JPWO2023062877A5 - - Google Patents
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- Publication number
- JPWO2023062877A5 JPWO2023062877A5 JP2023554254A JP2023554254A JPWO2023062877A5 JP WO2023062877 A5 JPWO2023062877 A5 JP WO2023062877A5 JP 2023554254 A JP2023554254 A JP 2023554254A JP 2023554254 A JP2023554254 A JP 2023554254A JP WO2023062877 A5 JPWO2023062877 A5 JP WO2023062877A5
- Authority
- JP
- Japan
- Prior art keywords
- liquid sealant
- sealant according
- epoxy resin
- mass
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims 13
- 239000000565 sealant Substances 0.000 claims 12
- 239000003822 epoxy resin Substances 0.000 claims 4
- 229920000647 polyepoxide Polymers 0.000 claims 4
- 239000003054 catalyst Substances 0.000 claims 3
- 239000003795 chemical substances by application Substances 0.000 claims 3
- 239000000945 filler Substances 0.000 claims 3
- 239000004844 aliphatic epoxy resin Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 150000002391 heterocyclic compounds Chemical group 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000004848 polyfunctional curative Substances 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021168186 | 2021-10-13 | ||
| PCT/JP2022/024511 WO2023062877A1 (ja) | 2021-10-13 | 2022-06-20 | 液状封止剤、電子部品及びその製造方法、並びに半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023062877A1 JPWO2023062877A1 (https=) | 2023-04-20 |
| JPWO2023062877A5 true JPWO2023062877A5 (https=) | 2025-01-31 |
Family
ID=85988259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023554254A Pending JPWO2023062877A1 (https=) | 2021-10-13 | 2022-06-20 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023062877A1 (https=) |
| KR (1) | KR20240081446A (https=) |
| WO (1) | WO2023062877A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117801745B (zh) * | 2024-02-28 | 2024-05-31 | 武汉市三选科技有限公司 | 低热膨胀系数的底部填充胶、其制备方法及芯片封装结构 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3656623B2 (ja) * | 2002-08-27 | 2005-06-08 | 松下電工株式会社 | 半導体装置の製造方法及び半導体装置 |
| JP2006176678A (ja) * | 2004-12-22 | 2006-07-06 | Matsushita Electric Works Ltd | エポキシ樹脂組成物及び電子部品 |
| JP6196138B2 (ja) | 2013-11-29 | 2017-09-13 | ナミックス株式会社 | 半導体封止剤および半導体装置 |
| JP6038236B2 (ja) * | 2015-06-17 | 2016-12-07 | 積水化学工業株式会社 | 光半導体装置用白色硬化性材料、及び光半導体装置用白色硬化性材料の製造方法 |
| EP3620481B1 (en) | 2017-05-31 | 2024-03-27 | Resonac Corporation | Liquid resin composition for sealing and electronic component apparatus |
-
2022
- 2022-06-20 WO PCT/JP2022/024511 patent/WO2023062877A1/ja not_active Ceased
- 2022-06-20 JP JP2023554254A patent/JPWO2023062877A1/ja active Pending
- 2022-06-20 KR KR1020237043485A patent/KR20240081446A/ko active Pending
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