JPWO2023145317A5 - - Google Patents

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Publication number
JPWO2023145317A5
JPWO2023145317A5 JP2023576700A JP2023576700A JPWO2023145317A5 JP WO2023145317 A5 JPWO2023145317 A5 JP WO2023145317A5 JP 2023576700 A JP2023576700 A JP 2023576700A JP 2023576700 A JP2023576700 A JP 2023576700A JP WO2023145317 A5 JPWO2023145317 A5 JP WO2023145317A5
Authority
JP
Japan
Prior art keywords
transistor
sub
chip
semiconductor module
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023576700A
Other languages
English (en)
Japanese (ja)
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JPWO2023145317A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/047073 external-priority patent/WO2023145317A1/ja
Publication of JPWO2023145317A1 publication Critical patent/JPWO2023145317A1/ja
Publication of JPWO2023145317A5 publication Critical patent/JPWO2023145317A5/ja
Pending legal-status Critical Current

Links

JP2023576700A 2022-01-28 2022-12-21 Pending JPWO2023145317A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022012102 2022-01-28
PCT/JP2022/047073 WO2023145317A1 (ja) 2022-01-28 2022-12-21 半導体モジュールおよび半導体ユニット

Publications (2)

Publication Number Publication Date
JPWO2023145317A1 JPWO2023145317A1 (https=) 2023-08-03
JPWO2023145317A5 true JPWO2023145317A5 (https=) 2024-10-07

Family

ID=87471620

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576700A Pending JPWO2023145317A1 (https=) 2022-01-28 2022-12-21

Country Status (5)

Country Link
US (1) US20240387513A1 (https=)
JP (1) JPWO2023145317A1 (https=)
CN (1) CN118591886A (https=)
DE (1) DE112022006552T5 (https=)
WO (1) WO2023145317A1 (https=)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11289045A (ja) * 1998-04-03 1999-10-19 Toyota Autom Loom Works Ltd 電圧駆動型半導体素子の保護回路、および過電圧保護機能を備えた電圧駆動型半導体回路
US7915645B2 (en) * 2009-05-28 2011-03-29 International Rectifier Corporation Monolithic vertically integrated composite group III-V and group IV semiconductor device and method for fabricating same
JP2011204877A (ja) * 2010-03-25 2011-10-13 Panasonic Corp 電界効果トランジスタ及びその評価方法
WO2014034895A1 (ja) * 2012-08-30 2014-03-06 富士電機株式会社 イグナイタ、イグナイタの制御方法および内燃機関用点火装置
US9882553B2 (en) * 2015-12-18 2018-01-30 Taiwan Semiconductor Manufacturing Company Ltd. Semiconductor device and circuit protecting method
JP6827776B2 (ja) 2016-11-15 2021-02-10 ローム株式会社 半導体デバイス
JP7368054B2 (ja) * 2019-05-16 2023-10-24 ローム株式会社 半導体装置

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