CN118317921A - 中空二氧化硅颗粒及其制造方法 - Google Patents

中空二氧化硅颗粒及其制造方法 Download PDF

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Publication number
CN118317921A
CN118317921A CN202280079036.6A CN202280079036A CN118317921A CN 118317921 A CN118317921 A CN 118317921A CN 202280079036 A CN202280079036 A CN 202280079036A CN 118317921 A CN118317921 A CN 118317921A
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CN
China
Prior art keywords
hollow silica
silica particles
particles
mass
less
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202280079036.6A
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English (en)
Chinese (zh)
Inventor
加茂博道
片山肇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agc Silicon Technology Co ltd
AGC Inc
Original Assignee
Agc Silicon Technology Co ltd
Asahi Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Agc Silicon Technology Co ltd, Asahi Glass Co Ltd filed Critical Agc Silicon Technology Co ltd
Publication of CN118317921A publication Critical patent/CN118317921A/zh
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B33/00—Silicon; Compounds thereof
    • C01B33/113—Silicon oxides; Hydrates thereof
    • C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
    • C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2002/00—Crystal-structural characteristics
    • C01P2002/80—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70
    • C01P2002/86—Crystal-structural characteristics defined by measured data other than those specified in group C01P2002/70 by NMR- or ESR-data
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/01—Particle morphology depicted by an image
    • C01P2004/03—Particle morphology depicted by an image obtained by SEM
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/30—Particle morphology extending in three dimensions
    • C01P2004/32—Spheres
    • C01P2004/34—Spheres hollow
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/10—Solid density
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/12—Surface area
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/16—Pore diameter
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/40—Electric properties

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Silicon Compounds (AREA)
CN202280079036.6A 2021-11-30 2022-11-17 中空二氧化硅颗粒及其制造方法 Pending CN118317921A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021-194371 2021-11-30
JP2021194371 2021-11-30
PCT/JP2022/042755 WO2023100676A1 (ja) 2021-11-30 2022-11-17 中空シリカ粒子及びその製造方法

Publications (1)

Publication Number Publication Date
CN118317921A true CN118317921A (zh) 2024-07-09

Family

ID=86612157

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202280079036.6A Pending CN118317921A (zh) 2021-11-30 2022-11-17 中空二氧化硅颗粒及其制造方法

Country Status (6)

Country Link
US (1) US20240308858A1 (https=)
JP (1) JPWO2023100676A1 (https=)
KR (1) KR20240112850A (https=)
CN (1) CN118317921A (https=)
TW (1) TW202330409A (https=)
WO (1) WO2023100676A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023093025A (ja) * 2021-12-22 2023-07-04 味の素株式会社 樹脂組成物
CN120303351A (zh) * 2022-12-05 2025-07-11 Ａｇｃ株式会社 树脂组合物、预浸料、带有树脂的金属基材和布线板
CN121464182A (zh) * 2023-07-10 2026-02-03 积水化学工业株式会社 树脂材料、固化物及多层印刷线路板
TWI883741B (zh) * 2023-12-27 2025-05-11 南亞塑膠工業股份有限公司 能改善可加工性的低介電樹脂組成物、預浸漬片及金屬積層板
CN120423566B (zh) * 2025-07-08 2025-09-09 浙江硅激生物科技有限公司 一种具有界面孔结构的富羟基二氧化硅及其制备方法和应用

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471590A (zh) * 2009-07-14 2012-05-23 花王株式会社 低介电树脂组合物
JP2014076935A (ja) * 2012-10-12 2014-05-01 Kawamura Institute Of Chemical Research 中空シリカナノ粒子の製造方法及び中空シリカナノ粒子
WO2021172294A1 (ja) * 2020-02-27 2021-09-02 Ａｇｃ株式会社 中空シリカ粒子及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5199569B2 (ja) 2006-06-27 2013-05-15 パナソニック株式会社 低誘電樹脂組成物、プリプレグ、金属張積層板、プリント配線板
JP5513364B2 (ja) * 2010-12-24 2014-06-04 花王株式会社 中空シリカ粒子
JP5864299B2 (ja) 2012-02-24 2016-02-17 味の素株式会社 樹脂組成物
EP3733603B1 (en) * 2017-12-26 2023-08-02 Agc Inc. Method for producing hollow silica particles
JP2020084128A (ja) * 2018-11-30 2020-06-04 花王株式会社 電子材料用封止剤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102471590A (zh) * 2009-07-14 2012-05-23 花王株式会社 低介电树脂组合物
JP2014076935A (ja) * 2012-10-12 2014-05-01 Kawamura Institute Of Chemical Research 中空シリカナノ粒子の製造方法及び中空シリカナノ粒子
WO2021172294A1 (ja) * 2020-02-27 2021-09-02 Ａｇｃ株式会社 中空シリカ粒子及びその製造方法
WO2021172293A1 (ja) * 2020-02-27 2021-09-02 Ａｇｃ株式会社 中空シリカ粒子及び中空シリカ粒子の製造方法

Also Published As

Publication number Publication date
US20240308858A1 (en) 2024-09-19
TW202330409A (zh) 2023-08-01
KR20240112850A (ko) 2024-07-19
WO2023100676A1 (ja) 2023-06-08
JPWO2023100676A1 (https=) 2023-06-08

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