JPWO2021241573A1 - - Google Patents

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Publication number
JPWO2021241573A1
JPWO2021241573A1 JP2021559596A JP2021559596A JPWO2021241573A1 JP WO2021241573 A1 JPWO2021241573 A1 JP WO2021241573A1 JP 2021559596 A JP2021559596 A JP 2021559596A JP 2021559596 A JP2021559596 A JP 2021559596A JP WO2021241573 A1 JPWO2021241573 A1 JP WO2021241573A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021559596A
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Japanese (ja)
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JP7107451B2 (ja
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Publication of JPWO2021241573A1 publication Critical patent/JPWO2021241573A1/ja
Priority to JP2022078321A priority Critical patent/JP7287536B2/ja
Application granted granted Critical
Publication of JP7107451B2 publication Critical patent/JP7107451B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00Processes for applying liquids or other fluent materials
    • B05D1/36Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1057Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain
    • C08G73/1064Polyimides containing other atoms than carbon, hydrogen, nitrogen or oxygen in the main chain containing sulfur
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2021559596A 2020-05-29 2021-05-25 ポリイミドフィルムおよびその製造方法 Active JP7107451B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2022078321A JP7287536B2 (ja) 2020-05-29 2022-05-11 ポリイミドフィルムおよびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020094848 2020-05-29
JP2020094848 2020-05-29
PCT/JP2021/019789 WO2021241573A1 (ja) 2020-05-29 2021-05-25 ポリイミドフィルムおよびその製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2022078321A Division JP7287536B2 (ja) 2020-05-29 2022-05-11 ポリイミドフィルムおよびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021241573A1 true JPWO2021241573A1 (zh) 2021-12-02
JP7107451B2 JP7107451B2 (ja) 2022-07-27

Family

ID=78744067

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2021559596A Active JP7107451B2 (ja) 2020-05-29 2021-05-25 ポリイミドフィルムおよびその製造方法
JP2022078321A Active JP7287536B2 (ja) 2020-05-29 2022-05-11 ポリイミドフィルムおよびその製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2022078321A Active JP7287536B2 (ja) 2020-05-29 2022-05-11 ポリイミドフィルムおよびその製造方法

Country Status (5)

Country Link
JP (2) JP7107451B2 (zh)
KR (1) KR20230019064A (zh)
CN (2) CN117656622A (zh)
TW (1) TW202202555A (zh)
WO (1) WO2021241573A1 (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115058040B (zh) * 2022-06-23 2023-10-03 华中科技大学 一种双层聚酰亚胺薄膜及其制备方法和应用

Citations (6)

* Cited by examiner, † Cited by third party
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JPH02126974A (ja) * 1988-06-23 1990-05-15 Toray Ind Inc ポリイミド積層膜の製造方法
WO2005115752A1 (ja) * 2004-05-31 2005-12-08 Kaneka Corporation ポリイミド積層体およびその製造方法
JP2007176160A (ja) * 2005-12-01 2007-07-12 Ist Corp 多層ポリイミド管状物及びその製造方法並びに樹脂管状物の製造装置
JP2010155360A (ja) * 2008-12-26 2010-07-15 Nippon Steel Chem Co Ltd 透明絶縁樹脂層を有する配線基板用積層体
WO2016129329A1 (ja) * 2015-02-09 2016-08-18 コニカミノルタ株式会社 透明耐熱性積層フィルムの製造方法、透明耐熱性積層フィルム、フレキシブルプリント基板、フレキシブルディスプレイ用基板、フレキシブルディスプレイ用前面板、led照明装置及び有機エレクトロルミネッセンス表示装置
WO2018186262A1 (ja) * 2017-04-06 2018-10-11 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材

