JPWO2022123381A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2022123381A5
JPWO2022123381A5 JP2022567711A JP2022567711A JPWO2022123381A5 JP WO2022123381 A5 JPWO2022123381 A5 JP WO2022123381A5 JP 2022567711 A JP2022567711 A JP 2022567711A JP 2022567711 A JP2022567711 A JP 2022567711A JP WO2022123381 A5 JPWO2022123381 A5 JP WO2022123381A5
Authority
JP
Japan
Prior art keywords
emitting device
jig
control cluster
substrate
light emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2022567711A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022123381A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2021/060951 external-priority patent/WO2022123381A1/ja
Publication of JPWO2022123381A1 publication Critical patent/JPWO2022123381A1/ja
Publication of JPWO2022123381A5 publication Critical patent/JPWO2022123381A5/ja
Withdrawn legal-status Critical Current

Links

JP2022567711A 2020-12-07 2021-11-25 Withdrawn JPWO2022123381A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020202402 2020-12-07
JP2020202401 2020-12-07
PCT/IB2021/060951 WO2022123381A1 (ja) 2020-12-07 2021-11-25 発光デバイスの製造装置

Publications (2)

Publication Number Publication Date
JPWO2022123381A1 JPWO2022123381A1 (https=) 2022-06-16
JPWO2022123381A5 true JPWO2022123381A5 (https=) 2024-11-08

Family

ID=81974212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022567711A Withdrawn JPWO2022123381A1 (https=) 2020-12-07 2021-11-25

Country Status (3)

Country Link
US (1) US20230422592A1 (https=)
JP (1) JPWO2022123381A1 (https=)
WO (1) WO2022123381A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022137022A1 (ja) * 2020-12-25 2022-06-30 株式会社半導体エネルギー研究所 表示装置の製造装置

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW318258B (https=) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
JP3537591B2 (ja) * 1996-04-26 2004-06-14 パイオニア株式会社 有機elディスプレイの製造方法
US5817366A (en) * 1996-07-29 1998-10-06 Tdk Corporation Method for manufacturing organic electroluminescent element and apparatus therefor
JP3762255B2 (ja) * 2001-06-05 2006-04-05 大日本印刷株式会社 エレクトロルミネッセント素子の製造方法
TWI258317B (en) * 2002-01-25 2006-07-11 Semiconductor Energy Lab A display device and method for manufacturing thereof
JP2003264071A (ja) * 2002-03-08 2003-09-19 Ulvac Japan Ltd 有機el素子の製造方法及びその装置
JP4252317B2 (ja) * 2003-01-10 2009-04-08 株式会社半導体エネルギー研究所 蒸着装置および蒸着方法
JP4426190B2 (ja) * 2003-01-24 2010-03-03 大日本印刷株式会社 エレクトロルミネッセント素子の製造方法
US7002292B2 (en) * 2003-07-22 2006-02-21 E. I. Du Pont De Nemours And Company Organic electronic device
JP2009170282A (ja) * 2008-01-17 2009-07-30 Seiko Epson Corp 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
JP2009170336A (ja) * 2008-01-18 2009-07-30 Sony Corp 表示装置の製造方法
KR20100132517A (ko) * 2008-03-05 2010-12-17 어플라이드 머티어리얼스, 인코포레이티드 회전 모듈을 갖는 코팅 장치
EP2098608A1 (en) * 2008-03-05 2009-09-09 Applied Materials, Inc. Coating apparatus with rotation module
JP5361002B2 (ja) * 2010-09-01 2013-12-04 独立行政法人産業技術総合研究所 デバイス製造装置および方法
JP6168742B2 (ja) * 2011-09-02 2017-07-26 キヤノン株式会社 有機el装置
JP6232655B2 (ja) * 2011-09-02 2017-11-22 株式会社Joled 有機el表示パネルおよびその製造方法
TWI501861B (zh) * 2011-12-06 2015-10-01 私立中原大學 滾輪式壓印系統
WO2014116681A2 (en) * 2013-01-22 2014-07-31 Brooks Automation, Inc. Substrate transport
CN105705997B (zh) * 2013-11-08 2020-01-17 Asml荷兰有限公司 生成用于定向自组装的引导模板的方法
KR20150112348A (ko) * 2014-03-27 2015-10-07 엘지디스플레이 주식회사 복사열 반사부를 가지는 진공 챔버 및 이를 이용한 유기 발광 표시 장치의 제조 방법
US9536759B2 (en) * 2015-05-29 2017-01-03 Taiwan Semiconductor Manufacturing Co., Ltd Baking apparatus and method
WO2017130440A1 (ja) * 2016-01-26 2017-08-03 鴻海精密工業股▲ふん▼有限公司 蒸着マスク、その製造方法及びその蒸着マスクを使った有機発光ダイオードの製造方法
US20200381276A1 (en) * 2019-05-31 2020-12-03 Applied Materials, Inc. Multisubstrate process system

Similar Documents

Publication Publication Date Title
CN100517798C (zh) 显示装置的制造方法
KR100696547B1 (ko) 증착 방법
TWI607100B (zh) 沉積裝置及製造有機發光二極體顯示器的方法
JP2017504725A (ja) 低圧ツール交換を可能にする原子層堆積処理チャンバ
TW200814392A (en) Deposition apparatus
US20230374663A1 (en) Apparatus and method for processing substrate
TW202113106A (zh) 用於形成層的處理系統
KR101840976B1 (ko) 이동체 지지장치와, 이를 포함한 진공 증착 장치 및 증착 방법
TW201802999A (zh) 傳送腔室與具有其之處理系統以及對應處理基板之方法
JPWO2022123381A5 (https=)
US20100175989A1 (en) Deposition apparatus, deposition system and deposition method
CN110923633A (zh) 掩膜组件、蒸镀装置及蒸镀方法
CN116965180A (zh) 使用应变调谐的压电模板层调谐量子发射装置的发射特性
US20090246941A1 (en) Deposition apparatus, deposition system and deposition method
KR102800139B1 (ko) 기판처리방법 및 기판처리장치
JP4674848B2 (ja) 有機el素子の製造装置
JPWO2022137022A5 (https=)
JP6556802B2 (ja) 真空装置、蒸着装置及びゲートバルブ
US20090317562A1 (en) Processing system and method for processing a substrate
JP2024060790A (ja) 成膜装置
KR20190090414A (ko) 증착 장치
CN113201710A (zh) 一种掩膜板、制备及其应用
JP5658520B2 (ja) 蒸着装置
CN119947549A (zh) 基板处理方法和基板处理装置
TW202404699A (zh) 包括排氣管之基板處理設備