TWI245593B - Embedding resin, wiring substrate using same and process for producing wiring substrate using same - Google Patents

Abstract

An embedding resin for embedding an electronic part in a wiring substrate, includes at least one of a soluble resin and a soluble organic filler as a soluble component to be dissolved with an oxidizing agent.

Description

1245593 V. Description of the invention (1) The invention relates to a method for embedding electronic components such as chip capacitors, chip inductors and chip resistors in a wiring circuit board (wiring). The circuit board or the wiring substrate) is filled with resin (filled resin). A wiring circuit board has an electronic component embedded therein and a system for producing a wiring circuit board using the embedded resin. In particular, the present invention is suitable for a multilayer wiring circuit board for receiving a semiconductor element package, and the like. 2li_Beginning of the skill in recent years' A lot of research has been done on a multi-chip module (muiti) with many semiconductor components configured on a building-up wiring circuit board. -chip module; MCM) ° — an electronic component, such as a chip capacitor, a chip inductor, a chip resistor, and the like, which can usually be surface-mounted on a wiring circuit board formed with a solder. A surface is provided with a wiring layer. However, when the surface of an electronic component is fixed on the surface of a combined wiring circuit board, a set of predetermined fixed areas corresponding to individual electronic components can naturally limit the above-mentioned wiring. The minimum value of the circuit board. In the process of surface = 疋, in some wiring arrangements (processing), the parasitic inductance that is unpopular from the standpoint of traits will increase, which makes it difficult for electronic devices to cope with higher The problem of frequency use. In order to solve the above problems, there have been quite a lot of researches on various

C: \ 2D-00DE \ 91-04 \ 91100717.ptd Page 4 1245593 V. Description of the invention (2) Embedding of electronic parts contained in the above wiring circuit board. Japanese Patent No. 1 999M 26978 discloses a method including publicly fixing an electronic component on a piece of wiring circuit board. The above-mentioned pre-joining board has a set of transmission sheets made of metal foil, and is connected in parallel. The electronic components are transferred to the other n-wire circuit board. However, the above mentioned; J's can be expected to leave-some issues such as the accuracy of the positioning in the fixing process :. Japanese Published Patent No. 2000-1 24352 A multi-layer wiring circuit board has an insulating layer combined on a group of electronic parts embedded in a core substrate of various kinds.乂 The above-mentioned method for embedding electronic components in a core substrate ^ It is necessary to fill resin in the gap between the core substrate and the electronic components. 2 The electrodes of the electronic components and the wiring formed on the insulating layer can be obtained by Such as electron-deficient metal flakes. In the above example, a general dare resin cannot sufficiently adhere to deposits (metal flakes) such as wiring, and will cause a problem of deposit foaming on a reliability test (for example, in FIG. 5 2 of 9). SUMMARY OF THE INVENTION An object of the present invention is to provide an embedded resin that can improve the mounting density (mounting dens 1 ty) of a wiring circuit board having electronic components installed therein, and is useful for, for example, impact resistance tests and water resistance tests. Reliability test, with high reliability, a method for manufacturing a wiring circuit board using the embedded resin and a wiring circuit board using the embedded resin. The embedded resin of the present invention contains at least a soluble resin and a soluble organic filler

