JPWO2021079434A1 - 半導体ウエハおよびその製造方法 - Google Patents
半導体ウエハおよびその製造方法 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 235000012431 wafers Nutrition 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 152
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 144
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 144
- 239000010703 silicon Substances 0.000 claims abstract description 144
- 229910002601 GaN Inorganic materials 0.000 claims abstract description 87
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims abstract description 87
- 238000000034 method Methods 0.000 claims abstract description 46
- 238000005530 etching Methods 0.000 claims description 30
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 13
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 13
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
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Abstract
Description
本願の発明に係る半導体ウエハでは、絶縁層によりシリコン基板の反りを抑制できる。
図1は、実施の形態1に係る半導体ウエハ100の断面図である。半導体ウエハ100は、シリコン基板10を備える。シリコン基板10の上面には窒化ガリウム成長層12が設けられる。窒化ガリウム成長層12は、複数の小区画13に分割されている。複数の小区画13は互いに離間している。窒化ガリウム成長層は、例えばIn1−x−yGaxAlyN層を含む多層膜である。ここで、0≦x≦1、0≦y≦1である。
図6は、実施の形態2に係る半導体ウエハ200の断面図である。半導体ウエハ200では、絶縁膜214の構造が半導体ウエハ100と異なる。絶縁膜214には、複数の小区画13のうち互いに隣接する一対の小区画13の間に凹部215が形成される。
図9は、実施の形態3に係る半導体ウエハ300の断面図である。半導体ウエハ300はシリコン基板310の構造が半導体ウエハ100と異なる。シリコン基板310の上面側には複数の凸部310aが形成される。複数の小区画13は、複数の凸部310aの上にそれぞれ設けられる。
図10は、実施の形態4に係る半導体ウエハ400の断面図である。本実施の形態では、シリコン基板10の上面に熱酸化膜16が設けられる。熱酸化膜16の上には絶縁膜14が設けられる。熱酸化膜16と絶縁膜14は絶縁層を形成する。
本願の発明に係る半導体ウエハの製造方法は、シリコン基板の上面に複数の小区画に分割された窒化ガリウム成長層を形成する第1工程と、該複数の小区画の間を絶縁膜で埋める第2工程と、を備え、該絶縁膜は該窒化ガリウム成長層が該シリコン基板に及ぼす応力と反対方向の応力を該シリコン基板に及ぼし、該絶縁膜はシリコン窒化膜である。
本願の発明に係る半導体ウエハの製造方法は、シリコン基板の上面に複数の小区画に分割された窒化ガリウム成長層を形成する第1工程と、該複数の小区画の間を絶縁膜で埋める第2工程と、を備え、該絶縁膜は該窒化ガリウム成長層が該シリコン基板に及ぼす応力と反対方向の応力を該シリコン基板に及ぼし、該第2工程は、該シリコン基板の上面と、該複数の小区画の各々の側面および上面と、を該絶縁膜で覆い、該絶縁膜のうち互いに隣接する一対の小区画の間の部分に凹部を形成する工程と、該凹部を埋めるように、該絶縁膜の上にレジストを設ける工程と、該レジストのうち該複数の小区画の上面よりも上に設けられた部分と、該絶縁膜のうち該複数の小区画の上面よりも上に設けられた部分と、をエッチングにより除去し、該複数の小区画の上面を該絶縁膜から露出させるエッチング工程と、該エッチング工程の後に、該レジストのうち該凹部を埋める部分を除去する工程と、を備える。
