JPWO2023157395A5 - - Google Patents

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Publication number
JPWO2023157395A5
JPWO2023157395A5 JP2024500953A JP2024500953A JPWO2023157395A5 JP WO2023157395 A5 JPWO2023157395 A5 JP WO2023157395A5 JP 2024500953 A JP2024500953 A JP 2024500953A JP 2024500953 A JP2024500953 A JP 2024500953A JP WO2023157395 A5 JPWO2023157395 A5 JP WO2023157395A5
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JP
Japan
Prior art keywords
electrode film
electrode
semiconductor device
region
film
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024500953A
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English (en)
Japanese (ja)
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JPWO2023157395A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/041528 external-priority patent/WO2023157395A1/ja
Publication of JPWO2023157395A1 publication Critical patent/JPWO2023157395A1/ja
Publication of JPWO2023157395A5 publication Critical patent/JPWO2023157395A5/ja
Pending legal-status Critical Current

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JP2024500953A 2022-02-18 2022-11-08 Pending JPWO2023157395A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022023925 2022-02-18
JP2022023926 2022-02-18
PCT/JP2022/041528 WO2023157395A1 (ja) 2022-02-18 2022-11-08 半導体装置およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023157395A1 JPWO2023157395A1 (https=) 2023-08-24
JPWO2023157395A5 true JPWO2023157395A5 (https=) 2024-10-23

Family

ID=87577925

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024500953A Pending JPWO2023157395A1 (https=) 2022-02-18 2022-11-08

Country Status (3)

Country Link
US (1) US20240405109A1 (https=)
JP (1) JPWO2023157395A1 (https=)
WO (1) WO2023157395A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024098458A (ja) * 2023-01-10 2024-07-23 富士電機株式会社 半導体装置
WO2026014345A1 (ja) * 2024-07-10 2026-01-15 ローム株式会社 半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3191407B2 (ja) * 1991-08-29 2001-07-23 ソニー株式会社 配線形成方法
JPH09260376A (ja) * 1996-03-18 1997-10-03 Toshiba Corp 半導体装置およびその製造方法
CN106663692B (zh) * 2015-02-03 2020-03-06 富士电机株式会社 半导体装置及其制造方法
CN109314139B (zh) * 2016-09-20 2022-04-15 富士电机株式会社 半导体装置和半导体装置的制造方法
JP7055056B2 (ja) * 2018-04-24 2022-04-15 三菱電機株式会社 半導体装置および半導体装置の製造方法
US11728333B2 (en) * 2018-05-30 2023-08-15 Rohm Co., Ltd. Semiconductor device
JP7250473B2 (ja) * 2018-10-18 2023-04-03 三菱電機株式会社 半導体装置
CN117352511A (zh) * 2018-10-18 2024-01-05 罗姆股份有限公司 半导体装置

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