JPWO2021025055A5 - - Google Patents
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- JPWO2021025055A5 JPWO2021025055A5 JP2021537342A JP2021537342A JPWO2021025055A5 JP WO2021025055 A5 JPWO2021025055 A5 JP WO2021025055A5 JP 2021537342 A JP2021537342 A JP 2021537342A JP 2021537342 A JP2021537342 A JP 2021537342A JP WO2021025055 A5 JPWO2021025055 A5 JP WO2021025055A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- group
- resin layer
- multilayer substrate
- resin layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 229920005989 resin Polymers 0.000 claims description 381
- 239000011347 resin Substances 0.000 claims description 381
- 239000000758 substrate Substances 0.000 claims description 95
- 239000000463 material Substances 0.000 claims description 61
- 125000000962 organic group Chemical group 0.000 claims description 53
- 239000004020 conductor Substances 0.000 claims description 51
- 239000000654 additive Substances 0.000 claims description 27
- 230000000996 additive effect Effects 0.000 claims description 25
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 claims description 21
- 229920000642 polymer Polymers 0.000 claims description 21
- 125000004185 ester group Chemical group 0.000 claims description 18
- 125000000217 alkyl group Chemical group 0.000 claims description 15
- 125000001033 ether group Chemical group 0.000 claims description 15
- 238000010030 laminating Methods 0.000 claims description 14
- 230000001965 increasing effect Effects 0.000 claims description 10
- 125000001424 substituent group Chemical group 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 8
- 125000003342 alkenyl group Chemical group 0.000 claims description 8
- 125000005370 alkoxysilyl group Chemical group 0.000 claims description 8
- 125000000304 alkynyl group Chemical group 0.000 claims description 8
- 125000003710 aryl alkyl group Chemical group 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 125000003700 epoxy group Chemical group 0.000 claims description 8
- 229910052736 halogen Inorganic materials 0.000 claims description 7
- 150000002367 halogens Chemical class 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000001257 hydrogen Substances 0.000 claims description 7
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 7
- 125000000468 ketone group Chemical group 0.000 claims description 7
- 125000002560 nitrile group Chemical group 0.000 claims description 7
- 238000010521 absorption reaction Methods 0.000 claims description 4
- 230000002708 enhancing effect Effects 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 239000010410 layer Substances 0.000 description 254
- 238000004381 surface treatment Methods 0.000 description 20
- 238000004519 manufacturing process Methods 0.000 description 17
- 230000009477 glass transition Effects 0.000 description 16
- 239000002344 surface layer Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 239000011229 interlayer Substances 0.000 description 13
- 238000010438 heat treatment Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000000126 substance Substances 0.000 description 10
- 238000011282 treatment Methods 0.000 description 8
- 229910052724 xenon Inorganic materials 0.000 description 8
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 8
