JP5969492B2 - 液晶シール剤及びそれを用いた液晶表示セル - Google Patents
液晶シール剤及びそれを用いた液晶表示セル Download PDFInfo
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- JP5969492B2 JP5969492B2 JP2013540738A JP2013540738A JP5969492B2 JP 5969492 B2 JP5969492 B2 JP 5969492B2 JP 2013540738 A JP2013540738 A JP 2013540738A JP 2013540738 A JP2013540738 A JP 2013540738A JP 5969492 B2 JP5969492 B2 JP 5969492B2
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- Prior art keywords
- liquid crystal
- component
- ether
- crystal sealant
- sealant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004973 liquid crystal related substance Substances 0.000 title claims description 177
- 239000000565 sealant Substances 0.000 title claims description 89
- 229920003986 novolac Polymers 0.000 claims description 47
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 41
- 238000007789 sealing Methods 0.000 claims description 35
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 33
- 239000003795 chemical substances by application Substances 0.000 claims description 33
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 13
- 239000007822 coupling agent Substances 0.000 claims description 13
- 125000000217 alkyl group Chemical group 0.000 claims description 10
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 10
- 239000011256 inorganic filler Substances 0.000 claims description 9
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 9
- 239000003960 organic solvent Substances 0.000 claims description 9
- 125000005843 halogen group Chemical group 0.000 claims description 7
- GDXHBFHOEYVPED-UHFFFAOYSA-N 1-(2-butoxyethoxy)butane Chemical compound CCCCOCCOCCCC GDXHBFHOEYVPED-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 125000003545 alkoxy group Chemical group 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 6
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 5
- OJURWUUOVGOHJZ-UHFFFAOYSA-N methyl 2-[(2-acetyloxyphenyl)methyl-[2-[(2-acetyloxyphenyl)methyl-(2-methoxy-2-oxoethyl)amino]ethyl]amino]acetate Chemical compound C=1C=CC=C(OC(C)=O)C=1CN(CC(=O)OC)CCN(CC(=O)OC)CC1=CC=CC=C1OC(C)=O OJURWUUOVGOHJZ-UHFFFAOYSA-N 0.000 claims description 5
- UYAAVKFHBMJOJZ-UHFFFAOYSA-N diimidazo[1,3-b:1',3'-e]pyrazine-5,10-dione Chemical compound O=C1C2=CN=CN2C(=O)C2=CN=CN12 UYAAVKFHBMJOJZ-UHFFFAOYSA-N 0.000 claims description 4
- 229940116423 propylene glycol diacetate Drugs 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 3
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 59
- 210000004027 cell Anatomy 0.000 description 32
- -1 polyphenol compounds Chemical class 0.000 description 29
- 238000000034 method Methods 0.000 description 24
- 239000011521 glass Substances 0.000 description 23
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 22
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 21
