JPWO2022201619A5 - - Google Patents
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- Publication number
- JPWO2022201619A5 JPWO2022201619A5 JP2022540935A JP2022540935A JPWO2022201619A5 JP WO2022201619 A5 JPWO2022201619 A5 JP WO2022201619A5 JP 2022540935 A JP2022540935 A JP 2022540935A JP 2022540935 A JP2022540935 A JP 2022540935A JP WO2022201619 A5 JPWO2022201619 A5 JP WO2022201619A5
- Authority
- JP
- Japan
- Prior art keywords
- thermosetting resin
- resin composition
- composition according
- compound
- linear
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001187 thermosetting polymer Polymers 0.000 claims 17
- 239000011342 resin composition Substances 0.000 claims 14
- -1 bismaleimide compound Chemical class 0.000 claims 8
- 125000004432 carbon atom Chemical group C* 0.000 claims 8
- 229920005989 resin Polymers 0.000 claims 7
- 239000011347 resin Substances 0.000 claims 7
- 150000001875 compounds Chemical class 0.000 claims 5
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 5
- 125000004450 alkenylene group Chemical group 0.000 claims 2
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000002947 alkylene group Chemical group 0.000 claims 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000003505 polymerization initiator Substances 0.000 claims 2
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Natural products P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 239000003733 fiber-reinforced composite Substances 0.000 claims 1
- 239000000945 filler Substances 0.000 claims 1
- 239000011888 foil Substances 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000004714 phosphonium salts Chemical class 0.000 claims 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 claims 1
- 239000007870 radical polymerization initiator Substances 0.000 claims 1
- 239000012783 reinforcing fiber Substances 0.000 claims 1
- 239000003566 sealing material Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021052291 | 2021-03-25 | ||
| JP2021052291 | 2021-03-25 | ||
| PCT/JP2021/040617 WO2022201619A1 (ja) | 2021-03-25 | 2021-11-04 | 熱硬化性樹脂組成物、硬化物、樹脂シート、プリプレグ、金属箔張積層板、多層プリント配線板、封止用材料、繊維強化複合材料、接着剤及び半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022201619A1 JPWO2022201619A1 (https=) | 2022-09-29 |
| JP7191275B1 JP7191275B1 (ja) | 2022-12-16 |
| JPWO2022201619A5 true JPWO2022201619A5 (https=) | 2023-02-20 |
Family
ID=83395322
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022540935A Active JP7191275B1 (ja) | 2021-03-25 | 2021-11-04 | 熱硬化性樹脂組成物、硬化物、樹脂シート、プリプレグ、金属箔張積層板、多層プリント配線板、封止用材料、繊維強化複合材料、接着剤及び半導体装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US12486371B2 (https=) |
| JP (1) | JP7191275B1 (https=) |
| KR (1) | KR20230160786A (https=) |
| CN (1) | CN116888189B (https=) |
| TW (1) | TWI888666B (https=) |
| WO (1) | WO2022201619A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12516163B2 (en) * | 2021-10-28 | 2026-01-06 | Shin-Etsu Chemical Co., Ltd. | Heat-curable maleimide resin composition for RTM, fiber-reinforced composite material and radome |
| JP2024002673A (ja) * | 2022-06-24 | 2024-01-11 | 信越化学工業株式会社 | 硬化性樹脂組成物、半導体封止材、接着剤、接着フィルム、プリプレグ、層間絶縁材料及びプリント配線板 |
| CN119735808B (zh) * | 2024-12-23 | 2026-01-13 | 睿龙材料科技(江苏)有限公司 | 一种双马来酰亚胺树脂组合物及其制备的半固化片及层压板 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010020071A1 (en) * | 1997-10-10 | 2001-09-06 | Capote Miguel Albert | High performance cyanate-bismaleimide-epoxy resin compositions for printed circuits and encapsulants |
| JPH11124433A (ja) | 1997-10-22 | 1999-05-11 | Mitsubishi Gas Chem Co Inc | フェノールノボラック型シアン酸エステルプレポリマー |
| JP4116869B2 (ja) | 2002-11-20 | 2008-07-09 | 株式会社巴川製紙所 | 耐熱性接着剤組成物及びこれを用いた積層体、並びにフレキシブルプリント基板 |
| US20130026660A1 (en) | 2011-07-29 | 2013-01-31 | Namics Corporation | Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the same |
| JP6260150B2 (ja) * | 2012-12-03 | 2018-01-17 | Jsr株式会社 | 液晶配向剤、液晶配向膜、液晶表示素子、位相差フィルム、位相差フィルムの製造方法、重合体及び化合物 |
| JP6825368B2 (ja) * | 2016-01-05 | 2021-02-03 | 荒川化学工業株式会社 | 銅張積層体及びプリント配線板 |
| TWI582136B (zh) * | 2016-07-25 | 2017-05-11 | Chin Yee Chemical Industres Co Ltd | Thermosetting resin and its composition, use |
| CN113474380A (zh) * | 2019-03-15 | 2021-10-01 | 日本化药株式会社 | 聚酰胺酸树脂、聚酰亚胺树脂及含有这些的树脂组合物 |
| WO2020203834A1 (ja) * | 2019-04-02 | 2020-10-08 | 日本化薬株式会社 | ビスマレイミド化合物、それを用いた感光性樹脂組成物、その硬化物及び半導体素子 |
| JP6981522B1 (ja) * | 2020-12-15 | 2021-12-15 | 東洋インキＳｃホールディングス株式会社 | 熱硬化性樹脂組成物、およびその利用 |
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2021
- 2021-11-04 TW TW110141106A patent/TWI888666B/zh active
- 2021-11-04 KR KR1020237026735A patent/KR20230160786A/ko active Pending
- 2021-11-04 WO PCT/JP2021/040617 patent/WO2022201619A1/ja not_active Ceased
- 2021-11-04 JP JP2022540935A patent/JP7191275B1/ja active Active
- 2021-11-04 CN CN202180093008.5A patent/CN116888189B/zh active Active
- 2021-11-04 US US18/276,056 patent/US12486371B2/en active Active