JP2013079326A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2013079326A5 JP2013079326A5 JP2011219996A JP2011219996A JP2013079326A5 JP 2013079326 A5 JP2013079326 A5 JP 2013079326A5 JP 2011219996 A JP2011219996 A JP 2011219996A JP 2011219996 A JP2011219996 A JP 2011219996A JP 2013079326 A5 JP2013079326 A5 JP 2013079326A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon atoms
- resin composition
- hydrogen atom
- represented
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000004432 carbon atom Chemical group C* 0.000 claims description 24
- 239000011342 resin composition Substances 0.000 claims description 20
- -1 polytetrafluoroethylene Polymers 0.000 claims description 16
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- 125000000217 alkyl group Chemical group 0.000 claims description 13
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 7
- 239000003063 flame retardant Substances 0.000 claims description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims description 6
- 125000003342 alkenyl group Chemical group 0.000 claims description 6
- 125000000219 ethylidene group Chemical group [H]C(=[*])C([H])([H])[H] 0.000 claims description 6
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 4
- 125000005843 halogen group Chemical group 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 125000000732 arylene group Chemical group 0.000 claims description 3
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims description 3
- 125000002947 alkylene group Chemical group 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 239000003054 catalyst Substances 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000000691 measurement method Methods 0.000 claims 1
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 7
- 229920000768 polyamine Polymers 0.000 description 4
- QCBSYPYHCJMQGB-UHFFFAOYSA-N 2-ethyl-1,3,5-triazine Chemical compound CCC1=NC=NC=N1 QCBSYPYHCJMQGB-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 150000002460 imidazoles Chemical class 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 125000004209 (C1-C8) alkyl group Chemical group 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- XZKLXPPYISZJCV-UHFFFAOYSA-N 1-benzyl-2-phenylimidazole Chemical compound C1=CN=C(C=2C=CC=CC=2)N1CC1=CC=CC=C1 XZKLXPPYISZJCV-UHFFFAOYSA-N 0.000 description 1
- RWWPXMBLPKCOIT-UHFFFAOYSA-N 1-hydroxy-5-methyl-2-phenylimidazol-4-ol Chemical compound ON1C(C)=C(O)N=C1C1=CC=CC=C1 RWWPXMBLPKCOIT-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- YTWBFUCJVWKCCK-UHFFFAOYSA-N 2-heptadecyl-1h-imidazole Chemical compound CCCCCCCCCCCCCCCCCC1=NC=CN1 YTWBFUCJVWKCCK-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QXSNXUCNBZLVFM-UHFFFAOYSA-N 2-methyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound CC1=NC=CN1.O=C1NC(=O)NC(=O)N1 QXSNXUCNBZLVFM-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- RJIQELZAIWFNTQ-UHFFFAOYSA-N 2-phenyl-1h-imidazole;1,3,5-triazinane-2,4,6-trione Chemical compound O=C1NC(=O)NC(=O)N1.C1=CNC(C=2C=CC=CC=2)=N1 RJIQELZAIWFNTQ-UHFFFAOYSA-N 0.000 description 1