- 229920005989 resin Polymers 0.000 description 20
- 239000011347 resin Substances 0.000 description 20
- 238000001723 curing Methods 0.000 description 16
- 150000002989 phenols Chemical class 0.000 description 14
- 229920001187 thermosetting polymer Polymers 0.000 description 14
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 13
- 238000004519 manufacturing process Methods 0.000 description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 10
- 150000001896 cresols Chemical class 0.000 description 9
- 239000004210 ether based solvent Substances 0.000 description 9
- 238000002347 injection Methods 0.000 description 9
- 239000007924 injection Substances 0.000 description 9
- 239000002904 solvent Substances 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 7
- 150000004780 naphthols Chemical class 0.000 description 7
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical class CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 6
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical class CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 6
- 239000003365 glass fiber Substances 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 5
- 125000003983 fluorenyl group Chemical group C1(=CC=CC=2C3=CC=CC=C3CC12)* 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- OVSKIKFHRZPJSS-UHFFFAOYSA-N 2,4-D Chemical compound OC(=O)COC1=CC=C(Cl)C=C1Cl OVSKIKFHRZPJSS-UHFFFAOYSA-N 0.000 description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 4
- 229910052801 chlorine Inorganic materials 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 4
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 235000012239 silicon dioxide Nutrition 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000000460 chlorine Substances 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 210000002858 crystal cell Anatomy 0.000 description 3
- 229910002026 crystalline silica Inorganic materials 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 239000005350 fused silica glass Substances 0.000 description 3
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 238000013021 overheating Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- SZNYYWIUQFZLLT-UHFFFAOYSA-N 2-methyl-1-(2-methylpropoxy)propane Chemical compound CC(C)COCC(C)C SZNYYWIUQFZLLT-UHFFFAOYSA-N 0.000 description 2
- DWXQOBVEPSJMOR-UHFFFAOYSA-N 2-methyl-2-pentyloctanoic acid Chemical compound CCCCCCC(C)(C(O)=O)CCCCC DWXQOBVEPSJMOR-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 2
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N COc1ccccc1 Chemical compound COc1ccccc1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- UDSFAEKRVUSQDD-UHFFFAOYSA-N Dimethyl adipate Chemical compound COC(=O)CCCCC(=O)OC UDSFAEKRVUSQDD-UHFFFAOYSA-N 0.000 description 2
