JPWO2022043826A1 - - Google Patents

Info

Publication number
JPWO2022043826A1
JPWO2022043826A1 JP2022544881A JP2022544881A JPWO2022043826A1 JP WO2022043826 A1 JPWO2022043826 A1 JP WO2022043826A1 JP 2022544881 A JP2022544881 A JP 2022544881A JP 2022544881 A JP2022544881 A JP 2022544881A JP WO2022043826 A1 JPWO2022043826 A1 JP WO2022043826A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022544881A
Other languages
Japanese (ja)
Other versions
JPWO2022043826A5 (https=
JP7720850B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022043826A1 publication Critical patent/JPWO2022043826A1/ja
Publication of JPWO2022043826A5 publication Critical patent/JPWO2022043826A5/ja
Priority to JP2025126387A priority Critical patent/JP2025163097A/ja
Application granted granted Critical
Publication of JP7720850B2 publication Critical patent/JP7720850B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
    • H10D84/82Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
    • H10D84/83Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
    • H10D84/85Complementary IGFETs, e.g. CMOS
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6745Polycrystalline or microcrystalline silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10OLED displays
    • H10K59/12Active-matrix OLED [AMOLED] displays
    • H10K59/121Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2300/00Aspects of the constitution of display devices
    • G09G2300/04Structural and physical details of display devices
    • G09G2300/0421Structural details of the set of electrodes
    • G09G2300/0426Layout of electrodes and connections
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00Command of the display device
    • G09G2310/02Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264Details of driving circuits
    • G09G2310/0286Details of a shift registers arranged for use in a driving circuit
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00Command of the display device
    • G09G2310/02Addressing, scanning or driving the display screen or processing steps related thereto
    • G09G2310/0264Details of driving circuits
    • G09G2310/0291Details of output amplifiers or buffers arranged for use in a driving circuit
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2310/00Command of the display device
    • G09G2310/08Details of timing specific for flat panels, other than clock recovery
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09GARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G2330/00Aspects of power supply; Aspects of display protection and defect management
    • G09G2330/02Details of power systems and of start or stop of display operation
    • G09G2330/021Power management, e.g. power saving

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Mathematical Physics (AREA)
  • Optics & Photonics (AREA)
  • Geometry (AREA)
  • Thin Film Transistor (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
JP2022544881A 2020-08-27 2021-08-17 半導体装置、表示装置、及び電子機器 Active JP7720850B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025126387A JP2025163097A (ja) 2020-08-27 2025-07-29 半導体装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020143219 2020-08-27
JP2020143219 2020-08-27
PCT/IB2021/057541 WO2022043826A1 (ja) 2020-08-27 2021-08-17 半導体装置、表示装置、及び電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025126387A Division JP2025163097A (ja) 2020-08-27 2025-07-29 半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022043826A1 true JPWO2022043826A1 (https=) 2022-03-03
JPWO2022043826A5 JPWO2022043826A5 (https=) 2024-08-01
JP7720850B2 JP7720850B2 (ja) 2025-08-08

Family

ID=80354745

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022544881A Active JP7720850B2 (ja) 2020-08-27 2021-08-17 半導体装置、表示装置、及び電子機器
JP2025126387A Pending JP2025163097A (ja) 2020-08-27 2025-07-29 半導体装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025126387A Pending JP2025163097A (ja) 2020-08-27 2025-07-29 半導体装置

Country Status (6)

Country Link
US (2) US12040333B2 (https=)
JP (2) JP7720850B2 (https=)
KR (1) KR20230056710A (https=)
CN (1) CN115885389A (https=)
DE (1) DE112021004465T5 (https=)
WO (1) WO2022043826A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106663394B (zh) * 2014-07-23 2019-10-22 索尼公司 显示装置、制造显示装置的方法以及电子设备
JP7851915B2 (ja) 2021-04-22 2026-04-27 株式会社半導体エネルギー研究所 表示装置
US12112719B2 (en) * 2022-03-04 2024-10-08 Innolux Corporation Electronic device and modulating device with short frame time length
CN115050757B (zh) 2022-06-15 2024-12-27 武汉华星光电半导体显示技术有限公司 显示面板及显示装置
KR102912335B1 (ko) * 2022-09-14 2026-01-13 엘지디스플레이 주식회사 디스플레이 패널
CN117457659A (zh) * 2023-01-31 2024-01-26 广州华星光电半导体显示技术有限公司 阵列基板及其制作方法、显示装置
US20240420644A1 (en) * 2023-06-13 2024-12-19 Apple Inc. Display having Gate Driver Circuitry with Reduced Power Consumption and Improved Reliability