- -1 heptynyl groups Chemical group 0.000 description 7
- 239000000203 mixture Substances 0.000 description 7
- 238000007747 plating Methods 0.000 description 7
- 238000005809 transesterification reaction Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000002238 attenuated effect Effects 0.000 description 4
- 150000001735 carboxylic acids Chemical class 0.000 description 4
- 239000003112 inhibitor Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 3
- 239000004813 Perfluoroalkoxy alkane Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229920011301 perfluoro alkoxyl alkane Polymers 0.000 description 3
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 238000003848 UV Light-Curing Methods 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000007142 ring opening reaction Methods 0.000 description 2
- 229930195734 saturated hydrocarbon Natural products 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 125000004972 1-butynyl group Chemical group [H]C([H])([H])C([H])([H])C#C* 0.000 description 1
- 125000000530 1-propynyl group Chemical group [H]C([H])([H])C#C* 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 125000000069 2-butynyl group Chemical group [H]C([H])([H])C#CC([H])([H])* 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- 125000001494 2-propynyl group Chemical group [H]C#CC([H])([H])* 0.000 description 1
- ATRRKUHOCOJYRX-UHFFFAOYSA-N Ammonium bicarbonate Chemical compound [NH4+].OC([O-])=O ATRRKUHOCOJYRX-UHFFFAOYSA-N 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920006358 Fluon Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 239000001099 ammonium carbonate Substances 0.000 description 1
- 235000012501 ammonium carbonate Nutrition 0.000 description 1
- 238000004873 anchoring Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 125000002178 anthracenyl group Chemical group C1(=CC=CC2=CC3=CC=CC=C3C=C12)* 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 125000000480 butynyl group Chemical group [*]C#CC([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 125000000596 cyclohexenyl group Chemical group C1(=CCCCC1)* 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000005980 hexynyl group Chemical group 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000004899 motility Effects 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000005069 octynyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C#C* 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000003014 phosphoric acid esters Chemical class 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000636 poly(norbornene) polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005204 segregation Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 230000000930 thermomechanical effect Effects 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019144542 | 2019-08-06 | ||
| JP2019144542 | 2019-08-06 | ||
| PCT/JP2020/029985 WO2021025055A1 (ja) | 2019-08-06 | 2020-08-05 | 樹脂多層基板および樹脂多層基板の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2021025055A1 JPWO2021025055A1 (https=) | 2021-02-11 |
| JPWO2021025055A5 true JPWO2021025055A5 (https=) | 2022-03-11 |
| JP7127745B2 JP7127745B2 (ja) | 2022-08-30 |
Family
ID=74502722
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021537342A Active JP7127745B2 (ja) | 2019-08-06 | 2020-08-05 | 樹脂多層基板 |