- MUXOBHXGJLMRAB-UHFFFAOYSA-N Dimethyl succinate Chemical compound COC(=O)CCC(=O)OC MUXOBHXGJLMRAB-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 239000007983 Tris buffer Substances 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000000378 calcium silicate Substances 0.000 description 2
- 229910052918 calcium silicate Inorganic materials 0.000 description 2
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 2
- 239000004927 clay Substances 0.000 description 2
- 229910052570 clay Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 2
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 2
- XTDYIOOONNVFMA-UHFFFAOYSA-N dimethyl pentanedioate Chemical compound COC(=O)CCCC(=O)OC XTDYIOOONNVFMA-UHFFFAOYSA-N 0.000 description 2
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N ethylene glycol monomethyl ether acetate Natural products COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- 238000005562 fading Methods 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 125000000623 heterocyclic group Chemical group 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- 239000012766 organic filler Substances 0.000 description 2
- 229940079877 pyrogallol Drugs 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 238000001029 thermal curing Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 125000006839 xylylene group Chemical group 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- SHGXHGZIIHQAMC-UHFFFAOYSA-N (3-ethoxy-3-methylbutyl) acetate Chemical compound CCOC(C)(C)CCOC(C)=O SHGXHGZIIHQAMC-UHFFFAOYSA-N 0.000 description 1
- RYNQKSJRFHJZTK-UHFFFAOYSA-N (3-methoxy-3-methylbutyl) acetate Chemical compound COC(C)(C)CCOC(C)=O RYNQKSJRFHJZTK-UHFFFAOYSA-N 0.000 description 1
- FMENPNOHVHBSHB-UHFFFAOYSA-N (3-methyl-3-propan-2-yloxybutyl) acetate Chemical compound CC(C)OC(C)(C)CCOC(C)=O FMENPNOHVHBSHB-UHFFFAOYSA-N 0.000 description 1
- RMECUHKQCCRYIN-UHFFFAOYSA-N (3-methyl-3-propoxybutyl) acetate Chemical compound CCCOC(C)(C)CCOC(C)=O RMECUHKQCCRYIN-UHFFFAOYSA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- 125000000229 (C1-C4)alkoxy group Chemical group 0.000 description 1
- IUGPRERXXKWPFI-UHFFFAOYSA-N 1,2-di(propan-2-yloxy)propane Chemical compound CC(C)OCC(C)OC(C)C IUGPRERXXKWPFI-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- VPBZZPOGZPKYKX-UHFFFAOYSA-N 1,2-diethoxypropane Chemical compound CCOCC(C)OCC VPBZZPOGZPKYKX-UHFFFAOYSA-N 0.000 description 1
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- PVMMVWNXKOSPRB-UHFFFAOYSA-N 1,2-dipropoxypropane Chemical compound CCCOCC(C)OCCC PVMMVWNXKOSPRB-UHFFFAOYSA-N 0.000 description 1
- CTWLEVBNYXGONT-UHFFFAOYSA-N 1,3-diethoxy-3-methylbutane Chemical compound CCOCCC(C)(C)OCC CTWLEVBNYXGONT-UHFFFAOYSA-N 0.000 description 1
- QFZHLUALUIUUDW-UHFFFAOYSA-N 1,3-dimethoxy-3-methylbutane Chemical compound COCCC(C)(C)OC QFZHLUALUIUUDW-UHFFFAOYSA-N 0.000 description 1