本願の発明に係る半導体ウエハの製造方法は、シリコン基板の上面に複数の小区画に分割された窒化ガリウム成長層を形成する第1工程と、該複数の小区画の間を絶縁膜で埋める第2工程と、を備え、該絶縁膜は該窒化ガリウム成長層が該シリコン基板に及ぼす応力と反対方向の応力を該シリコン基板に及ぼし、該第2工程は、該シリコン基板の上面と、該複数の小区画の各々の側面および上面と、を該絶縁膜で覆い、該絶縁膜のうち互いに隣接する一対の小区画の間の部分に凹部を形成する工程と、該凹部を埋めるように、該絶縁膜の上にレジストを設ける工程と、該レジストのうち該複数の小区画の上面よりも上に設けられた部分と、該絶縁膜のうち該複数の小区画の上面よりも上に設けられた部分と、をエッチングにより除去し、該複数の小区画の上面を該絶縁膜から露出させるエッチング工程と、該エッチング工程の後に、該レジストのうち該凹部を埋める部分を除去する工程と、を備える。
Claims (19)
- シリコン基板の上面に複数の小区画に分割された窒化ガリウム成長層を形成する第1工程と、
前記複数の小区画の間を絶縁膜で埋める第2工程と、
を備え、
前記絶縁膜は前記窒化ガリウム成長層が前記シリコン基板に及ぼす応力と反対方向の応力を前記シリコン基板に及ぼすことを特徴とする半導体ウエハの製造方法。 - 前記絶縁膜の厚さは1μm以上であり、前記窒化ガリウム成長層の厚さ以下であることを特徴とする請求項1に記載の半導体ウエハの製造方法。
- 前記絶縁膜はシリコン窒化膜であることを特徴とする請求項1または2に記載の半導体ウエハの製造方法。
- 前記窒化ガリウム成長層は、前記シリコン基板に圧縮応力を及ぼし、
前記第2工程では、プロセスガスとしてSiH4とNH3を用い、NH3に対するSiH4の比率を0.5以下に設定してプラズマCVDにより前記絶縁膜を形成することを特徴とする請求項3に記載の半導体ウエハの製造方法。 - 前記第2工程は、
前記シリコン基板の上面と、前記複数の小区画の各々の側面および上面と、を前記絶縁膜で覆い、前記絶縁膜のうち互いに隣接する一対の小区画の間の部分に凹部を形成する工程と、
前記凹部を埋めるように、前記絶縁膜の上にレジストを設ける工程と、
前記レジストのうち前記複数の小区画の上面よりも上に設けられた部分と、前記絶縁膜のうち前記複数の小区画の上面よりも上に設けられた部分と、をエッチングにより除去し、前記複数の小区画の上面を前記絶縁膜から露出させるエッチング工程と、
前記エッチング工程の後に、前記レジストのうち前記凹部を埋める部分を除去する工程と、
を備えることを特徴とする請求項1から4の何れか1項に記載の半導体ウエハの製造方法。 - 前記第1工程は、
前記シリコン基板の上面に熱酸化膜を形成し、前記シリコン基板の上面を前記熱酸化膜で複数の領域に区切る工程と、
前記複数の領域に前記複数の小区画をそれぞれ成長させる工程と、
を備えることを特徴とする請求項1から5の何れか1項に記載の半導体ウエハの製造方法。 - 前記第1工程では、前記複数の小区画を成長させたあとに前記熱酸化膜を除去することを特徴とする請求項6に記載の半導体ウエハの製造方法。
- 前記第2工程では、前記熱酸化膜の上に前記絶縁膜を形成することを特徴とする請求項6に記載の半導体ウエハの製造方法。
- 前記絶縁膜は、前記熱酸化膜よりも厚いことを特徴とする請求項6から8の何れか1項に記載の半導体ウエハの製造方法。
- 前記第1工程は、
前記シリコン基板の上面に前記窒化ガリウム成長層を形成する工程と、
前記窒化ガリウム成長層の一部をエッチングにより除去して前記シリコン基板を露出させ、前記窒化ガリウム成長層を前記複数の小区画に分割するエッチング工程と、
を備え、
前記エッチング工程では、前記シリコン基板が露出したあともエッチングを続行し、前記シリコン基板に溝を形成することを特徴とする請求項1から5の何れか1項に記載の半導体ウエハの製造方法。 - 前記絶縁膜は、前記シリコン基板の一端から他端まで連なることを特徴とする請求項1から10の何れか1項に記載の半導体ウエハの製造方法。
- シリコン基板と、
前記シリコン基板の上面に設けられ、複数の小区画に分割された窒化ガリウム成長層と、
前記シリコン基板の上面に設けられ、前記複数の小区画の間を埋める絶縁層と、
を備え、
前記絶縁層は前記窒化ガリウム成長層が前記シリコン基板に及ぼす応力と反対方向の応力を前記シリコン基板に及ぼすことを特徴とする半導体ウエハ。 - 前記絶縁層の厚さは1μm以上であり、前記窒化ガリウム成長層の厚さ以下であることを特徴とする請求項12に記載の半導体ウエハ。
- 前記絶縁層は、シリコン窒化膜を含むことを特徴とする請求項12または13に記載の半導体ウエハ。
- 前記絶縁層には、前記複数の小区画のうち互いに隣接する一対の小区画の間に凹部が形成されることを特徴とする請求項12から14の何れか1項に記載の半導体ウエハ。
- 前記シリコン基板の上面側には複数の凸部が形成され、
前記複数の小区画は、前記複数の凸部の上にそれぞれ設けられることを特徴とする請求項12から15の何れか1項に記載の半導体ウエハ。 - 前記絶縁層は、前記シリコン基板の上面に設けられた熱酸化膜と、前記熱酸化膜の上に設けられた絶縁膜と、を有することを特徴とする請求項12から15の何れか1項に記載の半導体ウエハ。
- 前記絶縁膜は、前記熱酸化膜よりも厚いことを特徴とする請求項17に記載の半導体ウエハ。
- 前記絶縁層は、前記シリコン基板の一端から他端まで連なることを特徴とする請求項12から18の何れか1項に記載の半導体ウエハ。
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