JPWO2022043826A1 - - Google Patents
Info
- Publication number
- JPWO2022043826A1 JPWO2022043826A1 JP2022544881A JP2022544881A JPWO2022043826A1 JP WO2022043826 A1 JPWO2022043826 A1 JP WO2022043826A1 JP 2022544881 A JP2022544881 A JP 2022544881A JP 2022544881 A JP2022544881 A JP 2022544881A JP WO2022043826 A1 JPWO2022043826 A1 JP WO2022043826A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/82—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components
- H10D84/83—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs of only field-effect components of only insulated-gate FETs [IGFET]
- H10D84/85—Complementary IGFETs, e.g. CMOS
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
- H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6741—Group IV materials, e.g. germanium or silicon carbide
- H10D30/6743—Silicon
- H10D30/6745—Polycrystalline or microcrystalline silicon
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/451—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
- H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
- H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2300/00—Aspects of the constitution of display devices
- G09G2300/04—Structural and physical details of display devices
- G09G2300/0421—Structural details of the set of electrodes
- G09G2300/0426—Layout of electrodes and connections
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
- G09G2310/0264—Details of driving circuits
- G09G2310/0286—Details of a shift registers arranged for use in a driving circuit
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/02—Addressing, scanning or driving the display screen or processing steps related thereto
- G09G2310/0264—Details of driving circuits
- G09G2310/0291—Details of output amplifiers or buffers arranged for use in a driving circuit
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2310/00—Command of the display device
- G09G2310/08—Details of timing specific for flat panels, other than clock recovery
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G2330/00—Aspects of power supply; Aspects of display protection and defect management
- G09G2330/02—Details of power systems and of start or stop of display operation
- G09G2330/021—Power management, e.g. power saving
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Nonlinear Science (AREA)
- Computer Hardware Design (AREA)
- Theoretical Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Geometry (AREA)
- Thin Film Transistor (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025126387A JP2025163097A (ja) | 2020-08-27 | 2025-07-29 | 半導体装置 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020143219 | 2020-08-27 | ||
| JP2020143219 | 2020-08-27 | ||
| PCT/IB2021/057541 WO2022043826A1 (ja) | 2020-08-27 | 2021-08-17 | 半導体装置、表示装置、及び電子機器 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025126387A Division JP2025163097A (ja) | 2020-08-27 | 2025-07-29 | 半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022043826A1 true JPWO2022043826A1 (https=) | 2022-03-03 |
| JPWO2022043826A5 JPWO2022043826A5 (https=) | 2024-08-01 |
| JP7720850B2 JP7720850B2 (ja) | 2025-08-08 |
Family
ID=80354745
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022544881A Active JP7720850B2 (ja) | 2020-08-27 | 2021-08-17 | 半導体装置、表示装置、及び電子機器 |
| JP2025126387A Pending JP2025163097A (ja) | 2020-08-27 | 2025-07-29 | 半導体装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025126387A Pending JP2025163097A (ja) | 2020-08-27 | 2025-07-29 | 半導体装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US12040333B2 (https=) |
| JP (2) | JP7720850B2 (https=) |
| KR (1) | KR20230056710A (https=) |