- QMGJMGFZLXYHCR-UHFFFAOYSA-N 1-(2-butoxypropoxy)butane Chemical compound CCCCOCC(C)OCCCC QMGJMGFZLXYHCR-UHFFFAOYSA-N 0.000 description 1
- MWGRRMQNSQNFID-UHFFFAOYSA-N 1-(2-methylpropoxy)propan-2-ol Chemical compound CC(C)COCC(C)O MWGRRMQNSQNFID-UHFFFAOYSA-N 0.000 description 1
- PQSCDZCQPMZHQH-UHFFFAOYSA-N 1-(2-methylpropoxy)propan-2-yl acetate Chemical compound CC(C)COCC(C)OC(C)=O PQSCDZCQPMZHQH-UHFFFAOYSA-N 0.000 description 1
- HQSLKNLISLWZQH-UHFFFAOYSA-N 1-(2-propoxyethoxy)propane Chemical compound CCCOCCOCCC HQSLKNLISLWZQH-UHFFFAOYSA-N 0.000 description 1
- JEIHSRORUWXJGF-UHFFFAOYSA-N 1-[(2-methylpropan-2-yl)oxy]propan-2-yl acetate Chemical compound CC(=O)OC(C)COC(C)(C)C JEIHSRORUWXJGF-UHFFFAOYSA-N 0.000 description 1
- KZVBBTZJMSWGTK-UHFFFAOYSA-N 1-[2-(2-butoxyethoxy)ethoxy]butane Chemical compound CCCCOCCOCCOCCCC KZVBBTZJMSWGTK-UHFFFAOYSA-N 0.000 description 1
- UOWSVNMPHMJCBZ-UHFFFAOYSA-N 1-[2-(2-butoxypropoxy)propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCCCC UOWSVNMPHMJCBZ-UHFFFAOYSA-N 0.000 description 1
- BOGFHOWTVGAYFK-UHFFFAOYSA-N 1-[2-(2-propoxyethoxy)ethoxy]propane Chemical compound CCCOCCOCCOCCC BOGFHOWTVGAYFK-UHFFFAOYSA-N 0.000 description 1
- KTSVVTQTKRGWGU-UHFFFAOYSA-N 1-[2-[2-(2-butoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOCCCC KTSVVTQTKRGWGU-UHFFFAOYSA-N 0.000 description 1
- OHRSSDYDJRJIMN-UHFFFAOYSA-N 1-[2-[2-(2-butoxypropoxy)propoxy]propoxy]butane Chemical compound CCCCOCC(C)OCC(C)OCC(C)OCCCC OHRSSDYDJRJIMN-UHFFFAOYSA-N 0.000 description 1
- DSPIZZQMSHIZLS-UHFFFAOYSA-N 1-[2-[2-(2-propoxyethoxy)ethoxy]ethoxy]propane Chemical compound CCCOCCOCCOCCOCCC DSPIZZQMSHIZLS-UHFFFAOYSA-N 0.000 description 1
- KJOVIRMWPFJSTR-UHFFFAOYSA-N 1-butan-2-yloxypropan-2-ol Chemical compound CCC(C)OCC(C)O KJOVIRMWPFJSTR-UHFFFAOYSA-N 0.000 description 1
- HZYHBQLFAGLGQU-UHFFFAOYSA-N 1-butan-2-yloxypropan-2-yl acetate Chemical compound CCC(C)OCC(C)OC(C)=O HZYHBQLFAGLGQU-UHFFFAOYSA-N 0.000 description 1
- XPBHKQLGOLBNHQ-UHFFFAOYSA-N 1-butoxy-3-methyl-3-[(2-methylpropan-2-yl)oxy]butane Chemical compound CCCCOCCC(C)(C)OC(C)(C)C XPBHKQLGOLBNHQ-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- KIAMPLQEZAMORJ-UHFFFAOYSA-N 1-ethoxy-2-[2-(2-ethoxyethoxy)ethoxy]ethane Chemical compound CCOCCOCCOCCOCC KIAMPLQEZAMORJ-UHFFFAOYSA-N 0.000 description 1
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- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000013112 stability test Methods 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
- GFQYVLUOOAAOGM-UHFFFAOYSA-N zirconium(iv) silicate Chemical compound [Zr+4].[O-][Si]([O-])([O-])[O-] GFQYVLUOOAAOGM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
- C08G59/184—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents with amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/508—Amines heterocyclic containing only nitrogen as a heteroatom having three nitrogen atoms in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K2200/00—Chemical nature of materials in mouldable or extrudable form for sealing or packing joints or covers