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015014786A (ja) * 2013-06-05 2015-01-22 株式会社半導体エネルギー研究所 順序回路、半導体装置
JP2016046527A (ja) * 2014-08-21 2016-04-04 株式会社半導体エネルギー研究所 半導体装置とその作製方法、電子機器
JP2017212711A (ja) * 2015-06-23 2017-11-30 株式会社半導体エネルギー研究所 撮像装置および電子機器

Family Cites Families (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60130160A (ja) 1983-12-19 1985-07-11 Hitachi Ltd 半導体記憶装置
JPH0612799B2 (ja) 1986-03-03 1994-02-16 三菱電機株式会社 積層型半導体装置およびその製造方法
JPH0442579A (ja) 1990-06-08 1992-02-13 Seiko Epson Corp 薄膜トランジスタ及び製造方法
JP3126573B2 (ja) 1993-12-24 2001-01-22 シャープ株式会社 半導体装置及びその製造方法
JPH08250673A (ja) 1995-03-15 1996-09-27 Nec Corp 半導体装置
JP4103968B2 (ja) 1996-09-18 2008-06-18 株式会社半導体エネルギー研究所 絶縁ゲイト型半導体装置
KR100219519B1 (ko) 1997-01-10 1999-09-01 윤종용 페로일렉트릭 플로팅 게이트 램을 구비하는 반도체 메모리 디바이스 및 그 제조방법
TW587252B (en) 2000-01-18 2004-05-11 Hitachi Ltd Semiconductor memory device and data processing device
JP3735855B2 (ja) 2000-02-17 2006-01-18 日本電気株式会社 半導体集積回路装置およびその駆動方法
JP2001325798A (ja) 2000-05-16 2001-11-22 Sony Corp 論理回路およびこれを用いた表示装置
JP4785271B2 (ja) 2001-04-27 2011-10-05 株式会社半導体エネルギー研究所 液晶表示装置、電子機器
JP4439761B2 (ja) 2001-05-11 2010-03-24 株式会社半導体エネルギー研究所 液晶表示装置、電子機器
TW582005B (en) 2001-05-29 2004-04-01 Semiconductor Energy Lab Pulse output circuit, shift register, and display device
JP4831895B2 (ja) 2001-08-03 2011-12-07 株式会社半導体エネルギー研究所 半導体装置
JP2003060060A (ja) 2001-08-21 2003-02-28 Fujitsu Ltd 半導体集積回路装置
KR100797522B1 (ko) 2002-09-05 2008-01-24 삼성전자주식회사 쉬프트 레지스터와 이를 구비하는 액정 표시 장치
KR100615085B1 (ko) 2004-01-12 2006-08-22 삼성전자주식회사 노드 콘택 구조체들, 이를 채택하는 반도체소자들, 이를채택하는 에스램 셀들 및 이를 제조하는 방법들
US20090224330A1 (en) * 2005-07-28 2009-09-10 Hong Chang Min Semiconductor Memory Device and Method for Arranging and Manufacturing the Same
FR2890236B1 (fr) 2005-08-30 2007-11-30 Commissariat Energie Atomique Procede de fabrication de circuits en couches minces en silicium amorphe et polycristallin
US7663165B2 (en) 2006-08-31 2010-02-16 Aptina Imaging Corporation Transparent-channel thin-film transistor-based pixels for high-performance image sensors
KR100829570B1 (ko) 2006-10-20 2008-05-14 삼성전자주식회사 크로스 포인트 메모리용 박막 트랜지스터 및 그 제조 방법
EP1950804A2 (en) 2007-01-26 2008-07-30 Samsung Electronics Co., Ltd. Display device and manufacturing method of the same
KR100886429B1 (ko) 2007-05-14 2009-03-02 삼성전자주식회사 반도체 소자 및 제조방법
US8354674B2 (en) 2007-06-29 2013-01-15 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer
TWI353063B (en) 2007-07-27 2011-11-21 Au Optronics Corp Photo detector and method for fabricating the same
US8232598B2 (en) 2007-09-20 2012-07-31 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US8284142B2 (en) 2008-09-30 2012-10-09 Semiconductor Energy Laboratory Co., Ltd. Display device
EP2172977A1 (en) 2008-10-03 2010-04-07 Semiconductor Energy Laboratory Co., Ltd. Display device
KR101259727B1 (ko) 2008-10-24 2013-04-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101432764B1 (ko) 2008-11-13 2014-08-21 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치의 제조방법
KR101291384B1 (ko) 2008-11-21 2013-07-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR102334634B1 (ko) 2008-11-28 2021-12-06 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 표시 장치 및 표시 장치를 포함하는 전자 장치
JP5781720B2 (ja) 2008-12-15 2015-09-24 ルネサスエレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
KR101048965B1 (ko) 2009-01-22 2011-07-12 삼성모바일디스플레이주식회사 유기 전계발광 표시장치
US8441047B2 (en) 2009-04-10 2013-05-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
JP5436049B2 (ja) 2009-05-29 2014-03-05 三菱電機株式会社 シフトレジスタ回路、シフトレジスタ回路の設計方法及び半導体装置
KR101065407B1 (ko) 2009-08-25 2011-09-16 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조 방법