- MDWCEEQVTZURSU-UHFFFAOYSA-N 3-(2,4,8,10-tetraoxaspiro[5.5]undecan-5-yl)propan-1-amine Chemical compound NCCCC1OCOCC11COCOC1 MDWCEEQVTZURSU-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- BVYPJEBKDLFIDL-UHFFFAOYSA-N 3-(2-phenylimidazol-1-yl)propanenitrile Chemical compound N#CCCN1C=CN=C1C1=CC=CC=C1 BVYPJEBKDLFIDL-UHFFFAOYSA-N 0.000 description 1
- SZUPZARBRLCVCB-UHFFFAOYSA-N 3-(2-undecylimidazol-1-yl)propanenitrile Chemical compound CCCCCCCCCCCC1=NC=CN1CCC#N SZUPZARBRLCVCB-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- IGSBHTZEJMPDSZ-UHFFFAOYSA-N 4-[(4-amino-3-methylcyclohexyl)methyl]-2-methylcyclohexan-1-amine Chemical compound C1CC(N)C(C)CC1CC1CC(C)C(N)CC1 IGSBHTZEJMPDSZ-UHFFFAOYSA-N 0.000 description 1
- KXEPRLUGFAULQX-UHFFFAOYSA-N 4-[2,5-di(propan-2-yl)phenyl]aniline Chemical compound CC(C)C1=CC=C(C(C)C)C(C=2C=CC(N)=CC=2)=C1 KXEPRLUGFAULQX-UHFFFAOYSA-N 0.000 description 1
- ZYEDGEXYGKWJPB-UHFFFAOYSA-N 4-[2-(4-aminophenyl)propan-2-yl]aniline Chemical compound C=1C=C(N)C=CC=1C(C)(C)C1=CC=C(N)C=C1 ZYEDGEXYGKWJPB-UHFFFAOYSA-N 0.000 description 1
- XUXRJWVQVJICHM-UHFFFAOYSA-N 4-methyl-2-phenyl-1H-triazol-5-one Chemical compound OC1=NN(N=C1C)C1=CC=CC=C1 XUXRJWVQVJICHM-UHFFFAOYSA-N 0.000 description 1
- YKCCXOHQOVXCIG-UHFFFAOYSA-N 5-(1-cyanoethyl)-2-(2-phenylethoxymethyl)imidazole-1,4-dicarbonitrile Chemical compound C(#N)C(C)C=1N(C(=NC=1C#N)COCCC1=CC=CC=C1)C#N YKCCXOHQOVXCIG-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- QDZXJOMXPRWGFG-UHFFFAOYSA-N CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 Chemical compound CCC1=NC=NC=N1.O=C1NC(=O)NC(=O)N1 QDZXJOMXPRWGFG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- XZAHJRZBUWYCBM-UHFFFAOYSA-N [1-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1(CN)CCCCC1 XZAHJRZBUWYCBM-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000001118 alkylidene group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- UKJLNMAFNRKWGR-UHFFFAOYSA-N cyclohexatrienamine Chemical group NC1=CC=C=C[CH]1 UKJLNMAFNRKWGR-UHFFFAOYSA-N 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229940018564 m-phenylenediamine Drugs 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- KYTZHLUVELPASH-UHFFFAOYSA-N naphthalene-1,2-dicarboxylic acid Chemical compound C1=CC=CC2=C(C(O)=O)C(C(=O)O)=CC=C21 KYTZHLUVELPASH-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011219996A JP2013079326A (ja) | 2011-10-04 | 2011-10-04 | 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ |
| TW101132303A TW201315751A (zh) | 2011-10-04 | 2012-09-05 | 樹脂組成物、含有該組成物之增層用絕緣體、及使用該組成物之預浸物 |
| PCT/JP2012/006265 WO2013051227A1 (ja) | 2011-10-04 | 2012-10-01 | 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011219996A JP2013079326A (ja) | 2011-10-04 | 2011-10-04 | 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013079326A JP2013079326A (ja) | 2013-05-02 |
| JP2013079326A5 true JP2013079326A5 (https=) | 2014-09-11 |
Family
ID=48043411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011219996A Pending JP2013079326A (ja) | 2011-10-04 | 2011-10-04 | 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2013079326A (https=) |
| TW (1) | TW201315751A (https=) |
| WO (1) | WO2013051227A1 (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6430203B2 (ja) * | 2014-04-03 | 2018-11-28 | 三菱鉛筆株式会社 | エポキシ樹脂材料添加用のポリテトラフルオロエチレンの油性溶剤系分散体 |