- C09K2200/06—Macromolecular organic compounds, e.g. prepolymers
- C09K2200/0645—Macromolecular organic compounds, e.g. prepolymers obtained otherwise than by reactions involving carbon-to-carbon unsaturated bonds
- C09K2200/0647—Polyepoxides
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Liquid Crystal (AREA)
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
Description
例えば、特許文献1には接着性、耐湿信頼性、可撓性に優れる熱硬化型液晶シール剤が開示されている。
特許文献2には接着性、耐湿信頼性、可撓性、熱硬化性に優れる熱硬化型液晶シール剤が開示されている。
特許文献3にはスクリーン印刷性、耐湿信頼性に優れる熱硬化型液晶シール剤が開示されている。
特許文献4には高温時に強い接着強度を有する熱硬化型液晶シール剤が開示されている。
1)
(a)フェノールノボラック樹脂、(b)2,4−ジアミノ−6−[2’−メチルイミダゾリル−(1’)]−エチル−s−トリアジンイソシアヌル酸付加物及びエポキシ樹脂アミンアダクトから選ばれる少なくとも1種、及び(c)エポキシ樹脂を含有し、120℃におけるゲルタイムが100秒以上270秒以下である液晶シール剤。
2)
上記成分(b)の含有量が上記成分(a)の含有量に対して38質量%以上70質量%以下である上記1)に記載の液晶シール剤。
3)
上記成分(a)が、軟化点が75℃以下のフェノールノボラック樹脂である上記1)又は2)に記載の液晶シール剤。
4)
上記成分(a)が、下記式(1)で表される化合物である上記1)乃至3)のいずれか一項に記載の液晶シール剤。
5)
上記成分(c)が、ビスフェノールA型エポキシ樹脂である上記1)乃至4)のいずれか一項に記載の液晶シール剤。
6)
更に、(d)カップリング剤を含有する上記1)乃至5)のいずれか一項に記載の液晶シール剤。
7)
上記成分(d)が、アミノシランカップリング剤である上記6)に記載の液晶シール剤。
8)
更に、(e)有機溶剤を含有する上記1)乃至7)のいずれか一項に記載の液晶シール剤。
9)
上記成分(e)が、二塩基酸ジメチルエステル、プロピレングリコールジアセテート、プロピレングリコールモノエチルエーテルアセテート、及びエチレングリコールジブチルエーテルからなる群から選択される1又は2以上の有機溶剤である上記8)に記載の液晶シール剤。
10)
更に、(f)無機充填剤を含有する上記1)乃至9)のいずれか一項に記載の液晶シール剤。
11)
上記1)乃至10)のいずれか一項に記載の液晶シール剤を硬化して得られる硬化物でシールされた液晶表示セル。
具体的には、PN−152(日本化薬株式会社製)等が市販品として市場から入手が容易である。
カップリング剤(d)の液晶シール剤に占める含有量は、本発明の液晶シール剤の総量を100質量部とした場合、0.05〜3質量部が好適である。
このようにして得られた本発明の液晶表示セルは、接着性、可撓性に優れるため、落下等の衝撃には非常に強いものである。また、耐湿信頼性に優れたものでもある。スペーサーとしては、例えばグラスファイバー、シリカビーズ、ポリマービーズ等が挙げられる。その直径は、目的に応じ異なるが、通常2〜8μm、好ましくは4〜7μmである。その使用量は、本発明の液晶シール剤100質量部に対し、通常0.1〜4質量部、好ましくは0.5〜2質量部、より好ましくは0.9〜1.5質量部程度である。
下記表1に示す割合で各樹脂成分(成分(a)、成分(c))及び有機溶剤(成分(e))を混合し、加熱溶解した。室温まで冷却後、カップリング剤(成分(d))、無機充填剤(成分(f))等を適宜添加し、硬化促進剤(成分(b))を添加し、3本ロールにて均一に混合し金属メッシュで濾過し、実施例1〜5の液晶シール剤を調製した。また、同様にして、比較例1〜4の液晶シール剤を調製した。なお、表中括弧内、成分(b)について、括弧内に記載した数値は、成分(b)の成分(a)に対する量を表す。
自動ゲル化テスタ(伊予電子製)を使用し、測定温度120℃雰囲気下にて、調製した液晶シール剤を測定部に0.4mL入れ、取り付けたテフロン(登録商標)製ニードルを自転部300rpmにて回転させてシール剤を撹拌し、トルクセンサーが70gcmのトルクを検出するまでの時間をゲルタイムとした。結果を表1に示す。
E型粘度計(VISCONIC EHD型、コーン3°×R14:東京精機株式会社製)にて25℃、10rpmの粘度を測定した。結果を表1に示す。
E型粘度計(VISCONIC EHD型、コーン3°×R14:東京精機株式会社製)にて25℃での、10rpm及び1rpmの粘度を測定し、1rpmの粘度/10rpmの粘度の値をチクソ比とした。結果を表1に示す。
調製した液晶シール剤を25℃雰囲気に48時間保管したものをE型粘度計(VISCONIC EHD型、コーン3°×R14:東京精機株式会社製)にて25℃、10rpmの粘度を測定し、初期粘度からの増粘度を算出し、48時間後の増粘率とした(計算式は、{(48時間後の粘度−初期粘度)/(初期粘度)}×100とした)。結果を表1に示す。
洗浄した1.5cm×3cmのガラス基板に、5μmのガラスファイバー(PF−50S:日本電気硝子株式会社製)を液晶シール剤に対して1質量%添加した液晶シール剤を、5μmの厚さに潰したときの直径が0.8〜1.2mmになるように塗布した。90℃設定のホットプレートにて10分間予備加熱を行い、対向基板として、洗浄した1.5cm×3cmのガラス基板を十字の形にて貼り合わせ、バインダークリップNo.155(ライオン事務機器製)にて2箇所をとめ、基板を固定させた。150℃設定の電気乾燥機にこの試験片を1時間投入して液晶シール剤を硬化した後、室温まで冷却した。ボンドテスター(SS−30WD:西進商事製)の引っ張りモードにて3.3mm/秒の速度にて引っ張り方向の強度を測定した。強度をシールの単位面積当たりに換算し、接着強度とした。結果を表1に示す。