| JP2021537343A Active JP7127746B2 (ja) | 2019-08-06 | 2020-08-05 | 樹脂シート及び樹脂多層基板 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021537343A Active JP7127746B2 (ja) | 2019-08-06 | 2020-08-05 | 樹脂シート及び樹脂多層基板 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US12120817B2 (https=) |
| JP (2) | JP7127745B2 (https=) |
| CN (2) | CN114174062A (https=) |
| WO (2) | WO2021025056A1 (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112440532A (zh) * | 2019-08-27 | 2021-03-05 | 康宁股份有限公司 | 用于高频印刷电路板应用的有机/无机层叠体 |
| JP7260054B2 (ja) * | 2020-03-06 | 2023-04-18 | 株式会社村田製作所 | 液晶ポリマーフィルムおよびその製造方法 |
| JP7749349B2 (ja) * | 2021-06-14 | 2025-10-06 | 株式会社Ｅｎｅｏｓマテリアル | フィブリル状液晶ポリマー粒子の製造方法 |
| WO2023032376A1 (ja) * | 2021-08-31 | 2023-03-09 | 株式会社村田製作所 | 液晶ポリマーフィルムおよび液晶ポリマーフィルムの製造方法 |
| JPWO2023210471A1 (https=) * | 2022-04-28 | 2023-11-02 | ||
| CN117024911A (zh) * | 2023-05-30 | 2023-11-10 | 深圳聚源新材科技有限公司 | 一种热膨胀系数可调的复合材料及其制备方法 |
| CN116731418A (zh) * | 2023-05-30 | 2023-09-12 | 深圳聚源新材科技有限公司 | 一种热膨胀系数可调的复合材料及其制备方法 |
| CN116552075A (zh) * | 2023-05-30 | 2023-08-08 | 深圳聚源新材科技有限公司 | 一种含热膨胀系数可调材料的复合材料及其应用 |
| JPWO2025134699A1 (https=) * | 2023-12-22 | 2025-06-26 |
Family Cites Families (38)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4161470A (en) | 1977-10-20 | 1979-07-17 | Celanese Corporation | Polyester of 6-hydroxy-2-naphthoic acid and para-hydroxy benzoic acid capable of readily undergoing melt processing |
| JP2805225B2 (ja) * | 1989-11-18 | 1998-09-30 | 日本ゼオン株式会社 | プラスチック成形品の接着方法 |
| CA2060494A1 (en) | 1991-02-13 | 1992-08-14 | Elena S. Percec | Polymer composites of thermoplastic and liquid crystal polymers and a process for their preparation |
| AU656371B2 (en) * | 1991-03-18 | 1995-02-02 | Hoechst Aktiengesellschaft | Alloys of cycloolefin polymers and liquid-crystal polyesters |
| JP3169984B2 (ja) * | 1991-05-24 | 2001-05-28 | 日本ゼオン株式会社 | 硬化層を有する熱可塑性飽和ノルボルネン系ポリマー成形品およびその製造方法 |
| KR960007471B1 (ko) * | 1991-09-30 | 1996-06-03 | 마쓰다 가부시끼가이샤 | 액정수지 복합체의 성형방법 |
| USH1502H (en) | 1993-08-17 | 1995-11-07 | Fiberweb North America, Inc. | Meltblown fibers and webs produced from liquid crystal polymers |
| AU713820B2 (en) | 1995-10-16 | 1999-12-09 | Sumitomo Electric Industries, Ltd. | Optical fiber diffraction grating, a method of fabricating thereof and a laser light source |
| US20020045042A1 (en) | 2000-06-06 | 2002-04-18 | Matsushita Electric Works, Ltd. | Laminate |
| JP3530829B2 (ja) * | 2001-03-12 | 2004-05-24 | 日本ピラー工業株式会社 | 電子部品用フッ素樹脂組成物 |
| WO2003024174A1 (en) * | 2001-09-05 | 2003-03-20 | Zeon Corporation | Mulitilayer circuit board, resin base material, and its production method |
| JP4014964B2 (ja) * | 2001-10-24 | 2007-11-28 | 三井・デュポンフロロケミカル株式会社 | フッ素樹脂積層体及びその製造方法 |
| JP2003171538A (ja) * | 2001-12-07 | 2003-06-20 | Dainippon Ink & Chem Inc | 液晶ポリエステル樹脂組成物 |
| JP2004083681A (ja) * | 2002-08-26 | 2004-03-18 | Hitachi Ltd | 低誘電正接樹脂組成物と液晶ポリマーの複合フィルムおよびそれを用いたフレキシブル配線基板 |
| JP2005175265A (ja) * | 2003-12-12 | 2005-06-30 | Hitachi Chem Co Ltd | 多層配線板用接着シート及び多層配線板の製造方法 |
| JP2005268365A (ja) | 2004-03-17 | 2005-09-29 | Nippon Pillar Packing Co Ltd | 多層プリント回路基板とその製造方法 |
| US7582339B2 (en) | 2004-11-15 | 2009-09-01 | Lg Chem, Ltd. | Biaxial-optical polynorbornene-based film and method of manufacturing the same, integrated optical compensation polarizer having the film and method of manufacturing the polarizer, and liquid crystal display panel containing the film and/or polarizer |