| CN (1) | CN115885389A (https=) |
| DE (1) | DE112021004465T5 (https=) |
| WO (1) | WO2022043826A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106663394B (zh) * | 2014-07-23 | 2019-10-22 | 索尼公司 | 显示装置、制造显示装置的方法以及电子设备 |
| JP7851915B2 (ja) | 2021-04-22 | 2026-04-27 | 株式会社半導体エネルギー研究所 | 表示装置 |
| US12112719B2 (en) * | 2022-03-04 | 2024-10-08 | Innolux Corporation | Electronic device and modulating device with short frame time length |
| CN115050757B (zh) | 2022-06-15 | 2024-12-27 | 武汉华星光电半导体显示技术有限公司 | 显示面板及显示装置 |
| KR102912335B1 (ko) * | 2022-09-14 | 2026-01-13 | 엘지디스플레이 주식회사 | 디스플레이 패널 |
| CN117457659A (zh) * | 2023-01-31 | 2024-01-26 | 广州华星光电半导体显示技术有限公司 | 阵列基板及其制作方法、显示装置 |
| US20240420644A1 (en) * | 2023-06-13 | 2024-12-19 | Apple Inc. | Display having Gate Driver Circuitry with Reduced Power Consumption and Improved Reliability |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015014786A (ja) * | 2013-06-05 | 2015-01-22 | 株式会社半導体エネルギー研究所 | 順序回路、半導体装置 |
| JP2016046527A (ja) * | 2014-08-21 | 2016-04-04 | 株式会社半導体エネルギー研究所 | 半導体装置とその作製方法、電子機器 |
| JP2017212711A (ja) * | 2015-06-23 | 2017-11-30 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
Family Cites Families (78)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60130160A (ja) | 1983-12-19 | 1985-07-11 | Hitachi Ltd | 半導体記憶装置 |
| JPH0612799B2 (ja) | 1986-03-03 | 1994-02-16 | 三菱電機株式会社 | 積層型半導体装置およびその製造方法 |
| JPH0442579A (ja) | 1990-06-08 | 1992-02-13 | Seiko Epson Corp | 薄膜トランジスタ及び製造方法 |
| JP3126573B2 (ja) | 1993-12-24 | 2001-01-22 | シャープ株式会社 | 半導体装置及びその製造方法 |
| JPH08250673A (ja) | 1995-03-15 | 1996-09-27 | Nec Corp | 半導体装置 |
| JP4103968B2 (ja) | 1996-09-18 | 2008-06-18 | 株式会社半導体エネルギー研究所 | 絶縁ゲイト型半導体装置 |
| KR100219519B1 (ko) | 1997-01-10 | 1999-09-01 | 윤종용 | 페로일렉트릭 플로팅 게이트 램을 구비하는 반도체 메모리 디바이스 및 그 제조방법 |
| TW587252B (en) | 2000-01-18 | 2004-05-11 | Hitachi Ltd | Semiconductor memory device and data processing device |
| JP3735855B2 (ja) | 2000-02-17 | 2006-01-18 | 日本電気株式会社 | 半導体集積回路装置およびその駆動方法 |
| JP2001325798A (ja) | 2000-05-16 | 2001-11-22 | Sony Corp | 論理回路およびこれを用いた表示装置 |
| JP4785271B2 (ja) | 2001-04-27 | 2011-10-05 | 株式会社半導体エネルギー研究所 | 液晶表示装置、電子機器 |
| JP4439761B2 (ja) | 2001-05-11 | 2010-03-24 | 株式会社半導体エネルギー研究所 | 液晶表示装置、電子機器 |
| TW582005B (en) | 2001-05-29 | 2004-04-01 | Semiconductor Energy Lab | Pulse output circuit, shift register, and display device |
| JP4831895B2 (ja) | 2001-08-03 | 2011-12-07 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP2003060060A (ja) | 2001-08-21 | 2003-02-28 | Fujitsu Ltd | 半導体集積回路装置 |
| KR100797522B1 (ko) | 2002-09-05 | 2008-01-24 | 삼성전자주식회사 | 쉬프트 레지스터와 이를 구비하는 액정 표시 장치 |
| KR100615085B1 (ko) | 2004-01-12 | 2006-08-22 | 삼성전자주식회사 | 노드 콘택 구조체들, 이를 채택하는 반도체소자들, 이를채택하는 에스램 셀들 및 이를 제조하는 방법들 |
| US20090224330A1 (en) * | 2005-07-28 | 2009-09-10 | Hong Chang Min | Semiconductor Memory Device and Method for Arranging and Manufacturing the Same |
| FR2890236B1 (fr) | 2005-08-30 | 2007-11-30 | Commissariat Energie Atomique | Procede de fabrication de circuits en couches minces en silicium amorphe et polycristallin |
| US7663165B2 (en) | 2006-08-31 | 2010-02-16 | Aptina Imaging Corporation | Transparent-channel thin-film transistor-based pixels for high-performance image sensors |
| KR100829570B1 (ko) | 2006-10-20 | 2008-05-14 | 삼성전자주식회사 | 크로스 포인트 메모리용 박막 트랜지스터 및 그 제조 방법 |
| EP1950804A2 (en) | 2007-01-26 | 2008-07-30 | Samsung Electronics Co., Ltd. | Display device and manufacturing method of the same |
| KR100886429B1 (ko) | 2007-05-14 | 2009-03-02 | 삼성전자주식회사 | 반도체 소자 및 제조방법 |
| US8354674B2 (en) | 2007-06-29 | 2013-01-15 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device wherein a property of a first semiconductor layer is different from a property of a second semiconductor layer |