8cm×8cm、厚さ0.7mmのガラス基板の中央部に、5μmのガラスファイバー(PF−50S:日本電気硝子株式会社製)を液晶シール剤に対して1質量%添加した液晶シール剤を、断面積5000μm2にて一辺4cmのコの字型のパターンをディスペンサーにて塗布した。90℃に設定した電気乾燥機にて10分間予備加熱を行った。室温に戻したガラス基板に、1質量%のグラスファイバー(PF−50S:日本電気硝子株式会社製)を添加したUV硬化型液晶シール剤(KAYATORON HM−1400:日本化薬株式会社製)を、断面積10000μm2にて一辺7cmの正方形のパターンでディスペンサーにて塗布した。このガラス基板に対し、ナトコ株式会社製ナトコスペーサーKSEB−525Fを塗布した8cm×8cm、厚さ0.7mmのガラス基板を対向基板として、真空貼り合わせ装置にて7Paの気圧下にて貼り合わせを行った。大気圧下にした後、UV照射し、外側のUV硬化型液晶シール剤を硬化させ、150℃設定の電気乾燥機に7分間放置し、シール剤のギャップ形成を行った。ガラスカッターを用いてガラス基板のコーナー部分を、UV硬化型液晶シール剤の一部も併せて切断し、UV硬化型液晶シール剤の内部を大気圧にした。切断部分を株式会社EHC製封口剤UV−RESIN LCB−610にて封口し、UVを照射して、封口剤を硬化させた。150℃設定の電気乾燥機に60分間投入し、基板内の残存エアを膨張させて、調製した液晶シール剤に応力をかけた。基板を室温に冷却後、基板の液晶シール剤部分を光学顕微鏡にて観察した。観察結果について、以下基準によって評価した。評価結果を表1に示す。
◎・・・シール部分に剥がれや微小気泡がない。
○・・・液晶シール剤のコーナー部分に微小気泡がシール幅に対して20%未満の範囲で観察される。
△・・・液晶シール剤のコーナー部分や直線部分に微小気泡がシール幅に対して30%未満の範囲で観察される。
×・・・液晶シール剤のコーナー部分や直線部分に剥がれがあるか、微小気泡がシール幅に対して30%以上の範囲で観察される。
調製した液晶シール剤を、スクリーン印刷機(LS−150:ニューロング精密工業株式回社製)にてガラス基板に印刷塗布した。これを目視にて確認した。かすれ、液晶シール剤の切れ等の有無を観察した。評価の基準は以下による。結果を表1に示す。
○・・・かすれ、切れが無い。
×・・・かすれ、切れが有る。
調製した液晶シール剤をシリンジに充填・脱泡した後、ディスペンサー(ショットマスター300:武蔵エンジニアリング社製)にてガラス基板上に30mm/secで塗布し、形状を目視にて確認した。かすれ、液晶シール剤の切れ等の有無を観察した。評価の基準は以下による。結果を表1に示す。
○・・・かすれ、切れが無い。
×・・・かすれ、切れが有る。
10mLサンプル瓶の底に調製した液晶シール剤を100mg程度均一に塗布した後、90℃に設定した電気乾燥機にて10分間溶剤乾燥(プリキュア)を行った。その後150℃に設定した電気乾燥機にて60分間硬化した。室温に冷却後、液晶(MLC−6866−100:メルク株式会社製)を液晶シール剤の10倍量加えた。90℃設定の電気乾燥機にて24時間加熱した後、30分間冷却した。それぞれの上澄みをデカンテーションにて分け取り、デジタル超高抵抗計(R8340:株式会社アドバンテスト製)にて比抵抗値を測定した。評価の基準は以下による。結果を表1に示す。
○・・・比抵抗値が1.0×10E+12以上
×・・・比抵抗値が1.0×10E+12未満
なお、比抵抗値の「1.0E+12」は「1.0×1012」を表し、他の記載も同様である。
5cm×7cmのガラス基板上に調製した液晶シール剤を25μmのクリアランスのアプリケーターを使用して塗布した。90℃に設定した電気乾燥機にて10分間溶剤乾燥を行い、150℃に設定した電気乾燥機にて60分間硬化させた。60℃90%に設定した恒温恒湿槽(HPAV−80−20:いすゞ製作所)に24時間投入後室温にて冷却した液晶シール剤と硬化直後の液晶シール剤との重量変化から吸水率を算出した。算出式は{(吸水後の液晶シール剤重量−吸水前の液晶シール剤重量)/(吸水前の液晶シール剤重量)}×100とした。結果を表1に示す。
Claims (11)
- (a)フェノールノボラック樹脂、(b)2,4−ジアミノ−6−[2’−メチルイミダゾリル−(1’)]−エチル−s−トリアジンイソシアヌル酸付加物及びエポキシ樹脂アミンアダクトから選ばれる少なくとも1種、及び(c)エポキシ樹脂を含有し、120℃におけるゲルタイムが100秒以上270秒以下である液晶シール剤。
- 前記成分(b)の含有量が前記成分(a)の含有量に対して38質量%以上70質量%以下である請求項1に記載の液晶シール剤。
- 前記成分(a)が、軟化点が75℃以下のフェノールノボラック樹脂である請求項1又は2に記載の液晶シール剤。
- 前記成分(c)が、ビスフェノールA型エポキシ樹脂である請求項1乃至4のいずれか一項に記載の液晶シール剤。
- 更に、(d)カップリング剤を含有する請求項1乃至5のいずれか一項に記載の液晶シール剤。
- 前記成分(d)が、アミノシランカップリング剤である請求項6に記載の液晶シール剤。
- 更に、(e)有機溶剤を含有する請求項1乃至7のいずれか一項に記載の液晶シール剤。
- 前記成分(e)が、二塩基酸ジメチルエステル、プロピレングリコールジアセテート、プロピレングリコールモノエチルエーテルアセテート、及びエチレングリコールジブチルエーテルからなる群から選択される1又は2以上の有機溶剤である請求項8に記載の液晶シール剤。
- 更に、(f)無機充填剤を含有する請求項1乃至9のいずれか一項に記載の液晶シール剤。
- 請求項1乃至10のいずれか一項に記載の液晶シール剤を硬化して得られる硬化物でシールされた液晶表示セル。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011233105 | 2011-10-24 | ||
JP2011233105 | 2011-10-24 | ||
PCT/JP2012/076801 WO2013061837A1 (ja) | 2011-10-24 | 2012-10-17 | 液晶シール剤及びそれを用いた液晶表示セル |
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