C: \ 2D-C0DE \ 91-04 \ 91100717.ptd 1245593 V. Description of the invention (3) Soluble ingredients dissolved by oxidant. By selectively dissolving and removing the soluble resin and the dissolving organic filler contained in the embedded resin and having an oxidizing agent, the surface of the resin can be easily roughened, so as to exert the effect of obtaining a desired wiring. As a result, even a wiring circuit board with a capacitor incorporated therein can be set with a minimum amount of wiring adhesion reliability, and a $ 1 large current flows on a resin formed with a capacitor embedded therein. Power supply wiring (p〇wer sUppiy wiring). Detailed description of the invention Regarding the soluble resin that can be dissolved with an oxidizing agent, a modified (mojH led) butadiene rubber can be used to obtain the advantage of a good rough surface. = In some details, in the acrylonitrile butadiene rubber containing carboxyl group, the preferred examples are: acrylonitrile butadiene rubber that stops at the carboxyl group (ctb 趵, acrylonitrile rubber containing carboxyl group, NBR, modified Weaning its butyl butadiene-Γ 虱 虱 butyrene, modified cis butylene di =, is a liquid rubber soluble in oxidants, which has particularly good rough properties. Coincidentally: j A soluble organic filler which is dissolved with an oxidizing agent may be used in any known resin soluble in an oxidizing agent, preferably a cross-linked filler, an organic propionate Λ. It is filled with a succinic diluent filler, an oxygen resin. The agent is a filler, ring and can be adjusted due to these fillers: the size of the non-flat surface of the organic filler's organic solvent. It is easy to adjust the formation of the rough far soluble resin and / or soluble The organic rhenium resin is 1 to 30 weight percent = true 4 charge. The amount of use based on the reason is more preferably 1 to 10 weight percent., Preferably 1 to 20 weight percent,

1245593 V. Description of the invention (4) 50: Application: = The diameter of the T-soluble organic filler is preferably not larger than the resin into which the resin easily flows through the gap between the thunder electrodes of the electronic part ( gap) is required. This is because when the amount of the soluble organic filler and the agent exceeds 50 micrometers, the soluble organic filler will easily block the thunder + the next day of the electronic part; the base is filled, and There is a month Qiu B ′, which results in insufficient embedded resin. There are different thermal expansion coefficients in the taxi. The diameters of Ke, Xuan Right Wing, and W are preferably not more than 30 microns, more preferably not more than 20%, and particularly preferably not more than 10 Kefeng. $ i & υ u ^ 矣 τδ 芈: Code, soil π / ν: Moreover, the embedded resin can be polished so that A can be avoided. I: The soluble organic filler to produce extremely unevenness It is better to avoid the lower range of the diameter of the fines formed by electroplating and subsequent formation of fines. It is better not to be smaller than the range. The embedded resin: less than The lower range of the diameter is more preferably not less than 0.5 micrometers. In addition to at least 3 liquid% lice resins and inorganics, in addition to adjusting the coefficient of thermal expansion: J BU t •. In addition to its pianos, these insoluble ingredients can prevent the structure of the resin from being greater than that of the solidified epoxy resin or as an inorganic filler as an aggregate. = Tree = The amount used is based on the embedded resin, and is 100% by weight, preferably 5 to 25% by weight. The weight of "5" charge is based on the embedded resin, which can be 45 to 85 li, preferably 50 to 75 weight percent, and more preferably 60 to 75 weight. Page 7 C: \ 2D-CODE \ 91- 04 \ 91100717.ptd V. Description of the invention (5) Volume percentage. When considering the fluidity of the embedded resin, it is used as a necessary additive. This series =: Oxygen resins are preferred to have low viscosity, and therefore allow the incorporation of inorganic fillers with thermal expansion coefficients such as mouth and mouth; = = = is the preferred use of -double-type epoxy resins. Compared with epoxy resin, etc., it is water glycerol ether or alicyclic). In terms of not reducing the working efficiency, t, 1 and a half (especially, heat resistance additionally makes the material of epoxy material more expensive;; system = good ^ Cnovoia,) ,,, ^ # 0 ,, ^… change :: . = Is a naphthalene resin with excellent heat resistance and moisture resistance.桝 iii ^ When using only semi-solid epoxy resins, the resulting enemies are two = increased viscosity. Therefore, for example, it is necessary to reduce the embedding tree: the filler component of the organic filler cannot be obtained at a high filling ratio 2 3 and obtained using the example of the liquid epoxy resin and the filling ratio, and a volatile solvent needs to be added. However, a volatile = = ί = will cause the generation of blister in the resin due to the residual solvent, and put it in an unfavorable state. There is no particular limitation on the inorganic fillers that are insoluble in the oxidant. However, it is crystalline silicon dioxide, fused silicon dioxide, aluminum oxide, silicon nitride, or the like. Inorganic filling by adding such a high filling ratio filler Page 8 \\ 312 \ 2d-code \ 9l-04 \ 9l100717.ptd 1245593 V. Description of the invention (6) agent, so that the thermal expansion coefficient of the embedded resin is not greater than 40ppm / it (preferably not more than 30 ppm / t, more preferably not more than 25 ppm / £ &c; c, particularly preferably not more than 20 pPm / t :, and the minimum limit is not less than 10 ppm ^ c) Can reduce the stress due to the blood _ _ poor stress of the embedded electronic parts. Concentrated packs ... The thermal expansion coefficient of the body-parts is preferably a spherical shape ... Improve the fluidity and embed the inorganic filler mainly based on SiO2 The agent is particularly good: because it is easy to obtain a spherical shape, the liquidity is further reduced, and: the amount of filling: the ratio of underfilling: fat is preferably added to two or more kinds of inorganic fillers with different shapes; The individual particles will be: The particle diameter of the inorganic filler added is smaller than that: because the embedded resin needs to pass through the gap between the electronic parts = motion. The particle diameter of the inorganic filler is preferably not greater than 30 ^ greater than 2. Micron, particularly preferably no greater than 10 microns. When the inorganic diameter exceeds 50 micrometers, the generated filler will easily block the lack of π between the electrons ^ = electrodes, causing the embedded resin to be insufficient. 7: Inserting the resin produces parts with locally different thermal expansion coefficients Serving. Further: "2 When this f resin is polished and its surface is smoothed" Ϊ2: The fine cloth produced afterwards = not more than 10 degrees / the minimum limit of the diameter of the inorganic filler is preferably micron. When the diameter of the inorganic filler is lower than this range, it is difficult to provide the desired fluidity. The diameter of the inorganic filler :: = will be more preferably not less than 0.3 micron ', and particularly preferably not less than 0.5 micron. Viscosity and filling ratio of the embedded resin can be enlarged, the particle size is large: low heart

