JPWO2022123381A1 - - Google Patents

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Publication number
JPWO2022123381A1
JPWO2022123381A1 JP2022567711A JP2022567711A JPWO2022123381A1 JP WO2022123381 A1 JPWO2022123381 A1 JP WO2022123381A1 JP 2022567711 A JP2022567711 A JP 2022567711A JP 2022567711 A JP2022567711 A JP 2022567711A JP WO2022123381 A1 JPWO2022123381 A1 JP WO2022123381A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2022567711A
Other languages
Japanese (ja)
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JPWO2022123381A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Publication of JPWO2022123381A1 publication Critical patent/JPWO2022123381A1/ja
Publication of JPWO2022123381A5 publication Critical patent/JPWO2022123381A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/811—Controlling the atmosphere during processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electroluminescent Light Sources (AREA)
JP2022567711A 2020-12-07 2021-11-25 Withdrawn JPWO2022123381A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020202402 2020-12-07
JP2020202401 2020-12-07
PCT/IB2021/060951 WO2022123381A1 (ja) 2020-12-07 2021-11-25 発光デバイスの製造装置

Publications (2)

Publication Number Publication Date
JPWO2022123381A1 true JPWO2022123381A1 (https=) 2022-06-16
JPWO2022123381A5 JPWO2022123381A5 (https=) 2024-11-08

Family

ID=81974212

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022567711A Withdrawn JPWO2022123381A1 (https=) 2020-12-07 2021-11-25

Country Status (3)

Country Link
US (1) US20230422592A1 (https=)
JP (1) JPWO2022123381A1 (https=)
WO (1) WO2022123381A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022137022A1 (ja) * 2020-12-25 2022-06-30 株式会社半導体エネルギー研究所 表示装置の製造装置

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293589A (ja) * 1996-04-26 1997-11-11 Pioneer Electron Corp 有機ｅｌディスプレイの製造方法
JP2002367775A (ja) * 2001-06-05 2002-12-20 Dainippon Printing Co Ltd エレクトロルミネッセント素子の製造方法
JP2003264071A (ja) * 2002-03-08 2003-09-19 Ulvac Japan Ltd 有機ｅｌ素子の製造方法及びその装置
JP2004217970A (ja) * 2003-01-10 2004-08-05 Semiconductor Energy Lab Co Ltd 製造装置、クリーニング方法、および再利用方法
JP2004228011A (ja) * 2003-01-24 2004-08-12 Dainippon Printing Co Ltd エレクトロルミネッセント素子の製造方法
JP2009170336A (ja) * 2008-01-18 2009-07-30 Sony Corp 表示装置の製造方法
JP2009170282A (ja) * 2008-01-17 2009-07-30 Seiko Epson Corp 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
JP2011518252A (ja) * 2008-03-05 2011-06-23 アプライド マテリアルズ インコーポレイテッド 回転モジュールを備えたコーティング装置
WO2013031076A1 (ja) * 2011-09-02 2013-03-07 パナソニック株式会社 有機ｅｌ表示パネルおよびその製造方法
JP2013065830A (ja) * 2011-09-02 2013-04-11 Canon Inc 有機ｅｌ装置
KR20150112348A (ko) * 2014-03-27 2015-10-07 엘지디스플레이 주식회사 복사열 반사부를 가지는 진공 챔버 및 이를 이용한 유기 발광 표시 장치의 제조 방법

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Publication number Priority date Publication date Assignee Title
TW318258B (https=) * 1995-12-12 1997-10-21 Tokyo Electron Co Ltd
US5817366A (en) * 1996-07-29 1998-10-06 Tdk Corporation Method for manufacturing organic electroluminescent element and apparatus therefor
TWI258317B (en) * 2002-01-25 2006-07-11 Semiconductor Energy Lab A display device and method for manufacturing thereof
US7002292B2 (en) * 2003-07-22 2006-02-21 E. I. Du Pont De Nemours And Company Organic electronic device
EP2098608A1 (en) * 2008-03-05 2009-09-09 Applied Materials, Inc. Coating apparatus with rotation module
JP5361002B2 (ja) * 2010-09-01 2013-12-04 独立行政法人産業技術総合研究所 デバイス製造装置および方法
TWI501861B (zh) * 2011-12-06 2015-10-01 私立中原大學 滾輪式壓印系統
WO2014116681A2 (en) * 2013-01-22 2014-07-31 Brooks Automation, Inc. Substrate transport
CN105705997B (zh) * 2013-11-08 2020-01-17 Asml荷兰有限公司 生成用于定向自组装的引导模板的方法
US9536759B2 (en) * 2015-05-29 2017-01-03 Taiwan Semiconductor Manufacturing Co., Ltd Baking apparatus and method
WO2017130440A1 (ja) * 2016-01-26 2017-08-03 鴻海精密工業股▲ふん▼有限公司 蒸着マスク、その製造方法及びその蒸着マスクを使った有機発光ダイオードの製造方法
US20200381276A1 (en) * 2019-05-31 2020-12-03 Applied Materials, Inc. Multisubstrate process system

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09293589A (ja) * 1996-04-26 1997-11-11 Pioneer Electron Corp 有機ｅｌディスプレイの製造方法
JP2002367775A (ja) * 2001-06-05 2002-12-20 Dainippon Printing Co Ltd エレクトロルミネッセント素子の製造方法
JP2003264071A (ja) * 2002-03-08 2003-09-19 Ulvac Japan Ltd 有機ｅｌ素子の製造方法及びその装置
JP2004217970A (ja) * 2003-01-10 2004-08-05 Semiconductor Energy Lab Co Ltd 製造装置、クリーニング方法、および再利用方法
JP2004228011A (ja) * 2003-01-24 2004-08-12 Dainippon Printing Co Ltd エレクトロルミネッセント素子の製造方法
JP2009170282A (ja) * 2008-01-17 2009-07-30 Seiko Epson Corp 基板処理装置および有機エレクトロルミネッセンス装置の製造方法
JP2009170336A (ja) * 2008-01-18 2009-07-30 Sony Corp 表示装置の製造方法
JP2011518252A (ja) * 2008-03-05 2011-06-23 アプライド マテリアルズ インコーポレイテッド 回転モジュールを備えたコーティング装置
WO2013031076A1 (ja) * 2011-09-02 2013-03-07 パナソニック株式会社 有機ｅｌ表示パネルおよびその製造方法
JP2013065830A (ja) * 2011-09-02 2013-04-11 Canon Inc 有機ｅｌ装置
KR20150112348A (ko) * 2014-03-27 2015-10-07 엘지디스플레이 주식회사 복사열 반사부를 가지는 진공 챔버 및 이를 이용한 유기 발광 표시 장치의 제조 방법

Also Published As

Publication number Publication date
WO2022123381A1 (ja) 2022-06-16
US20230422592A1 (en) 2023-12-28

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