JPWO2022249397A5 - - Google Patents
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- JPWO2022249397A5 JPWO2022249397A5 JP2021576486A JP2021576486A JPWO2022249397A5 JP WO2022249397 A5 JPWO2022249397 A5 JP WO2022249397A5 JP 2021576486 A JP2021576486 A JP 2021576486A JP 2021576486 A JP2021576486 A JP 2021576486A JP WO2022249397 A5 JPWO2022249397 A5 JP WO2022249397A5
- Authority
- JP
- Japan
- Prior art keywords
- region
- semiconductor device
- trench
- layer
- cell region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/020212 WO2022249397A1 (ja) | 2021-05-27 | 2021-05-27 | 半導体装置及び電力変換装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP7062143B1 JP7062143B1 (ja) | 2022-05-02 |
| JPWO2022249397A1 JPWO2022249397A1 (https=) | 2022-12-01 |
| JPWO2022249397A5 true JPWO2022249397A5 (https=) | 2023-05-02 |
Family
ID=81452704
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021576486A Active JP7062143B1 (ja) | 2021-05-27 | 2021-05-27 | 半導体装置及び電力変換装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240194780A1 (https=) |
| JP (1) | JP7062143B1 (https=) |
| CN (1) | CN117355945A (https=) |
| DE (1) | DE112021007715T5 (https=) |
| WO (1) | WO2022249397A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7682970B2 (ja) * | 2023-10-05 | 2025-05-26 | 株式会社東芝 | 半導体装置及び製造方法 |
| TWI901330B (zh) * | 2024-09-03 | 2025-10-11 | 世界先進積體電路股份有限公司 | 半導體結構及其形成方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4500639B2 (ja) | 2004-09-24 | 2010-07-14 | トヨタ自動車株式会社 | トレンチゲート型半導体装置およびその製造方法 |
| JP5772842B2 (ja) * | 2013-01-31 | 2015-09-02 | 株式会社デンソー | 炭化珪素半導体装置 |
| CN111712926B (zh) * | 2018-02-19 | 2024-02-02 | 三菱电机株式会社 | 碳化硅半导体装置 |
| WO2021014570A1 (ja) * | 2019-07-23 | 2021-01-28 | 三菱電機株式会社 | 炭化珪素半導体装置、電力変換装置および炭化珪素半導体装置の製造方法 |
| JP7257927B2 (ja) * | 2019-09-19 | 2023-04-14 | 三菱電機株式会社 | 半導体装置 |
-
2021
- 2021-05-27 WO PCT/JP2021/020212 patent/WO2022249397A1/ja not_active Ceased
- 2021-05-27 US US18/287,650 patent/US20240194780A1/en active Pending
- 2021-05-27 JP JP2021576486A patent/JP7062143B1/ja active Active
- 2021-05-27 CN CN202180098497.3A patent/CN117355945A/zh active Pending
- 2021-05-27 DE DE112021007715.5T patent/DE112021007715T5/de active Pending
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