387A JP WO2023171733 A5 JPWO2023171733 A5 JP WO2023171733A5
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- wafer
- forming
- protective film
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 34
- 238000004519 manufacturing process Methods 0.000 claims 33
- 230000001681 protective effect Effects 0.000 claims 19
- 238000000034 method Methods 0.000 claims 16
- 239000002904 solvent Substances 0.000 claims 13
- 230000008020 evaporation Effects 0.000 claims 5
- 238000001704 evaporation Methods 0.000 claims 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 claims 2
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052760 oxygen Inorganic materials 0.000 claims 2
- 239000001301 oxygen Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 238000004380 ashing Methods 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- -1 cinnamoyl group Chemical group 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- 238000011109 contamination Methods 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 claims 1
- 238000004528 spin coating Methods 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025031053A JP2025084878A (ja) | 2022-03-10 | 2025-02-28 | 半導体製造用ウエハ端部保護膜形成用組成物 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022037045 | 2022-03-10 | ||
| JP2022037045 | 2022-03-10 | ||
| PCT/JP2023/008951 WO2023171733A1 (ja) | 2022-03-10 | 2023-03-09 | 半導体製造用ウエハ端部保護膜形成用組成物 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025031053A Division JP2025084878A (ja) | 2022-03-10 | 2025-02-28 | 半導体製造用ウエハ端部保護膜形成用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023171733A1 JPWO2023171733A1 (https=) | 2023-09-14 |
| JPWO2023171733A5 true JPWO2023171733A5 (https=) | 2024-05-10 |
| JP7647996B2 JP7647996B2 (ja) | 2025-03-18 |
Family
ID=87935279
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024506387A Active JP7647996B2 (ja) | 2022-03-10 | 2023-03-09 | 半導体製造用ウエハ端部保護膜形成用組成物 |
| JP2025031053A Pending JP2025084878A (ja) | 2022-03-10 | 2025-02-28 | 半導体製造用ウエハ端部保護膜形成用組成物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025031053A Pending JP2025084878A (ja) | 2022-03-10 | 2025-02-28 | 半導体製造用ウエハ端部保護膜形成用組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250172869A1 (https=) |
| EP (1) | EP4492142A4 (https=) |
| JP (2) | JP7647996B2 (https=) |
| KR (1) | KR20240161651A (https=) |
| CN (1) | CN118843834A (https=) |
| TW (1) | TW202403444A (https=) |
| WO (1) | WO2023171733A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7752098B2 (ja) * | 2022-08-10 | 2025-10-09 | 信越化学工業株式会社 | ウェハエッジ保護膜形成方法、パターン形成方法、及びウェハエッジ保護膜形成用組成物 |
| WO2025134712A1 (ja) * | 2023-12-20 | 2025-06-26 | 日産化学株式会社 | 半導体製造用ウエハ端部保護膜形成用組成物 |
| WO2025150547A1 (ja) * | 2024-01-11 | 2025-07-17 | 日産化学株式会社 | 半導体製造用ウエハ端部保護膜形成用組成物 |
| WO2025150530A1 (ja) * | 2024-01-11 | 2025-07-17 | 日産化学株式会社 | 半導体製造用ウエハ端部保護膜形成用組成物 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009104643A1 (ja) | 2008-02-20 | 2009-08-27 | 日産化学工業株式会社 | 光硬化膜形成組成物及び光硬化膜形成方法 |
| JP2011228340A (ja) | 2010-04-15 | 2011-11-10 | Elpida Memory Inc | 半導体装置の製造方法 |
| US9176377B2 (en) | 2010-06-01 | 2015-11-03 | Inpria Corporation | Patterned inorganic layers, radiation based patterning compositions and corresponding methods |
| US8703386B2 (en) | 2012-02-27 | 2014-04-22 | International Business Machines Corporation | Metal peroxo compounds with organic co-ligands for electron beam, deep UV and extreme UV photoresist applications |
| JP5988438B2 (ja) * | 2012-08-02 | 2016-09-07 | 東京エレクトロン株式会社 | 塗布処理方法及び塗布処理装置 |
| US9310684B2 (en) | 2013-08-22 | 2016-04-12 | Inpria Corporation | Organometallic solution based high resolution patterning compositions |
| JP6295846B2 (ja) | 2014-06-17 | 2018-03-20 | 日産化学工業株式会社 | ガラス保護膜形成用組成物及びガラス保護膜 |
| KR102952227B1 (ko) | 2014-10-23 | 2026-04-13 | 인프리아 코포레이션 | 유기 금속 용액 기반의 고해상도 패터닝 조성물 및 상응하는 방법 |
| JP6436068B2 (ja) | 2015-11-19 | 2018-12-12 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| TWI743143B (zh) * | 2016-08-10 | 2021-10-21 | 日商Ｊｓｒ股份有限公司 | 半導體用抗蝕劑底層膜形成組成物、抗蝕劑底層膜、抗蝕劑底層膜的形成方法及圖案化基板的製造方法 |
| KR102610448B1 (ko) | 2016-08-12 | 2023-12-07 | 인프리아 코포레이션 | 금속 함유 레지스트로부터의 에지 비드 영역의 금속 잔류물 저감방법 |
| KR20240119168A (ko) | 2017-04-14 | 2024-08-06 | 닛산 가가쿠 가부시키가이샤 | 레지스트 하층막 형성 조성물 |
| JP6950662B2 (ja) * | 2018-10-30 | 2021-10-13 | 信越化学工業株式会社 | 基板保護膜形成用材料及びパターン形成方法 |
| US11605538B2 (en) * | 2018-10-31 | 2023-03-14 | Taiwan Semiconductor Manufacturing Co., Ltd. | Protective composition and method of forming photoresist pattern |
-
2023
- 2023-03-09 CN CN202380026004.4A patent/CN118843834A/zh active Pending
- 2023-03-09 EP EP23766909.8A patent/EP4492142A4/en not_active Withdrawn
- 2023-03-09 WO PCT/JP2023/008951 patent/WO2023171733A1/ja not_active Ceased
- 2023-03-09 JP JP2024506387A patent/JP7647996B2/ja active Active
- 2023-03-09 TW TW112108638A patent/TW202403444A/zh unknown
- 2023-03-09 KR KR1020247031092A patent/KR20240161651A/ko active Pending
- 2023-03-09 US US18/842,697 patent/US20250172869A1/en active Pending
-
2025
- 2025-02-28 JP JP2025031053A patent/JP2025084878A/ja active Pending
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