JPWO2021106732A1 - - Google Patents

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Publication number
JPWO2021106732A1
JPWO2021106732A1 JP2021561356A JP2021561356A JPWO2021106732A1 JP WO2021106732 A1 JPWO2021106732 A1 JP WO2021106732A1 JP 2021561356 A JP2021561356 A JP 2021561356A JP 2021561356 A JP2021561356 A JP 2021561356A JP WO2021106732 A1 JPWO2021106732 A1 JP WO2021106732A1
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JP
Japan
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JP2021561356A
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Japanese (ja)
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JP7676319B2 (ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/7795—Circuitry for generating timing or clock signals
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/812—Arrangements for transferring the charges in the image sensor perpendicular to the imaging plane, e.g. buried regions used to transfer generated charges to circuitry under the photosensitive region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/813—Electronic components shared by multiple pixels, e.g. one amplifier shared by two pixels
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B1/00—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor
    • A61B1/04—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances
    • A61B1/05—Instruments for performing medical examinations of the interior of cavities or tubes of the body by visual or photographical inspection, e.g. endoscopes; Illuminating arrangements therefor combined with photographic or television appliances characterised by the image sensor, e.g. camera, being in the distal end portion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
    • H10F39/184—Infrared image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP2021561356A 2019-11-29 2020-11-19 撮像装置および電子機器 Active JP7676319B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019216511 2019-11-29
JP2019216511 2019-11-29
PCT/JP2020/043142 WO2021106732A1 (ja) 2019-11-29 2020-11-19 撮像装置および電子機器

Publications (2)

Publication Number Publication Date
JPWO2021106732A1 true JPWO2021106732A1 (https=) 2021-06-03
JP7676319B2 JP7676319B2 (ja) 2025-05-14

Family

ID=76129388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021561356A Active JP7676319B2 (ja) 2019-11-29 2020-11-19 撮像装置および電子機器

Country Status (7)

Country Link
US (2) US11973102B2 (https=)
EP (1) EP4068361B1 (https=)
JP (1) JP7676319B2 (https=)
KR (2) KR102859488B1 (https=)
CN (1) CN114667605B (https=)
TW (1) TWI901611B (https=)
WO (1) WO2021106732A1 (https=)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023032049A (ja) * 2021-08-26 2023-03-09 キオクシア株式会社 半導体装置
WO2023091898A1 (en) * 2021-11-16 2023-05-25 Hsu Fu Chang Advanced structures having mosfet transistors and metal layers
TW202329439A (zh) * 2021-12-10 2023-07-16 日商索尼半導體解決方案公司 光檢測裝置及電子機器
US12327804B2 (en) * 2022-05-13 2025-06-10 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor device and manufacturing method thereof
WO2023243222A1 (ja) * 2022-06-15 2023-12-21 ソニーセミコンダクタソリューションズ株式会社 撮像装置
US12408466B2 (en) 2022-07-11 2025-09-02 Taiwan Semiconductor Manufacturing Company, Ltd. High-speed readout image sensor
TWI884427B (zh) * 2022-08-26 2025-05-21 台灣積體電路製造股份有限公司 影像感測器與其形成方法
US12407957B1 (en) * 2022-12-22 2025-09-02 Apple Inc. Multiple-substrate high conversion gain pixels
US20240250098A1 (en) * 2023-01-25 2024-07-25 Taiwan Semiconductor Manufacturing Company, Ltd. Image sensor device and method of manufacturing the same
WO2025047167A1 (ja) * 2023-08-25 2025-03-06 ソニーセミコンダクタソリューションズ株式会社 光検出装置
WO2025126676A1 (ja) * 2023-12-14 2025-06-19 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置及び電子機器
WO2025142996A1 (ja) * 2023-12-28 2025-07-03 ソニーセミコンダクタソリューションズ株式会社 光検出装置
WO2026023245A1 (ja) * 2024-07-22 2026-01-29 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011166170A (ja) * 2011-05-16 2011-08-25 Sony Corp 固体撮像装置、固体撮像装置の駆動方法、及び電子機器
JP2012147169A (ja) * 2011-01-11 2012-08-02 Renesas Electronics Corp 固体撮像装置
WO2017043343A1 (ja) * 2015-09-11 2017-03-16 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器
WO2018186026A1 (ja) * 2017-04-04 2018-10-11 ソニーセミコンダクタソリューションズ株式会社 半導体装置、半導体装置の製造方法、及び電子機器

