JPWO2021182157A5 - - Google Patents
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- Publication number
- JPWO2021182157A5 JPWO2021182157A5 JP2022505930A JP2022505930A JPWO2021182157A5 JP WO2021182157 A5 JPWO2021182157 A5 JP WO2021182157A5 JP 2022505930 A JP2022505930 A JP 2022505930A JP 2022505930 A JP2022505930 A JP 2022505930A JP WO2021182157 A5 JPWO2021182157 A5 JP WO2021182157A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- conductor
- laminate
- conductors
- internal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 46
- 229920005989 resin Polymers 0.000 claims description 25
- 239000011347 resin Substances 0.000 claims description 25
- 239000000758 substrate Substances 0.000 claims description 10
- 239000007769 metal material Substances 0.000 claims description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims 8
- 239000012790 adhesive layer Substances 0.000 claims 1
- 229920005992 thermoplastic resin Polymers 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020042128 | 2020-03-11 | ||
| JP2020042128 | 2020-03-11 | ||
| PCT/JP2021/007750 WO2021182157A1 (ja) | 2020-03-11 | 2021-03-01 | 樹脂多層基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021182157A1 JPWO2021182157A1 (https=) | 2021-09-16 |
| JPWO2021182157A5 true JPWO2021182157A5 (https=) | 2022-10-27 |
| JP7400941B2 JP7400941B2 (ja) | 2023-12-19 |
Family
ID=77671808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022505930A Active JP7400941B2 (ja) | 2020-03-11 | 2021-03-01 | 樹脂多層基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11751321B2 (https=) |
| JP (1) | JP7400941B2 (https=) |
| CN (1) | CN217936041U (https=) |
| WO (1) | WO2021182157A1 (https=) |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03129895A (ja) * | 1989-10-16 | 1991-06-03 | Matsushita Electric Ind Co Ltd | 高周波多層基板 |
| JP2603022Y2 (ja) * | 1990-04-25 | 2000-02-14 | 株式会社アドバンテスト | プリント基板伝送路 |
| JPH0786814A (ja) * | 1993-09-10 | 1995-03-31 | Murata Mfg Co Ltd | 平行ストリップラインケーブルの製造方法 |
| JP2000269616A (ja) * | 1999-03-17 | 2000-09-29 | Kuraray Co Ltd | 高周波回路基板 |
| JP4051989B2 (ja) | 2002-04-12 | 2008-02-27 | 株式会社デンソー | 多層配線基板の製造方法 |
| KR100898247B1 (ko) * | 2007-10-24 | 2009-05-18 | 주식회사 동부하이텍 | 반도체형 ｒｆ소자 |
| WO2010103940A1 (ja) * | 2009-03-09 | 2010-09-16 | 株式会社村田製作所 | 樹脂配線基板 |
| JP2013089841A (ja) * | 2011-10-20 | 2013-05-13 | Kyocer Slc Technologies Corp | 配線基板 |
| JP2016509391A (ja) * | 2012-12-20 | 2016-03-24 | スリーエム イノベイティブ プロパティズ カンパニー | フローティングコネクタシールド |
| JP6344476B2 (ja) | 2014-08-29 | 2018-06-20 | 株式会社村田製作所 | 多層回路基板 |
| JP6669248B2 (ja) | 2016-03-31 | 2020-03-18 | 株式会社村田製作所 | 回路モジュール |
| CN106783812A (zh) * | 2016-12-30 | 2017-05-31 | 上海集成电路研发中心有限公司 | 一种全屏蔽片上共面波导传输结构及其制备方法 |
-
2021
- 2021-03-01 CN CN202190000282.9U patent/CN217936041U/zh active Active
- 2021-03-01 JP JP2022505930A patent/JP7400941B2/ja active Active
- 2021-03-01 WO PCT/JP2021/007750 patent/WO2021182157A1/ja not_active Ceased
-
2022
- 2022-07-13 US US17/863,451 patent/US11751321B2/en active Active
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