JPWO2023100676A5 - - Google Patents
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- Publication number
- JPWO2023100676A5 JPWO2023100676A5 JP2023564875A JP2023564875A JPWO2023100676A5 JP WO2023100676 A5 JPWO2023100676 A5 JP WO2023100676A5 JP 2023564875 A JP2023564875 A JP 2023564875A JP 2023564875 A JP2023564875 A JP 2023564875A JP WO2023100676 A5 JPWO2023100676 A5 JP WO2023100676A5
- Authority
- JP
- Japan
- Prior art keywords
- hollow silica
- silica particles
- particles according
- density
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 38
- 239000002245 particle Substances 0.000 claims 8
- 239000000377 silicon dioxide Substances 0.000 claims 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims 6
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000007789 gas Substances 0.000 claims 4
- 239000007764 o/w emulsion Substances 0.000 claims 4
- 229910052786 argon Inorganic materials 0.000 claims 3
- 238000001739 density measurement Methods 0.000 claims 3
- 239000002243 precursor Substances 0.000 claims 3
- 239000011164 primary particle Substances 0.000 claims 3
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 238000000691 measurement method Methods 0.000 claims 2
- 239000011163 secondary particle Substances 0.000 claims 2
- 125000005372 silanol group Chemical group 0.000 claims 2
- 238000005004 MAS NMR spectroscopy Methods 0.000 claims 1
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 239000004115 Sodium Silicate Substances 0.000 claims 1
- 239000008346 aqueous phase Substances 0.000 claims 1
- 229910052788 barium Inorganic materials 0.000 claims 1
- 229910052792 caesium Inorganic materials 0.000 claims 1
- 229910052791 calcium Inorganic materials 0.000 claims 1
- 239000011362 coarse particle Substances 0.000 claims 1
- 239000001307 helium Substances 0.000 claims 1
- 229910052734 helium Inorganic materials 0.000 claims 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims 1
- 235000021388 linseed oil Nutrition 0.000 claims 1
- 239000000944 linseed oil Substances 0.000 claims 1
- 229910052744 lithium Inorganic materials 0.000 claims 1
- 229910052749 magnesium Inorganic materials 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002739 metals Chemical class 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 239000003921 oil Substances 0.000 claims 1
- 235000019198 oils Nutrition 0.000 claims 1
- 239000012071 phase Substances 0.000 claims 1
- 229910052700 potassium Inorganic materials 0.000 claims 1
- 239000002994 raw material Substances 0.000 claims 1
- 239000011342 resin composition Substances 0.000 claims 1
- 229910052701 rubidium Inorganic materials 0.000 claims 1
- 239000002002 slurry Substances 0.000 claims 1
- 229910052708 sodium Inorganic materials 0.000 claims 1
- 239000011734 sodium Substances 0.000 claims 1
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 claims 1
- 229910052911 sodium silicate Inorganic materials 0.000 claims 1
- 229910052712 strontium Inorganic materials 0.000 claims 1
- 239000004094 surface-active agent Substances 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021194371 | 2021-11-30 | ||
| PCT/JP2022/042755 WO2023100676A1 (ja) | 2021-11-30 | 2022-11-17 | 中空シリカ粒子及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100676A1 JPWO2023100676A1 (https=) | 2023-06-08 |
| JPWO2023100676A5 true JPWO2023100676A5 (https=) | 2024-08-13 |
Family
ID=86612157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564875A Pending JPWO2023100676A1 (https=) | 2021-11-30 | 2022-11-17 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240308858A1 (https=) |
| JP (1) | JPWO2023100676A1 (https=) |
| KR (1) | KR20240112850A (https=) |
| CN (1) | CN118317921A (https=) |
| TW (1) | TW202330409A (https=) |
| WO (1) | WO2023100676A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023093025A (ja) * | 2021-12-22 | 2023-07-04 | 味の素株式会社 | 樹脂組成物 |
| CN120303351A (zh) * | 2022-12-05 | 2025-07-11 | Ａｇｃ株式会社 | 树脂组合物、预浸料、带有树脂的金属基材和布线板 |
| CN121464182A (zh) * | 2023-07-10 | 2026-02-03 | 积水化学工业株式会社 | 树脂材料、固化物及多层印刷线路板 |
| TWI883741B (zh) * | 2023-12-27 | 2025-05-11 | 南亞塑膠工業股份有限公司 | 能改善可加工性的低介電樹脂組成物、預浸漬片及金屬積層板 |
| CN120423566B (zh) * | 2025-07-08 | 2025-09-09 | 浙江硅激生物科技有限公司 | 一种具有界面孔结构的富羟基二氧化硅及其制备方法和应用 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5199569B2 (ja) | 2006-06-27 | 2013-05-15 | パナソニック株式会社 | 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板 |
| CN102471590B (zh) * | 2009-07-14 | 2015-05-20 | 花王株式会社 | 低介电树脂组合物 |
| JP5513364B2 (ja) * | 2010-12-24 | 2014-06-04 | 花王株式会社 | 中空シリカ粒子 |
| JP5864299B2 (ja) | 2012-02-24 | 2016-02-17 | 味の素株式会社 | 樹脂組成物 |
| JP5600718B2 (ja) * | 2012-10-12 | 2014-10-01 | Ｄｉｃ株式会社 | 中空シリカナノ粒子の製造方法 |
| EP3733603B1 (en) * | 2017-12-26 | 2023-08-02 | Agc Inc. | Method for producing hollow silica particles |
| JP2020084128A (ja) * | 2018-11-30 | 2020-06-04 | 花王株式会社 | 電子材料用封止剤 |
| EP4112551A4 (en) * | 2020-02-27 | 2024-08-28 | Agc Inc. | HOLLOW SILICA PARTICLES AND METHOD FOR MANUFACTURING HOLLOW SILICA PARTICLES |
-
2022
- 2022-11-17 CN CN202280079036.6A patent/CN118317921A/zh active Pending
- 2022-11-17 KR KR1020247017704A patent/KR20240112850A/ko active Pending
- 2022-11-17 WO PCT/JP2022/042755 patent/WO2023100676A1/ja not_active Ceased
- 2022-11-17 JP JP2023564875A patent/JPWO2023100676A1/ja active Pending
- 2022-11-24 TW TW111145007A patent/TW202330409A/zh unknown
-
2024
- 2024-05-28 US US18/675,502 patent/US20240308858A1/en active Pending
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