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201101476A (en) * 2005-06-02 2011-01-01 Sony Corp Semiconductor image sensor module and method of manufacturing the same
US7965329B2 (en) * 2008-09-09 2011-06-21 Omnivision Technologies, Inc. High gain read circuit for 3D integrated pixel
JP5985136B2 (ja) * 2009-03-19 2016-09-06 ソニー株式会社 半導体装置とその製造方法、及び電子機器
JP5482025B2 (ja) * 2009-08-28 2014-04-23 ソニー株式会社 固体撮像装置とその製造方法、及び電子機器
JP2012015400A (ja) * 2010-07-02 2012-01-19 Canon Inc 固体撮像装置
JP2012156310A (ja) * 2011-01-26 2012-08-16 Sony Corp 固体撮像素子、固体撮像素子の製造方法、および電子機器
JP2013187360A (ja) * 2012-03-08 2013-09-19 Sony Corp 固体撮像装置、及び、電子機器
JP2014022561A (ja) 2012-07-18 2014-02-03 Sony Corp 固体撮像装置、及び、電子機器
JP2014209696A (ja) * 2012-07-23 2014-11-06 ソニー株式会社 固体撮像装置、信号読み出し方法、および電子機器
ES2476115B1 (es) * 2012-12-11 2015-04-20 Consejo Superior De Investigaciones Científicas (Csic) Metodo y dispositivo para la deteccion de la variacion temporal de la intensidad luminosa en una matriz de fotosensores
JP2015032687A (ja) * 2013-08-02 2015-02-16 ソニー株式会社 撮像素子、電子機器、および撮像素子の製造方法
JP6413235B2 (ja) * 2013-12-06 2018-10-31 株式会社ニコン 撮像素子および撮像装置
KR20220100106A (ko) * 2014-06-09 2022-07-14 가부시키가이샤 한도오따이 에네루기 켄큐쇼 촬상 장치
CN107408565B (zh) * 2015-03-03 2021-07-20 索尼公司 半导体装置和电子设备
JP6856974B2 (ja) * 2015-03-31 2021-04-14 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および電子機器
KR102656723B1 (ko) * 2015-04-07 2024-04-12 소니그룹주식회사 고체 촬상 소자 및 전자 장치
JP6808316B2 (ja) * 2015-12-04 2021-01-06 キヤノン株式会社 撮像装置、および、撮像システム
JP2017117828A (ja) * 2015-12-21 2017-06-29 ソニー株式会社 固体撮像素子および電子装置
JP6832649B2 (ja) * 2016-08-17 2021-02-24 ブリルニクス インク 固体撮像装置、固体撮像装置の駆動方法、および電子機器
CN110050345B (zh) * 2016-12-09 2023-11-14 索尼半导体解决方案公司 固态图像拾取元件和电子装置
US9888197B1 (en) * 2017-01-04 2018-02-06 Semiconductor Components Industries, Llc Methods and apparatus for a CMOS image sensor with an in-pixel amplifier
JP7193907B2 (ja) * 2017-01-23 2022-12-21 キヤノン株式会社 固体撮像装置
JP6957157B2 (ja) * 2017-01-26 2021-11-02 キヤノン株式会社 固体撮像装置、撮像システム、および固体撮像装置の製造方法
JP7121468B2 (ja) * 2017-02-24 2022-08-18 ブリルニクス シンガポール プライベート リミテッド 固体撮像装置、固体撮像装置の製造方法、および電子機器
JP2018174231A (ja) * 2017-03-31 2018-11-08 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、および電子機器
JP2018182462A (ja) * 2017-04-07 2018-11-15 ルネサスエレクトロニクス株式会社 撮像素子
JP2018186211A (ja) * 2017-04-27 2018-11-22 ルネサスエレクトロニクス株式会社 半導体装置およびその製造方法
JP6963873B2 (ja) * 2017-05-26 2021-11-10 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子、固体撮像素子の製造方法および電子機器
JP2018206837A (ja) * 2017-05-31 2018-12-27 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および固体撮像装置の製造方法、並びに電子機器
JP7064322B2 (ja) * 2017-12-06 2022-05-10 キヤノン株式会社 電子機器およびその制御方法、ならびに撮像素子
WO2019130702A1 (ja) * 2017-12-27 2019-07-04 ソニーセミコンダクタソリューションズ株式会社 撮像装置
JP7118658B2 (ja) * 2018-02-09 2022-08-16 キヤノン株式会社 撮像装置、撮像システム、移動体
JP7080660B2 (ja) * 2018-02-09 2022-06-06 キヤノン株式会社 光電変換装置、撮像システム、および、移動体
WO2019181456A1 (ja) * 2018-03-19 2019-09-26 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および固体撮像装置
CN112119500B (zh) * 2018-05-21 2025-06-17 索尼公司 固态摄像元件及其制造方法
JP7129646B2 (ja) 2018-06-11 2022-09-02 パナソニックＩｐマネジメント株式会社 制御システム、プログラム
JP2020068289A (ja) * 2018-10-24 2020-04-30 キヤノン株式会社 光電変換装置、撮像システム、移動体、および積層用の半導体チップ

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012147169A (ja) * 2011-01-11 2012-08-02 Renesas Electronics Corp 固体撮像装置
JP2011166170A (ja) * 2011-05-16 2011-08-25 Sony Corp 固体撮像装置、固体撮像装置の駆動方法、及び電子機器
WO2017043343A1 (ja) * 2015-09-11 2017-03-16 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器
WO2018186026A1 (ja) * 2017-04-04 2018-10-11 ソニーセミコンダクタソリューションズ株式会社 半導体装置、半導体装置の製造方法、及び電子機器

Also Published As

Publication number Publication date
JP7676319B2 (ja) 2025-05-14
TW202139443A (zh) 2021-10-16
EP4068361A4 (en) 2022-12-28
US20240258356A1 (en) 2024-08-01
KR20250136941A (ko) 2025-09-16
KR20220110182A (ko) 2022-08-05
US11973102B2 (en) 2024-04-30
CN114667605A (zh) 2022-06-24
WO2021106732A1 (ja) 2021-06-03
CN114667605B (zh) 2025-08-26
TWI901611B (zh) 2025-10-21
EP4068361B1 (en) 2026-02-25
KR102859488B1 (ko) 2025-09-16
EP4068361A1 (en) 2022-10-05
US20220392942A1 (en) 2022-12-08

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