TWI671724B (zh) 2009-09-10 2019-09-11 日商半導體能源研究所股份有限公司 半導體裝置和顯示裝置
CN102024410B (zh) 2009-09-16 2014-10-22 株式会社半导体能源研究所 半导体装置及电子设备
KR101591613B1 (ko) 2009-10-21 2016-02-03 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101829074B1 (ko) 2009-10-29 2018-02-13 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR20190006091A (ko) 2009-10-29 2019-01-16 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2011052488A1 (en) 2009-10-30 2011-05-05 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
EP2494597A4 (en) 2009-10-30 2015-03-18 Semiconductor Energy Lab SEMICONDUCTOR COMPONENT
CN104393007A (zh) 2009-11-06 2015-03-04 株式会社半导体能源研究所 半导体装置
CN104681079B (zh) 2009-11-06 2018-02-02 株式会社半导体能源研究所 半导体装置及用于驱动半导体装置的方法
CN102612741B (zh) 2009-11-06 2014-11-12 株式会社半导体能源研究所 半导体装置
KR101605984B1 (ko) 2009-11-06 2016-03-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2011058934A1 (en) 2009-11-13 2011-05-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
KR101790365B1 (ko) 2009-11-20 2017-10-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2011062067A1 (en) 2009-11-20 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
KR20190124813A (ko) 2009-11-20 2019-11-05 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2011065183A1 (en) 2009-11-24 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device including memory cell
KR101803254B1 (ko) 2009-11-27 2017-11-30 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN102656683B (zh) 2009-12-11 2015-02-11 株式会社半导体能源研究所 半导体装置
KR101813460B1 (ko) 2009-12-18 2017-12-29 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101870119B1 (ko) 2009-12-25 2018-06-25 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
WO2011096264A1 (en) 2010-02-05 2011-08-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of driving semiconductor device
US9111795B2 (en) 2011-04-29 2015-08-18 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device with capacitor connected to memory element through oxide semiconductor film
JP5947099B2 (ja) 2011-05-20 2016-07-06 株式会社半導体エネルギー研究所 半導体装置
WO2013002192A1 (ja) * 2011-06-30 2013-01-03 シャープ株式会社 表示駆動回路、表示パネル、及び表示装置
TWI621243B (zh) 2011-08-29 2018-04-11 半導體能源研究所股份有限公司 半導體裝置
US9018629B2 (en) 2011-10-13 2015-04-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing semiconductor device
JP6075922B2 (ja) 2012-02-29 2017-02-08 株式会社半導体エネルギー研究所 表示装置
TWI581404B (zh) 2012-08-10 2017-05-01 半導體能源研究所股份有限公司 半導體裝置以及該半導體裝置的驅動方法
TWI622053B (zh) 2013-07-10 2018-04-21 半導體能源研究所股份有限公司 半導體裝置
US9818765B2 (en) 2013-08-26 2017-11-14 Apple Inc. Displays with silicon and semiconducting oxide thin-film transistors
KR102227474B1 (ko) 2013-11-05 2021-03-15 삼성디스플레이 주식회사 박막트랜지스터 어레이 기판, 유기발광표시장치 및 박막트랜지스터 어레이 기판의 제조 방법
US10074576B2 (en) 2014-02-28 2018-09-11 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device
US9543370B2 (en) 2014-09-24 2017-01-10 Apple Inc. Silicon and semiconducting oxide thin-film transistor displays
KR20210039507A (ko) * 2014-11-28 2021-04-09 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 모듈, 및 전자 기기
US9397124B2 (en) 2014-12-03 2016-07-19 Apple Inc. Organic light-emitting diode display with double gate transistors
US10553690B2 (en) * 2015-08-04 2020-02-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
JP2019049652A (ja) 2017-09-11 2019-03-28 シャープ株式会社 表示装置
JP2019061208A (ja) 2017-09-28 2019-04-18 シャープ株式会社 表示装置
CN107799521A (zh) * 2017-10-10 2018-03-13 深圳市华星光电半导体显示技术有限公司 Cmos反相器及阵列基板
US11049469B2 (en) * 2019-11-19 2021-06-29 Sharp Kabushiki Kaisha Data signal line drive circuit and liquid crystal display device provided with same
WO2021105828A1 (ja) 2019-11-29 2021-06-03 株式会社半導体エネルギー研究所 半導体装置、表示装置、及び電子機器

