JPWO2022071404A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022071404A5
JPWO2022071404A5 JP2021568419A JP2021568419A JPWO2022071404A5 JP WO2022071404 A5 JPWO2022071404 A5 JP WO2022071404A5 JP 2021568419 A JP2021568419 A JP 2021568419A JP 2021568419 A JP2021568419 A JP 2021568419A JP WO2022071404 A5 JPWO2022071404 A5 JP WO2022071404A5
Authority
JP
Japan
Prior art keywords
liquid crystal
crystal display
compound
sealant
content
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021568419A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022071404A1 (https=
JP7151003B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/035891 external-priority patent/WO2022071404A1/ja
Publication of JPWO2022071404A1 publication Critical patent/JPWO2022071404A1/ja
Publication of JPWO2022071404A5 publication Critical patent/JPWO2022071404A5/ja
Application granted granted Critical
Publication of JP7151003B2 publication Critical patent/JP7151003B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021568419A 2020-09-30 2021-09-29 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子 Active JP7151003B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020166192 2020-09-30
JP2020166192 2020-09-30
PCT/JP2021/035891 WO2022071404A1 (ja) 2020-09-30 2021-09-29 液晶表示素子用シール剤、上下導通材料、及び、液晶表示素子

Publications (3)

Publication Number Publication Date
JPWO2022071404A1 JPWO2022071404A1 (https=) 2022-04-07
JPWO2022071404A5 true JPWO2022071404A5 (https=) 2022-09-20
JP7151003B2 JP7151003B2 (ja) 2022-10-11

Family

ID=80950584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021568419A Active JP7151003B2 (ja) 2020-09-30 2021-09-29 液晶滴下工法用シール剤、上下導通材料、及び、液晶表示素子

Country Status (5)

Country Link
JP (1) JP7151003B2 (https=)
KR (1) KR102924703B1 (https=)
CN (1) CN115867590A (https=)
TW (1) TWI888653B (https=)
WO (1) WO2022071404A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202313920A (zh) * 2021-06-03 2023-04-01 日商積水化學工業股份有限公司 液晶顯示元件用密封劑及液晶顯示元件

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4521887B2 (ja) * 1997-03-28 2010-08-11 日本化薬株式会社 液晶シール剤及び液晶セル
JPH1197588A (ja) * 1997-09-16 1999-04-09 Toshiba Chem Corp 液状封止用樹脂組成物
JP2001100224A (ja) * 1999-09-28 2001-04-13 Mitsui Chemicals Inc 液晶表示セル用シール材組成物
JP3583326B2 (ja) 1999-11-01 2004-11-04 協立化学産業株式会社 Lcdパネルの滴下工法用シール剤
KR100906926B1 (ko) 2001-05-16 2009-07-10 세키스이가가쿠 고교가부시키가이샤 경화성 수지 조성물, 표시 소자용 시일제 및 표시 소자용주입구 밀봉제
TWI453512B (zh) * 2006-08-04 2014-09-21 Mitsui Chemicals Inc 液晶密封劑、使用其之液晶顯示面板的製造方法及液晶顯示面板
US7993751B2 (en) * 2007-02-07 2011-08-09 Air Products And Chemicals, Inc. Alkylated aminopropylated methylene-di-(cyclohexylamine) and uses thereof
JP5424411B2 (ja) * 2010-04-28 2014-02-26 三井化学株式会社 液晶表示パネルの製造方法および液晶表示パネル
JP5986987B2 (ja) * 2011-03-28 2016-09-06 三井化学株式会社 液晶シール剤、それを用いた液晶表示パネルの製造方法、および液晶表示パネル
JP5969492B2 (ja) * 2011-10-24 2016-08-17 日本化薬株式会社 液晶シール剤及びそれを用いた液晶表示セル
WO2016074184A1 (en) * 2014-11-13 2016-05-19 Ablestik (Shanghai) Ltd. Thermally curable sealant composition and use thereof
KR20180075431A (ko) * 2015-10-26 2018-07-04 세키스이가가쿠 고교가부시키가이샤 액정 표시 소자용 시일제, 상하 도통 재료 및 액정 표시 소자
TWI707946B (zh) * 2016-01-07 2020-10-21 日商積水化學工業股份有限公司 液晶顯示元件用密封劑、上下導通材料及液晶顯示元件
KR102594919B1 (ko) * 2017-11-29 2023-10-27 교리쯔 가가꾸 산교 가부시키가이샤 경화성 수지 조성물 및 그의 제조 방법

Similar Documents

Publication Publication Date Title
CN105368063B (zh) 一种贮存稳定的单组份脱醇型室温硫化硅橡胶
JP2009009107A5 (https=)
JP2017222881A5 (https=)
JPWO2022071404A5 (https=)
US20190031689A1 (en) Alpha-silane coupling agent and application thereof
KR102780156B1 (ko) 수지 조성물
CN109824899A (zh) 一种线性结构的含硼有机硅增粘剂及其制备方法
TW200801062A (en) Epoxy resin molding material for sealing and device of electronic part
US8426614B2 (en) Epoxy compound and process for producing the epoxy compound
CN104497906B (zh) 一种用于加成型硅橡胶的含硼增粘剂及其制备方法
CN105339348A (zh) 含硫醚的(甲基)丙烯酸酯衍生物及含有该衍生物的贴附性改善剂
JP2024144537A5 (https=)
CN109020919B (zh) 一种制备药用活性化合物n-取代苯并噻嗪-4-酮的方法
TW200628508A (en) Radiation curable resin, liquid crystal sealing material, and liquid crystal display cell using same
JP6092103B2 (ja) 液晶シール剤及びそれを用いた液晶表示セル
CN103570918B (zh) 一种二聚酸缩水甘油酯的合成方法
US11767288B2 (en) Method for producing amine through reduction of amide
TW201945376A (zh) 具有酮亞胺(ketimine)結構的有機矽化合物之製造方法
JPWO2022071116A5 (https=)
JP2008056857A5 (https=)
CN111484821A (zh) 一种继电器用低温快速固化环氧树脂胶黏剂及其制法
CN114874255A (zh) 含硅环氧化合物及其组合物
JP2006016370A (ja) シラン化合物
JPWO2023068109A5 (https=)
JPH04348120A (ja) 封止用エポキシ樹脂組成物