| TWI353063B (en) | 2007-07-27 | 2011-11-21 | Au Optronics Corp | Photo detector and method for fabricating the same |
| US8232598B2 (en) | 2007-09-20 | 2012-07-31 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
| US8284142B2 (en) | 2008-09-30 | 2012-10-09 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| EP2172977A1 (en) | 2008-10-03 | 2010-04-07 | Semiconductor Energy Laboratory Co., Ltd. | Display device |
| KR101259727B1 (ko) | 2008-10-24 | 2013-04-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101432764B1 (ko) | 2008-11-13 | 2014-08-21 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치의 제조방법 |
| KR101291384B1 (ko) | 2008-11-21 | 2013-07-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR102334634B1 (ko) | 2008-11-28 | 2021-12-06 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 표시 장치 및 표시 장치를 포함하는 전자 장치 |
| JP5781720B2 (ja) | 2008-12-15 | 2015-09-24 | ルネサスエレクトロニクス株式会社 | 半導体装置及び半導体装置の製造方法 |
| KR101048965B1 (ko) | 2009-01-22 | 2011-07-12 | 삼성모바일디스플레이주식회사 | 유기 전계발광 표시장치 |
| US8441047B2 (en) | 2009-04-10 | 2013-05-14 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing the same |
| JP5436049B2 (ja) | 2009-05-29 | 2014-03-05 | 三菱電機株式会社 | シフトレジスタ回路、シフトレジスタ回路の設計方法及び半導体装置 |
| KR101065407B1 (ko) | 2009-08-25 | 2011-09-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
| TWI671724B (zh) | 2009-09-10 | 2019-09-11 | 日商半導體能源研究所股份有限公司 | 半導體裝置和顯示裝置 |
| CN102024410B (zh) | 2009-09-16 | 2014-10-22 | 株式会社半导体能源研究所 | 半导体装置及电子设备 |
| KR101591613B1 (ko) | 2009-10-21 | 2016-02-03 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101829074B1 (ko) | 2009-10-29 | 2018-02-13 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR20190006091A (ko) | 2009-10-29 | 2019-01-16 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011052488A1 (en) | 2009-10-30 | 2011-05-05 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| EP2494597A4 (en) | 2009-10-30 | 2015-03-18 | Semiconductor Energy Lab | SEMICONDUCTOR COMPONENT |
| CN104393007A (zh) | 2009-11-06 | 2015-03-04 | 株式会社半导体能源研究所 | 半导体装置 |
| CN104681079B (zh) | 2009-11-06 | 2018-02-02 | 株式会社半导体能源研究所 | 半导体装置及用于驱动半导体装置的方法 |
| CN102612741B (zh) | 2009-11-06 | 2014-11-12 | 株式会社半导体能源研究所 | 半导体装置 |
| KR101605984B1 (ko) | 2009-11-06 | 2016-03-23 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011058934A1 (en) | 2009-11-13 | 2011-05-19 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and driving method thereof |
| KR101790365B1 (ko) | 2009-11-20 | 2017-10-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011062067A1 (en) | 2009-11-20 | 2011-05-26 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device |
| KR20190124813A (ko) | 2009-11-20 | 2019-11-05 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011065183A1 (en) | 2009-11-24 | 2011-06-03 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device including memory cell |
| KR101803254B1 (ko) | 2009-11-27 | 2017-11-30 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| CN102656683B (zh) | 2009-12-11 | 2015-02-11 | 株式会社半导体能源研究所 | 半导体装置 |
| KR101813460B1 (ko) | 2009-12-18 | 2017-12-29 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| KR101870119B1 (ko) | 2009-12-25 | 2018-06-25 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치 |
| WO2011096264A1 (en) | 2010-02-05 | 2011-08-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of driving semiconductor device |
| US9111795B2 (en) | 2011-04-29 | 2015-08-18 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device with capacitor connected to memory element through oxide semiconductor film |
