JP2024516137A5 - - Google Patents

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Publication number
JP2024516137A5
JP2024516137A5 JP2023563874A JP2023563874A JP2024516137A5 JP 2024516137 A5 JP2024516137 A5 JP 2024516137A5 JP 2023563874 A JP2023563874 A JP 2023563874A JP 2023563874 A JP2023563874 A JP 2023563874A JP 2024516137 A5 JP2024516137 A5 JP 2024516137A5
Authority
JP
Japan
Prior art keywords
phenylene ether
ether oligomer
thermosetting composition
methyl
article
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023563874A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024516137A (ja
Filing date
Publication date
Priority claimed from EP21169518.4A external-priority patent/EP4079784A1/en
Application filed filed Critical
Publication of JP2024516137A publication Critical patent/JP2024516137A/ja
Publication of JP2024516137A5 publication Critical patent/JP2024516137A5/ja
Pending legal-status Critical Current

Links

JP2023563874A 2021-04-20 2022-04-19 フェニレンエーテルオリゴマーおよびフェニレンエーテルオリゴマーを含む硬化可能な熱硬化性組成物 Pending JP2024516137A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP21169518.4A EP4079784A1 (en) 2021-04-20 2021-04-20 Phenylene ether oligomer and curable thermosetting composition comprising the phenylene ether oligomer
EP21169518.4 2021-04-20
PCT/IB2022/053659 WO2022224144A1 (en) 2021-04-20 2022-04-19 Phenylene ether oligomer and curable thermosetting composition comprising the phenylene ether oligomer

Publications (2)

Publication Number Publication Date
JP2024516137A JP2024516137A (ja) 2024-04-12
JP2024516137A5 true JP2024516137A5 (https=) 2025-05-19

Family

ID=75625416

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023563874A Pending JP2024516137A (ja) 2021-04-20 2022-04-19 フェニレンエーテルオリゴマーおよびフェニレンエーテルオリゴマーを含む硬化可能な熱硬化性組成物

Country Status (7)

Country Link
US (1) US20240376240A1 (https=)
EP (1) EP4079784A1 (https=)
JP (1) JP2024516137A (https=)
KR (1) KR20230170675A (https=)
CN (1) CN117178007A (https=)
TW (1) TWI900758B (https=)
WO (1) WO2022224144A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11926736B1 (en) * 2023-02-17 2024-03-12 Thintronics, Inc. Curable film composition, curable film, and cured product thereof
TWI847882B (zh) * 2023-09-27 2024-07-01 國立中興大學 寡聚物、其製備方法與固化物

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US4304705A (en) 1980-01-02 1981-12-08 Minnesota Mining And Manufacturing Company Radiation-curable polymers containing pendant unsaturated peptide groups derived from azlactone polymers
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US6627704B2 (en) * 1999-12-01 2003-09-30 General Electric Company Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom
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US6835785B2 (en) * 2002-01-28 2004-12-28 Mitsubishi Gas Chemical Company, Inc. Polyphenylene ether oligomer compound, derivatives thereof and use thereof
US7192651B2 (en) 2003-08-20 2007-03-20 Mitsubishi Gas Chemical Company, Inc. Resin composition and prepreg for laminate and metal-clad laminate
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JP7081950B2 (ja) * 2018-03-27 2022-06-07 旭化成株式会社 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板
US10995182B2 (en) * 2018-04-30 2021-05-04 Shpp Global Technologies B.V. Phenylene ether oligomer, curable composition comprising the phenylene ether oligomer, and thermoset composition derived therefrom
KR102400111B1 (ko) * 2019-02-08 2022-05-19 주식회사 엘지화학 반도체 패키지용 열경화성 수지 조성물, 프리프레그 및 금속박 적층판
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