| WO2015152240A1 (ja) * | 2014-04-02 | 2015-10-08 | 三菱鉛筆株式会社 | ポリテトラフルオロエチレンの油性溶剤系分散体 |
| CN105837839B (zh) | 2015-01-30 | 2021-02-02 | 三菱铅笔株式会社 | 聚四氟乙烯的油性溶剂系分散体以及含聚四氟乙烯的环氧树脂组合物和其固化物 |
| WO2016159102A1 (ja) * | 2015-04-01 | 2016-10-06 | 三菱鉛筆株式会社 | フッ素系樹脂含有非水系分散体、フッ素系樹脂含有ポリイミド前駆体溶液組成物、それを用いたポリイミド、ポリイミドフィルム、回路基板用接着剤組成物、およびそれらの製造方法 |
| JP6461700B2 (ja) * | 2015-04-28 | 2019-01-30 | 三菱鉛筆株式会社 | 回路基板用接着剤組成物 |
| TWI725054B (zh) | 2015-10-01 | 2021-04-21 | 日商三菱鉛筆股份有限公司 | 氟系樹脂之非水系分散體、含氟系樹脂之熱硬化樹脂組成物與其硬化物、及電路基板用接著劑組成物 |
| JP6834155B2 (ja) * | 2016-03-16 | 2021-02-24 | 味の素株式会社 | 樹脂組成物 |
| WO2018003314A1 (ja) * | 2016-06-29 | 2018-01-04 | 三菱瓦斯化学株式会社 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
| JP6828510B2 (ja) * | 2017-02-27 | 2021-02-10 | 味の素株式会社 | 樹脂組成物 |
| JP6801608B2 (ja) * | 2017-08-21 | 2020-12-16 | 味の素株式会社 | 樹脂組成物 |
| JP2021181537A (ja) | 2020-05-19 | 2021-11-25 | 三菱鉛筆株式会社 | フッ素系樹脂粒子非水系分散体 |
| CN112876903A (zh) * | 2021-03-07 | 2021-06-01 | 珠海英勇科技有限公司 | 一种低介电塞孔油墨及其制备方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02120351A (ja) * | 1988-10-29 | 1990-05-08 | Japan Synthetic Rubber Co Ltd | 難燃性樹脂組成物 |
| JP2003082061A (ja) * | 2001-09-10 | 2003-03-19 | Asahi Denka Kogyo Kk | 硬化性組成物 |
| JP4463005B2 (ja) * | 2004-05-31 | 2010-05-12 | 株式会社Ａｄｅｋａ | エポキシ樹脂組成物 |
| JP5421786B2 (ja) * | 2008-01-31 | 2014-02-19 | 積水化学工業株式会社 | 樹脂組成物、及びそれを用いた積層樹脂フィルム |
| JP5683093B2 (ja) * | 2009-11-13 | 2015-03-11 | 株式会社Adeka | ポリアミド化合物及びそれを含有してなるエポキシ樹脂組成物 |
-
2011
- 2011-10-04 JP JP2011219996A patent/JP2013079326A/ja active Pending
-
2012
- 2012-09-05 TW TW101132303A patent/TW201315751A/zh unknown
- 2012-10-01 WO PCT/JP2012/006265 patent/WO2013051227A1/ja not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2013079326A5 (https=) | ||
| JP6672699B2 (ja) | エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法 | |
| JP5846290B2 (ja) | ハロゲンフリー難燃性接着剤組成物 | |
| JP4723865B2 (ja) | 難燃性エポキシ樹脂組成物、同組成物を含有するプリプレグ、積層板およびプリント配線板 | |
| JP2002284963A (ja) | 難燃性エポキシ樹脂組成物及びその用途 | |
| JP6854505B2 (ja) | 樹脂組成物、それを用いた熱硬化性フィルム | |
| CN107254144A (zh) | 树脂组合物和使用其的预浸料以及层压板 | |
| JP2013166959A (ja) | 混合触媒系を含む硬化性エポキシ樹脂組成物およびそれから作られた積層体 | |
| JP2013079326A (ja) | 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ | |
| CN101341181A (zh) | 可固化环氧树脂组合物及由其制造的层压材料 | |
| WO2007046405A1 (ja) | 熱硬化性樹脂組成物並びにその用途 | |
| JP2010222408A (ja) | フレキシブルプリント配線板用樹脂組成物、樹脂フィルム、プリプレグ、樹脂付き金属箔、フレキシブルプリント配線板 | |
| JP4616771B2 (ja) | 難燃性エポキシ樹脂組成物及びその硬化物 | |
| JP6686666B2 (ja) | エポキシ樹脂、エポキシ樹脂組成物、硬化物、電気・電子回路用積層板及びエポキシ樹脂の製造方法 | |
| JP6340877B2 (ja) | リン含有エポキシ樹脂、リン含有エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板 | |
| JP5004483B2 (ja) | プリプレグ用エポキシ樹脂硬化性組成物 | |
| JP5234584B2 (ja) | エポキシ樹脂硬化性組成物 | |
| JP2005036126A (ja) | エポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料。 | |
| JP2004143424A (ja) | 非ハロゲン系樹脂組成物 | |
| CN110461937A (zh) | 树脂组合物、树脂片、树脂固化物、树脂基板以及层叠基板 | |
| JP2001139652A (ja) | 燐および窒素を含む樹脂硬化剤とその硬化剤を含む難燃性樹脂組成物 | |
| JP6248524B2 (ja) | 熱硬化性樹脂組成物、これを用いたプリプレグ、積層板及びプリント配線板 | |
| JP2005126543A (ja) | 難燃性非ハロゲンエポキシ樹脂組成物及びそれを用いたフレキシブル印刷配線板材料 | |
| JP6203303B2 (ja) | 熱硬化性樹脂組成物、その製造方法および用途 | |
| CN102838842A (zh) | 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板 |