JPWO2023145316A5 - - Google Patents

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Publication number
JPWO2023145316A5
JPWO2023145316A5 JP2023576699A JP2023576699A JPWO2023145316A5 JP WO2023145316 A5 JPWO2023145316 A5 JP WO2023145316A5 JP 2023576699 A JP2023576699 A JP 2023576699A JP 2023576699 A JP2023576699 A JP 2023576699A JP WO2023145316 A5 JPWO2023145316 A5 JP WO2023145316A5
Authority
JP
Japan
Prior art keywords
transistor
electrode
clamp
semiconductor device
connection wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023576699A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2023145316A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2022/047072 external-priority patent/WO2023145316A1/ja
Publication of JPWO2023145316A1 publication Critical patent/JPWO2023145316A1/ja
Publication of JPWO2023145316A5 publication Critical patent/JPWO2023145316A5/ja
Pending legal-status Critical Current

Links

JP2023576699A 2022-01-28 2022-12-21 Pending JPWO2023145316A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022012101 2022-01-28
PCT/JP2022/047072 WO2023145316A1 (ja) 2022-01-28 2022-12-21 半導体装置および半導体モジュール

Publications (2)

Publication Number Publication Date
JPWO2023145316A1 JPWO2023145316A1 (https=) 2023-08-03
JPWO2023145316A5 true JPWO2023145316A5 (https=) 2024-10-07

Family

ID=87471641

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023576699A Pending JPWO2023145316A1 (https=) 2022-01-28 2022-12-21

Country Status (5)

Country Link
US (1) US20240379835A1 (https=)
JP (1) JPWO2023145316A1 (https=)
CN (1) CN118591889A (https=)
DE (1) DE112022006551T5 (https=)
WO (1) WO2023145316A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5996465B2 (ja) * 2013-03-21 2016-09-21 株式会社東芝 半導体装置
JP5907102B2 (ja) * 2013-03-22 2016-04-20 トヨタ自動車株式会社 半導体装置
JP6671124B2 (ja) 2015-08-10 2020-03-25 ローム株式会社 窒化物半導体デバイス
US10158029B2 (en) * 2016-02-23 2018-12-18 Analog Devices, Inc. Apparatus and methods for robust overstress protection in compound semiconductor circuit applications
JP7368054B2 (ja) * 2019-05-16 2023-10-24 ローム株式会社 半導体装置

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