C: \ 2D-CODE \ 91-04 \ 9ll007l7.ptd Page 9 1245593 V. Description of the invention (7) Cloth. The surface of the inorganic filler is preferably named by a coupling agent if necessary. This is because the month of the inorganic filler can be improved by the resin component to improve the fluidity of the embedded resin. Coupling agents that can be applied to this include coupling agents based on Shiyaki, coupling agents based on titanate, and coupling agents based on aluminate. Other examples of the substantially insoluble component of the oxidizing agent include a hardening accelerator (hardening accelerator), a silicone oil, and a gum, a reaction diluent, and an antifoaming agent. 5 重量 ％。 This hardening accelerator is based on the embedded resin, and its amount is 0.5 weight percent. In the case of an embedded resin containing a thermosetting resin incorporated therein, it is necessary to add a hardener (curing agent) here. The kind of the agent used is not particularly limited. However, in fact, # 佳 imidazole-based hardener, amine-based hardener, acid ^ as the agent, thermoplastic phenolic resin-based hardener or the like. Alas, in the case of using epoxy resin as the thermosetting resin, when the liquid hardener such as imidazole, amine, and acid anhydride is used, the second one is easy to provide low viscosity and extend the filling agent. !! I make it advantageous to add e.g. inorganic fillers

The hardener is based on an embedded resin and is used in an amount of 5 to 45, preferably 5 to 25 weight percent. Liba X has a wiring circuit board interposed between an electrical port formed in an opening formed therein and an opening filled with the embedded resin of the present invention. The surface at "L" is "wet, J example package, and modified" In the evenings 02 to 3, the hardening is based on the hardness of the master and the resin fillers are used. The gap is effectively C: \ 2D-C0DE \ 91-04 \ 91100717.ptd page 10

1245593 V. Description of the invention (8) