JPWO2023100676A1 - - Google Patents
Info
- Publication number
- JPWO2023100676A1 JPWO2023100676A1 JP2023564875A JP2023564875A JPWO2023100676A1 JP WO2023100676 A1 JPWO2023100676 A1 JP WO2023100676A1 JP 2023564875 A JP2023564875 A JP 2023564875A JP 2023564875 A JP2023564875 A JP 2023564875A JP WO2023100676 A1 JPWO2023100676 A1 JP WO2023100676A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2002/00—Crystal-structural characteristics
- C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
- C01P2002/86—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by NMR- or ESR-data
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/30—Particle morphology extending in three dimensions
- C01P2004/32—Spheres
- C01P2004/34—Spheres hollow
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/10—Solid density
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/16—Pore diameter
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/40—Electric properties
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021194371 | 2021-11-30 | ||
| PCT/JP2022/042755 WO2023100676A1 (ja) | 2021-11-30 | 2022-11-17 | 中空シリカ粒子及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023100676A1 true JPWO2023100676A1 (https=) | 2023-06-08 |
| JPWO2023100676A5 JPWO2023100676A5 (https=) | 2024-08-13 |
Family
ID=86612157
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023564875A Pending JPWO2023100676A1 (https=) | 2021-11-30 | 2022-11-17 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240308858A1 (https=) |
| JP (1) | JPWO2023100676A1 (https=) |
| KR (1) | KR20240112850A (https=) |
| CN (1) | CN118317921A (https=) |
| TW (1) | TW202330409A (https=) |
| WO (1) | WO2023100676A1 (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2023093025A (ja) * | 2021-12-22 | 2023-07-04 | 味の素株式会社 | 樹脂組成物 |
| CN120303351A (zh) * | 2022-12-05 | 2025-07-11 | Ａｇｃ株式会社 | 树脂组合物、预浸料、带有树脂的金属基材和布线板 |
| CN121464182A (zh) * | 2023-07-10 | 2026-02-03 | 积水化学工业株式会社 | 树脂材料、固化物及多层印刷线路板 |
| TWI883741B (zh) * | 2023-12-27 | 2025-05-11 | 南亞塑膠工業股份有限公司 | 能改善可加工性的低介電樹脂組成物、預浸漬片及金屬積層板 |
| CN120423566B (zh) * | 2025-07-08 | 2025-09-09 | 浙江硅激生物科技有限公司 | 一种具有界面孔结构的富羟基二氧化硅及其制备方法和应用 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5199569B2 (ja) | 2006-06-27 | 2013-05-15 | パナソニック株式会社 | 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板 |
| CN102471590B (zh) * | 2009-07-14 | 2015-05-20 | 花王株式会社 | 低介电树脂组合物 |
| JP5513364B2 (ja) * | 2010-12-24 | 2014-06-04 | 花王株式会社 | 中空シリカ粒子 |
| JP5864299B2 (ja) | 2012-02-24 | 2016-02-17 | 味の素株式会社 | 樹脂組成物 |
| JP5600718B2 (ja) * | 2012-10-12 | 2014-10-01 | Ｄｉｃ株式会社 | 中空シリカナノ粒子の製造方法 |
| EP3733603B1 (en) * | 2017-12-26 | 2023-08-02 | Agc Inc. | Method for producing hollow silica particles |
| JP2020084128A (ja) * | 2018-11-30 | 2020-06-04 | 花王株式会社 | 電子材料用封止剤 |
| EP4112551A4 (en) * | 2020-02-27 | 2024-08-28 | Agc Inc. | HOLLOW SILICA PARTICLES AND METHOD FOR MANUFACTURING HOLLOW SILICA PARTICLES |
-
2022
- 2022-11-17 CN CN202280079036.6A patent/CN118317921A/zh active Pending
- 2022-11-17 KR KR1020247017704A patent/KR20240112850A/ko active Pending
- 2022-11-17 WO PCT/JP2022/042755 patent/WO2023100676A1/ja not_active Ceased
- 2022-11-17 JP JP2023564875A patent/JPWO2023100676A1/ja active Pending
- 2022-11-24 TW TW111145007A patent/TW202330409A/zh unknown
-
2024
- 2024-05-28 US US18/675,502 patent/US20240308858A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| US20240308858A1 (en) | 2024-09-19 |
| TW202330409A (zh) | 2023-08-01 |
| KR20240112850A (ko) | 2024-07-19 |
| WO2023100676A1 (ja) | 2023-06-08 |
| CN118317921A (zh) | 2024-07-09 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240515 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20251114 |