| JP5947099B2 (ja) | 2011-05-20 | 2016-07-06 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| WO2013002192A1 (ja) * | 2011-06-30 | 2013-01-03 | シャープ株式会社 | 表示駆動回路、表示パネル、及び表示装置 |
| TWI621243B (zh) | 2011-08-29 | 2018-04-11 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| US9018629B2 (en) | 2011-10-13 | 2015-04-28 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method for manufacturing semiconductor device |
| JP6075922B2 (ja) | 2012-02-29 | 2017-02-08 | 株式会社半導体エネルギー研究所 | 表示装置 |
| TWI581404B (zh) | 2012-08-10 | 2017-05-01 | 半導體能源研究所股份有限公司 | 半導體裝置以及該半導體裝置的驅動方法 |
| TWI622053B (zh) | 2013-07-10 | 2018-04-21 | 半導體能源研究所股份有限公司 | 半導體裝置 |
| US9818765B2 (en) | 2013-08-26 | 2017-11-14 | Apple Inc. | Displays with silicon and semiconducting oxide thin-film transistors |
| KR102227474B1 (ko) | 2013-11-05 | 2021-03-15 | 삼성디스플레이 주식회사 | 박막트랜지스터 어레이 기판, 유기발광표시장치 및 박막트랜지스터 어레이 기판의 제조 방법 |
| US10074576B2 (en) | 2014-02-28 | 2018-09-11 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor memory device |
| US9543370B2 (en) | 2014-09-24 | 2017-01-10 | Apple Inc. | Silicon and semiconducting oxide thin-film transistor displays |
| KR20210039507A (ko) * | 2014-11-28 | 2021-04-09 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체 장치, 모듈, 및 전자 기기 |
| US9397124B2 (en) | 2014-12-03 | 2016-07-19 | Apple Inc. | Organic light-emitting diode display with double gate transistors |
| US10553690B2 (en) * | 2015-08-04 | 2020-02-04 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and manufacturing method thereof |
| JP2019049652A (ja) | 2017-09-11 | 2019-03-28 | シャープ株式会社 | 表示装置 |
| JP2019061208A (ja) | 2017-09-28 | 2019-04-18 | シャープ株式会社 | 表示装置 |
| CN107799521A (zh) * | 2017-10-10 | 2018-03-13 | 深圳市华星光电半导体显示技术有限公司 | Cmos反相器及阵列基板 |
| US11049469B2 (en) * | 2019-11-19 | 2021-06-29 | Sharp Kabushiki Kaisha | Data signal line drive circuit and liquid crystal display device provided with same |
| WO2021105828A1 (ja) | 2019-11-29 | 2021-06-03 | 株式会社半導体エネルギー研究所 | 半導体装置、表示装置、及び電子機器 |
-
2021
- 2021-08-17 WO PCT/IB2021/057541 patent/WO2022043826A1/ja not_active Ceased
- 2021-08-17 JP JP2022544881A patent/JP7720850B2/ja active Active
- 2021-08-17 DE DE112021004465.6T patent/DE112021004465T5/de active Pending
- 2021-08-17 KR KR1020237009125A patent/KR20230056710A/ko active Pending
- 2021-08-17 CN CN202180052440.XA patent/CN115885389A/zh active Pending
- 2021-08-17 US US18/022,329 patent/US12040333B2/en active Active
-
2024
- 2024-07-09 US US18/767,164 patent/US12490513B2/en active Active
-
2025
- 2025-07-29 JP JP2025126387A patent/JP2025163097A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015014786A (ja) * | 2013-06-05 | 2015-01-22 | 株式会社半導体エネルギー研究所 | 順序回路、半導体装置 |
| JP2016046527A (ja) * | 2014-08-21 | 2016-04-04 | 株式会社半導体エネルギー研究所 | 半導体装置とその作製方法、電子機器 |
| JP2017212711A (ja) * | 2015-06-23 | 2017-11-30 | 株式会社半導体エネルギー研究所 | 撮像装置および電子機器 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20230326934A1 (en) | 2023-10-12 |
| DE112021004465T5 (de) | 2023-06-07 |
| US12040333B2 (en) | 2024-07-16 |
| WO2022043826A1 (ja) | 2022-03-03 |
| JP7720850B2 (ja) | 2025-08-08 |
| CN115885389A (zh) | 2023-03-31 |
| JP2025163097A (ja) | 2025-10-28 |
| US20240379690A1 (en) | 2024-11-14 |
| KR20230056710A (ko) | 2023-04-27 |
| US12490513B2 (en) | 2025-12-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20240724 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240724 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20250708 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20250729 |
|
| R150 | Certificate of patent or registration of utility model |
Ref document number: 7720850 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |