JPWO2023162968A5 - - Google Patents
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- Publication number
- JPWO2023162968A5 JPWO2023162968A5 JP2023567875A JP2023567875A JPWO2023162968A5 JP WO2023162968 A5 JPWO2023162968 A5 JP WO2023162968A5 JP 2023567875 A JP2023567875 A JP 2023567875A JP 2023567875 A JP2023567875 A JP 2023567875A JP WO2023162968 A5 JPWO2023162968 A5 JP WO2023162968A5
- Authority
- JP
- Japan
- Prior art keywords
- manufacturing
- wafer
- group
- semiconductor
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 35
- 238000004519 manufacturing process Methods 0.000 claims 34
- 238000000034 method Methods 0.000 claims 13
- 230000001681 protective effect Effects 0.000 claims 13
- 239000000178 monomer Substances 0.000 claims 10
- 125000004432 carbon atom Chemical group C* 0.000 claims 7
- 229920000642 polymer Polymers 0.000 claims 7
- 239000011342 resin composition Substances 0.000 claims 7
- 125000003118 aryl group Chemical group 0.000 claims 6
- 229910052799 carbon Inorganic materials 0.000 claims 6
- 239000000203 mixture Substances 0.000 claims 5
- 238000006243 chemical reaction Methods 0.000 claims 4
- 238000004132 cross linking Methods 0.000 claims 4
- 238000006356 dehydrogenation reaction Methods 0.000 claims 4
- 125000001931 aliphatic group Chemical group 0.000 claims 3
- 239000002904 solvent Substances 0.000 claims 3
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 claims 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 2
- -1 cinnamoyl group Chemical group 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 239000002243 precursor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- 125000002252 acyl group Chemical group 0.000 claims 1
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims 1
- 150000004056 anthraquinones Chemical class 0.000 claims 1
- RJGDLRCDCYRQOQ-UHFFFAOYSA-N anthrone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3CC2=C1 RJGDLRCDCYRQOQ-UHFFFAOYSA-N 0.000 claims 1
- 150000008425 anthrones Chemical class 0.000 claims 1
- 238000004380 ashing Methods 0.000 claims 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims 1
- 239000012965 benzophenone Substances 0.000 claims 1
- 125000002843 carboxylic acid group Chemical group 0.000 claims 1
- 238000004140 cleaning Methods 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000011109 contamination Methods 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
- 125000003700 epoxy group Chemical group 0.000 claims 1
- 238000005530 etching Methods 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 230000001678 irradiating effect Effects 0.000 claims 1
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims 1
- 239000003960 organic solvent Substances 0.000 claims 1
- 229910052760 oxygen Inorganic materials 0.000 claims 1
- 125000005372 silanol group Chemical group 0.000 claims 1
- 229910052717 sulfur Inorganic materials 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- 238000002834 transmittance Methods 0.000 claims 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022025403 | 2022-02-22 | ||
| JP2022025403 | 2022-02-22 | ||
| PCT/JP2023/006222 WO2023162968A1 (ja) | 2022-02-22 | 2023-02-21 | 自己架橋性ポリマーを含む光硬化性樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162968A1 JPWO2023162968A1 (https=) | 2023-08-31 |
| JPWO2023162968A5 true JPWO2023162968A5 (https=) | 2024-02-01 |
| JP7559977B2 JP7559977B2 (ja) | 2024-10-02 |
Family
ID=87765903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023567875A Active JP7559977B2 (ja) | 2022-02-22 | 2023-02-21 | 自己架橋性ポリマーを含む光硬化性樹脂組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US12339586B2 (https=) |
| EP (1) | EP4485077A4 (https=) |
| JP (1) | JP7559977B2 (https=) |
| KR (1) | KR102842411B1 (https=) |
| CN (1) | CN118742855A (https=) |
| TW (1) | TW202340268A (https=) |
| WO (1) | WO2023162968A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117157739A (zh) * | 2021-03-31 | 2023-12-01 | 日产化学株式会社 | 层叠体、剥离剂组合物以及经加工的半导体基板的制造方法 |
| JP7752098B2 (ja) * | 2022-08-10 | 2025-10-09 | 信越化学工業株式会社 | ウェハエッジ保護膜形成方法、パターン形成方法、及びウェハエッジ保護膜形成用組成物 |
| WO2026048760A1 (ja) * | 2024-08-30 | 2026-03-05 | 日産化学株式会社 | レジスト下層膜形成用組成物 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4348253B2 (ja) * | 2003-08-20 | 2009-10-21 | 富士フイルム株式会社 | 導電性パターン材料及び導電性パターンの形成方法 |
| KR101115089B1 (ko) * | 2005-03-02 | 2012-02-29 | 주식회사 동진쎄미켐 | 유기 반사방지막 형성용 유기 중합체 및 이를 포함하는 유기 조성물 |
| WO2009104643A1 (ja) | 2008-02-20 | 2009-08-27 | 日産化学工業株式会社 | 光硬化膜形成組成物及び光硬化膜形成方法 |
| JP5727688B2 (ja) | 2008-03-31 | 2015-06-03 | リンテック株式会社 | エネルギー線硬化型重合体、エネルギー線硬化型粘着剤組成物、粘着シートおよび半導体ウエハの加工方法 |
| JP2011228340A (ja) | 2010-04-15 | 2011-11-10 | Elpida Memory Inc | 半導体装置の製造方法 |
| JP6295846B2 (ja) | 2014-06-17 | 2018-03-20 | 日産化学工業株式会社 | ガラス保護膜形成用組成物及びガラス保護膜 |
| JP6436068B2 (ja) | 2015-11-19 | 2018-12-12 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP2018124354A (ja) * | 2017-01-30 | 2018-08-09 | Jsr株式会社 | レジスト膜形成方法及び保護膜形成用組成物 |
| KR20240119168A (ko) | 2017-04-14 | 2024-08-06 | 닛산 가가쿠 가부시키가이샤 | 레지스트 하층막 형성 조성물 |
| JP7302480B2 (ja) | 2017-12-22 | 2023-07-04 | 日産化学株式会社 | ジオール構造を有する保護膜形成組成物 |
| KR102247290B1 (ko) * | 2018-07-27 | 2021-04-30 | 주식회사 엘지화학 | 바인더 수지, 감광성 수지 조성물, 감광재, 컬러필터 및 디스플레이 장치 |
| CN114144488B (zh) | 2019-08-02 | 2025-04-04 | 日东电工株式会社 | 光交联性粘合剂及其利用 |
| US11626285B2 (en) | 2019-09-10 | 2023-04-11 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of manufacturing a semiconductor device |
| JP7752098B2 (ja) * | 2022-08-10 | 2025-10-09 | 信越化学工業株式会社 | ウェハエッジ保護膜形成方法、パターン形成方法、及びウェハエッジ保護膜形成用組成物 |
-
2023
- 2023-02-21 CN CN202380022676.8A patent/CN118742855A/zh active Pending
- 2023-02-21 WO PCT/JP2023/006222 patent/WO2023162968A1/ja not_active Ceased
- 2023-02-21 US US18/835,123 patent/US12339586B2/en active Active
- 2023-02-21 KR KR1020247022630A patent/KR102842411B1/ko active Active
- 2023-02-21 TW TW112106244A patent/TW202340268A/zh unknown
- 2023-02-21 JP JP2023567875A patent/JP7559977B2/ja active Active
- 2023-02-21 EP EP23759969.1A patent/EP4485077A4/en active Pending
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