| JP2007070418A (ja) * | 2005-09-06 | 2007-03-22 | Kyocera Chemical Corp | 接着シート、金属箔張積層板及びビルドアップ型多層プリント配線板 |
| US20100252310A1 (en) | 2007-07-27 | 2010-10-07 | Kiyoshige Kojima | Composite for multilayer circuit board |
| TWI453120B (zh) * | 2007-11-15 | 2014-09-21 | Jsr Corp | A raw film of a raw ice sheet having a hard coat layer and a method for producing a raw ethylidene resin film having a hard coat layer |
| KR101046430B1 (ko) | 2008-09-11 | 2011-07-05 | 삼성전기주식회사 | 저유전율 및 저손실 특성을 가진 노르보넨계 중합체, 이를이용한 절연재, 인쇄회로기판 및 기능성 소자 |
| KR101100351B1 (ko) | 2009-02-13 | 2011-12-30 | 삼성전기주식회사 | 저유전율 및 저손실 특성을 가진 노르보넨계 중합체 및 이를 이용한 절연재 |
| JP5717961B2 (ja) | 2009-12-24 | 2015-05-13 | 日本メクトロン株式会社 | フレキシブル回路基板の製造方法 |
| JP2012121956A (ja) * | 2010-12-07 | 2012-06-28 | Sumitomo Bakelite Co Ltd | 付加型ノルボルネン系樹脂、その製造方法、該樹脂を含む樹脂組成物、ならびに該樹脂を含む成形体および該成形体を含む複合部材 |
| JP2011184695A (ja) * | 2011-04-18 | 2011-09-22 | Sumitomo Bakelite Co Ltd | 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板 |
| US8475884B2 (en) | 2011-05-25 | 2013-07-02 | GM Global Technology Operations LLC | Coatings with organic polymeric fillers for molded SMC articles |
| JP2013151638A (ja) * | 2011-12-27 | 2013-08-08 | Yamaichi Electronics Co Ltd | カバーレイフィルム、フレキシブル配線板およびその製造方法 |
| JP2012160741A (ja) * | 2012-03-16 | 2012-08-23 | Sumitomo Bakelite Co Ltd | 樹脂組成物、積層体、配線板および配線板の製造方法 |
| WO2014188830A1 (ja) | 2013-05-22 | 2014-11-27 | 株式会社村田製作所 | フィブリル化液晶ポリマーパウダー、フィブリル化液晶ポリマーパウダーの製造方法、ペースト、樹脂多層基板、および、樹脂多層基板の製造方法 |
| CN107000402A (zh) * | 2015-03-06 | 2017-08-01 | 株式会社村田制作所 | 复合体薄片及其制造方法、树脂多层基板及其制造方法 |
| JP6819579B2 (ja) * | 2015-05-11 | 2021-01-27 | Ａｇｃ株式会社 | プリント基板用材料、金属積層板、それらの製造方法およびプリント基板の製造方法 |
| CN108136732B (zh) * | 2015-09-28 | 2021-03-09 | 日本瑞翁株式会社 | 层叠体及其制造方法、以及柔性印刷基板 |
| JP2017164905A (ja) * | 2016-03-14 | 2017-09-21 | 昭和電工株式会社 | ノルボルネン化合物付加重合体と金属箔との積層フィルム |
| KR102340434B1 (ko) | 2016-04-11 | 2021-12-16 | 에이지씨 가부시키가이샤 | 적층체, 프린트 기판, 및 적층체의 제조 방법 |
| TWI650358B (zh) | 2017-09-14 | 2019-02-11 | 佳勝科技股份有限公司 | 液晶高分子組成物及高頻複合基板 |
| JP2019065061A (ja) * | 2017-09-28 | 2019-04-25 | Ａｇｃ株式会社 | プリント基板用樹脂組成物および製造方法 |
| JP6950747B2 (ja) | 2017-11-16 | 2021-10-13 | 株式会社村田製作所 | 樹脂多層基板、電子部品およびその実装構造 |
| CN211909269U (zh) | 2017-11-16 | 2020-11-10 | 株式会社村田制作所 | 树脂多层基板、电子部件及其安装构造 |
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2020
- 2020-08-05 CN CN202080054083.6A patent/CN114174062A/zh active Pending
- 2020-08-05 CN CN202080054610.3A patent/CN114208401A/zh active Pending
- 2020-08-05 JP JP2021537342A patent/JP7127745B2/ja active Active
- 2020-08-05 JP JP2021537343A patent/JP7127746B2/ja active Active
- 2020-08-05 WO PCT/JP2020/029986 patent/WO2021025056A1/ja not_active Ceased
- 2020-08-05 WO PCT/JP2020/029985 patent/WO2021025055A1/ja not_active Ceased
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2022
- 2022-01-26 US US17/584,589 patent/US12120817B2/en active Active
- 2022-01-31 US US17/589,087 patent/US20220153943A1/en not_active Abandoned
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2024
- 2024-02-26 US US18/586,832 patent/US20240206060A1/en not_active Abandoned
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