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AU1415083A (en) * 1982-05-21 1983-11-24 Dow Chemical Company, The Multilayer polyamide film
JP3425854B2 (ja) 1997-10-02 2003-07-14 日本電信電話株式会社 低屈折率透明ポリイミド共重合体、及びそれらの前駆体溶液、及びそれらの製造方法
JP2002146021A (ja) 2000-11-10 2002-05-22 Ube Ind Ltd 可溶性、透明なポリイミドおよびその製造法
JP2002348374A (ja) 2001-05-25 2002-12-04 Hitachi Cable Ltd ポリアミック酸又はポリイミド及び液晶配向剤
JP4734837B2 (ja) * 2004-03-23 2011-07-27 宇部興産株式会社 接着性の改良されたポリイミドフィルム、その製造方法および積層体
CN1960870A (zh) * 2004-05-31 2007-05-09 株式会社钟化 聚酰亚胺层合体及其制造方法
JP2008044230A (ja) * 2006-08-16 2008-02-28 Toyobo Co Ltd 多層ポリイミドフィルム及びその製造方法
WO2008146637A1 (ja) 2007-05-24 2008-12-04 Mitsubishi Gas Chemical Company, Inc. 無色透明樹脂フィルムの製造方法及び製造装置
KR101550005B1 (ko) * 2007-08-03 2015-09-03 가부시키가이샤 가네카 다층 폴리이미드 필름, 적층판 및 금속장 적층판
CN102414024A (zh) * 2009-04-28 2012-04-11 宇部兴产株式会社 多层聚酰亚胺膜
JP5545033B2 (ja) * 2010-05-25 2014-07-09 東洋紡株式会社 積層体およびその製造方法
WO2012141994A2 (en) * 2011-04-15 2012-10-18 Avery Dennison Corporation Surface treated film and/or laminate
KR101514221B1 (ko) 2011-12-07 2015-04-23 에스케이이노베이션 주식회사 다층 폴리이미드 구조의 연성금속적층판 제조방법
KR102034762B1 (ko) * 2012-06-20 2019-10-21 도요보 가부시키가이샤 적층체의 제조방법, 적층체, 이 적층체를 이용한 디바이스 부가 적층체의 제조방법, 및 디바이스 부가 적층체
JP2014137486A (ja) * 2013-01-17 2014-07-28 Ricoh Co Ltd ポリイミドベルトの製造方法
CN105073851B (zh) * 2013-04-03 2018-08-28 三井化学株式会社 聚酰胺酸、包含该聚酰胺酸的清漆、以及聚酰亚胺膜
KR101869173B1 (ko) 2014-02-14 2018-06-19 아사히 가세이 가부시키가이샤 폴리이미드 전구체 및 그것을 함유하는 수지 조성물
JP6420064B2 (ja) * 2014-06-03 2018-11-07 旭化成株式会社 ポリイミド前駆体組成物及びポリイミドフィルム
KR20240049649A (ko) * 2015-10-15 2024-04-16 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 폴리이미드 적층체 및 그 제조방법
JPWO2018088543A1 (ja) 2016-11-11 2019-10-10 宇部興産株式会社 ポリイミドフィルムとハードコート層とを含む積層体
CN106985483B (zh) * 2017-03-15 2019-01-04 嘉浦薄膜新材料(昆山)有限公司 一种高性能包装用复合薄膜
US11274182B2 (en) * 2017-05-11 2022-03-15 Kaneka Corporation Poly(amic acid), poly(amic acid) solution, polyimide, polyimide film, layered product, flexible device, and production method for polyimide film
CN108515751A (zh) * 2018-03-15 2018-09-11 天津工业大学 含介孔氧化硅中间层的聚酰胺复合纳滤膜及其制备方法
JP7099019B2 (ja) * 2018-04-09 2022-07-12 大日本印刷株式会社 ポリイミド積層体の製造方法、及びポリイミドフィルムの製造方法
JP7222089B2 (ja) * 2019-06-27 2023-02-14 日鉄ケミカル&マテリアル株式会社 樹脂フィルム、金属張積層体及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02126974A (ja) * 1988-06-23 1990-05-15 Toray Ind Inc ポリイミド積層膜の製造方法
WO2005115752A1 (ja) * 2004-05-31 2005-12-08 Kaneka Corporation ポリイミド積層体およびその製造方法
JP2007176160A (ja) * 2005-12-01 2007-07-12 Ist Corp 多層ポリイミド管状物及びその製造方法並びに樹脂管状物の製造装置
JP2010155360A (ja) * 2008-12-26 2010-07-15 Nippon Steel Chem Co Ltd 透明絶縁樹脂層を有する配線基板用積層体
WO2016129329A1 (ja) * 2015-02-09 2016-08-18 コニカミノルタ株式会社 透明耐熱性積層フィルムの製造方法、透明耐熱性積層フィルム、フレキシブルプリント基板、フレキシブルディスプレイ用基板、フレキシブルディスプレイ用前面板、led照明装置及び有機エレクトロルミネッセンス表示装置
WO2018186262A1 (ja) * 2017-04-06 2018-10-11 大日本印刷株式会社 ポリイミドフィルム、積層体、及びディスプレイ用表面材

Also Published As

Publication number Publication date
CN115461221B (zh) 2023-12-29
WO2021241573A1 (ja) 2021-12-02
JP7287536B2 (ja) 2023-06-06
CN117656622A (zh) 2024-03-08
JP2022117986A (ja) 2022-08-12
CN115461221A (zh) 2022-12-09
KR20230019064A (ko) 2023-02-07
TW202202555A (zh) 2022-01-16
JP7107451B2 (ja) 2022-07-27

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