JPWO2022230292A5 - - Google Patents
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- JPWO2022230292A5 JPWO2022230292A5 JP2023517065A JP2023517065A JPWO2022230292A5 JP WO2022230292 A5 JPWO2022230292 A5 JP WO2022230292A5 JP 2023517065 A JP2023517065 A JP 2023517065A JP 2023517065 A JP2023517065 A JP 2023517065A JP WO2022230292 A5 JPWO2022230292 A5 JP WO2022230292A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pad electrodes
- section
- capacitance
- capacitor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021077975 | 2021-04-30 | ||
| JP2021077975 | 2021-04-30 | ||
| PCT/JP2022/004901 WO2022230292A1 (ja) | 2021-04-30 | 2022-02-08 | 固体撮像装置、電子機器および移動体 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022230292A1 JPWO2022230292A1 (https=) | 2022-11-03 |
| JPWO2022230292A5 true JPWO2022230292A5 (https=) | 2025-02-07 |
| JP7797491B2 JP7797491B2 (ja) | 2026-01-13 |
Family
ID=83848271
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023517065A Active JP7797491B2 (ja) | 2021-04-30 | 2022-02-08 | 固体撮像装置、電子機器および移動体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240205565A1 (https=) |
| EP (1) | EP4333422A4 (https=) |
| JP (1) | JP7797491B2 (https=) |
| CN (1) | CN117083873A (https=) |
| WO (1) | WO2022230292A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024202675A1 (ja) * | 2023-03-31 | 2024-10-03 | ソニーセミコンダクタソリューションズ株式会社 | 測距装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5426069A (en) * | 1992-04-09 | 1995-06-20 | Dalsa Inc. | Method for making silicon-germanium devices using germanium implantation |
| US5386128A (en) * | 1994-01-21 | 1995-01-31 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Monolithic in-based III-V compound semiconductor focal plane array cell with single stage CCD output |
| JP4317115B2 (ja) * | 2004-04-12 | 2009-08-19 | 国立大学法人東北大学 | 固体撮像装置、光センサおよび固体撮像装置の動作方法 |
| US20090122173A1 (en) * | 2007-11-13 | 2009-05-14 | William Emerson Tennant | Low noise readout apparatus and method for cmos image sensors |
| JP5028545B2 (ja) * | 2012-01-16 | 2012-09-19 | キヤノン株式会社 | 撮像装置、放射線撮像装置及びそれを用いた放射線撮像システム |
| JP6176990B2 (ja) * | 2013-04-25 | 2017-08-09 | オリンパス株式会社 | 固体撮像装置および撮像装置 |
| JP6780421B2 (ja) | 2016-03-01 | 2020-11-04 | ソニー株式会社 | 撮像素子、積層型撮像素子及び固体撮像装置、並びに、固体撮像装置の駆動方法 |
| JP6929643B2 (ja) | 2016-12-27 | 2021-09-01 | キヤノン株式会社 | 撮像装置および撮像システム |
| CN108878462B (zh) * | 2017-05-12 | 2023-08-15 | 松下知识产权经营株式会社 | 摄像装置及照相机系统 |
| JP7072362B2 (ja) * | 2017-09-26 | 2022-05-20 | ブリルニクス シンガポール プライベート リミテッド | 固体撮像装置、固体撮像装置の駆動方法、および電子機器 |
| US10893222B2 (en) * | 2018-03-29 | 2021-01-12 | Panasonic Intellectual Property Management Co., Ltd. | Imaging device and camera system, and driving method of imaging device |
| KR102618358B1 (ko) * | 2019-06-05 | 2023-12-28 | 삼성전자주식회사 | 이미지 센서 |
| JP2021005656A (ja) * | 2019-06-26 | 2021-01-14 | ソニーセミコンダクタソリューションズ株式会社 | 半導体装置及びその製造方法 |
| JP2021077975A (ja) | 2019-11-07 | 2021-05-20 | ソニー株式会社 | 無線端末、サーバおよび無線通信システム |
-
2022
- 2022-02-08 EP EP22795215.7A patent/EP4333422A4/en active Pending
- 2022-02-08 CN CN202280020903.9A patent/CN117083873A/zh active Pending
- 2022-02-08 US US18/286,171 patent/US20240205565A1/en active Pending
- 2022-02-08 JP JP2023517065A patent/JP7797491B2/ja active Active
- 2022-02-08 WO PCT/JP2022/004901 patent/WO2022230292A1/ja not_active Ceased
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