KR20240112850A - 중공 실리카 입자 및 그 제조 방법 - Google Patents

중공 실리카 입자 및 그 제조 방법 Download PDF

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Publication number
KR20240112850A
KR20240112850A KR1020247017704A KR20247017704A KR20240112850A KR 20240112850 A KR20240112850 A KR 20240112850A KR 1020247017704 A KR1020247017704 A KR 1020247017704A KR 20247017704 A KR20247017704 A KR 20247017704A KR 20240112850 A KR20240112850 A KR 20240112850A
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KR
South Korea
Prior art keywords
hollow silica
particles
silica particles
hollow
density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247017704A
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English (en)
Korean (ko)
Inventor
히로미치 가모
하지메 가타야마
Original Assignee
에이지씨 가부시키가이샤
에이지씨 에스아이테크 가부시키가이샤
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Publication of KR20240112850A publication Critical patent/KR20240112850A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/86—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by NMR- or ESR-data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C01P2004/34—Spheres hollow
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/16—Pore diameter
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
KR1020247017704A 2021-11-30 2022-11-17 중공 실리카 입자 및 그 제조 방법 Pending KR20240112850A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021194371 2021-11-30
JPJP-P-2021-194371 2021-11-30
PCT/JP2022/042755 WO2023100676A1 (ja) 2021-11-30 2022-11-17 中空シリカ粒子及びその製造方法

Publications (1)

Publication Number Publication Date
KR20240112850A true KR20240112850A (ko) 2024-07-19

Family

ID=86612157

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247017704A Pending KR20240112850A (ko) 2021-11-30 2022-11-17 중공 실리카 입자 및 그 제조 방법

Country Status (6)

Country Link
US (1) US20240308858A1 (https=)
JP (1) JPWO2023100676A1 (https=)
KR (1) KR20240112850A (https=)
CN (1) CN118317921A (https=)
TW (1) TW202330409A (https=)
WO (1) WO2023100676A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023093025A (ja) * 2021-12-22 2023-07-04 味の素株式会社 樹脂組成物
CN120303351A (zh) * 2022-12-05 2025-07-11 Ａｇｃ株式会社 树脂组合物、预浸料、带有树脂的金属基材和布线板
CN121464182A (zh) * 2023-07-10 2026-02-03 积水化学工业株式会社 树脂材料、固化物及多层印刷线路板
TWI883741B (zh) * 2023-12-27 2025-05-11 南亞塑膠工業股份有限公司 能改善可加工性的低介電樹脂組成物、預浸漬片及金屬積層板
CN120423566B (zh) * 2025-07-08 2025-09-09 浙江硅激生物科技有限公司 一种具有界面孔结构的富羟基二氧化硅及其制备方法和应用

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008031409A (ja) 2006-06-27 2008-02-14 Matsushita Electric Works Ltd 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板
JP2013173841A (ja) 2012-02-24 2013-09-05 Ajinomoto Co Inc 樹脂組成物

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471590B (zh) * 2009-07-14 2015-05-20 花王株式会社 低介电树脂组合物
JP5513364B2 (ja) * 2010-12-24 2014-06-04 花王株式会社 中空シリカ粒子
JP5600718B2 (ja) * 2012-10-12 2014-10-01 Ｄｉｃ株式会社 中空シリカナノ粒子の製造方法
EP3733603B1 (en) * 2017-12-26 2023-08-02 Agc Inc. Method for producing hollow silica particles
JP2020084128A (ja) * 2018-11-30 2020-06-04 花王株式会社 電子材料用封止剤
EP4112551A4 (en) * 2020-02-27 2024-08-28 Agc Inc. HOLLOW SILICA PARTICLES AND METHOD FOR MANUFACTURING HOLLOW SILICA PARTICLES

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008031409A (ja) 2006-06-27 2008-02-14 Matsushita Electric Works Ltd 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板
JP2013173841A (ja) 2012-02-24 2013-09-05 Ajinomoto Co Inc 樹脂組成物

Also Published As

Publication number Publication date
US20240308858A1 (en) 2024-09-19
TW202330409A (zh) 2023-08-01
WO2023100676A1 (ja) 2023-06-08
JPWO2023100676A1 (https=) 2023-06-08
CN118317921A (zh) 2024-07-09

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PA0105 International application

Patent event date: 20240527

Patent event code: PA01051R01D

Comment text: International Patent Application

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