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015014786A (ja) * 2013-06-05 2015-01-22 株式会社半導体エネルギー研究所 順序回路、半導体装置
JP2016046527A (ja) * 2014-08-21 2016-04-04 株式会社半導体エネルギー研究所 半導体装置とその作製方法、電子機器
JP2017212711A (ja) * 2015-06-23 2017-11-30 株式会社半導体エネルギー研究所 撮像装置および電子機器

Also Published As

Publication number Publication date
US20230326934A1 (en) 2023-10-12
DE112021004465T5 (de) 2023-06-07
US12040333B2 (en) 2024-07-16
WO2022043826A1 (ja) 2022-03-03
JP7720850B2 (ja) 2025-08-08
CN115885389A (zh) 2023-03-31
JP2025163097A (ja) 2025-10-28
US20240379690A1 (en) 2024-11-14
KR20230056710A (ko) 2023-04-27
US12490513B2 (en) 2025-12-02

Similar Documents

Publication Publication Date Title
BR112021014123A2 (https=)
JPWO2022043826A1 (https=)
BR112022009896A2 (https=)
BR112021017747A2 (https=)
BR112022024743A2 (https=)
BR112022026905A2 (https=)
BR102021018859A2 (https=)
BR102021015500A2 (https=)
BR102021007058A2 (https=)
BR102020022030A2 (https=)
BR102021020147A2 (https=)
BR102021018926A2 (https=)
BR102021018167A2 (https=)
BR102021017576A2 (https=)
BR102021016837A2 (https=)
BR102021016551A2 (https=)
BR102021016375A2 (https=)
BR102021016200A2 (https=)
BR102021016176A2 (https=)
BR102021015566A2 (https=)
BR102021015450A8 (https=)
BR102021015220A2 (https=)
BR102021015247A2 (https=)
BR102021014056A2 (https=)
BR102021014044A2 (https=)

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20240724

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20240724

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20250708

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20250729

R150 Certificate of patent or registration of utility model

Ref document number: 7720850

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150