JPWO2023074886A5 - - Google Patents
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- Publication number
- JPWO2023074886A5 JPWO2023074886A5 JP2023556696A JP2023556696A JPWO2023074886A5 JP WO2023074886 A5 JPWO2023074886 A5 JP WO2023074886A5 JP 2023556696 A JP2023556696 A JP 2023556696A JP 2023556696 A JP2023556696 A JP 2023556696A JP WO2023074886 A5 JPWO2023074886 A5 JP WO2023074886A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- composition according
- group
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 229920005989 resin Polymers 0.000 claims 10
- 239000011347 resin Substances 0.000 claims 10
- 239000011342 resin composition Substances 0.000 claims 9
- -1 phosphoric acid ester compound Chemical class 0.000 claims 6
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 2
- 229920000058 polyacrylate Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 1
- 150000003923 2,5-pyrrolediones Chemical class 0.000 claims 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims 1
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 claims 1
- 229920000877 Melamine resin Polymers 0.000 claims 1
- 239000004640 Melamine resin Substances 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 229920003180 amino resin Polymers 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 125000000753 cycloalkyl group Chemical group 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 239000012948 isocyanate Substances 0.000 claims 1
- 150000002513 isocyanates Chemical class 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 claims 1
- 229920001568 phenolic resin Polymers 0.000 claims 1
- 239000005011 phenolic resin Substances 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920001955 polyphenylene ether Polymers 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 229920001187 thermosetting polymer Polymers 0.000 claims 1
- 229920006337 unsaturated polyester resin Polymers 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021178896 | 2021-11-01 | ||
| PCT/JP2022/040575 WO2023074886A1 (ja) | 2021-11-01 | 2022-10-31 | 樹脂組成物、プリプレグ、積層板、金属張り積層板、プリント配線板及び半導体パッケージ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023074886A1 JPWO2023074886A1 (https=) | 2023-05-04 |
| JPWO2023074886A5 true JPWO2023074886A5 (https=) | 2024-07-19 |
Family
ID=86159496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023556696A Pending JPWO2023074886A1 (https=) | 2021-11-01 | 2022-10-31 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023074886A1 (https=) |
| KR (1) | KR20240095198A (https=) |
| CN (1) | CN118159605A (https=) |
| TW (1) | TW202323430A (https=) |
| WO (1) | WO2023074886A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2025028469A1 (https=) * | 2023-08-02 | 2025-02-06 | ||
| CN119592067A (zh) * | 2023-09-01 | 2025-03-11 | 台光电子材料(昆山)股份有限公司 | 树脂组合物及其制品 |
| CN120981515A (zh) * | 2023-09-08 | 2025-11-18 | 株式会社力森诺科 | 预浸料、层叠板、印刷线路板及半导体封装体 |
| WO2025126952A1 (ja) * | 2023-12-12 | 2025-06-19 | 株式会社レゾナック | 樹脂組成物、プリプレグ、積層板、樹脂フィルム、プリント配線板及び半導体パッケージ |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001013679A (ja) * | 1999-04-30 | 2001-01-19 | Toagosei Co Ltd | レジスト組成物 |
| JP4586609B2 (ja) * | 2005-03-30 | 2010-11-24 | 日立化成工業株式会社 | 硬化性樹脂組成物、プリプレグ、基板、金属箔張積層板及びプリント配線板 |
| JP6357762B2 (ja) | 2012-11-28 | 2018-07-18 | 日立化成株式会社 | 変性シロキサン化合物、熱硬化性樹脂組成物、プリプレグ、樹脂付きフィルム、積層板、多層プリント配線板及び半導体パッケージ |
| TWI812589B (zh) | 2016-05-13 | 2023-08-21 | 日商力森諾科股份有限公司 | 樹脂組成物、預浸體、附有樹脂之金屬箔、積層板、及印刷線路板 |
| US10681807B2 (en) * | 2017-03-29 | 2020-06-09 | Hitachi Chemical Company, Ltd. | Coreless substrate prepreg, coreless substrate, coreless substrate manufacturing method and semiconductor package |
| JP7100799B2 (ja) * | 2018-01-12 | 2022-07-14 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
-
2022
- 2022-10-31 CN CN202280072011.3A patent/CN118159605A/zh active Pending
- 2022-10-31 JP JP2023556696A patent/JPWO2023074886A1/ja active Pending
- 2022-10-31 WO PCT/JP2022/040575 patent/WO2023074886A1/ja not_active Ceased
- 2022-10-31 KR KR1020247012891A patent/KR20240095198A/ko active Pending
- 2022-11-01 TW TW111141515A patent/TW202323430A/zh unknown
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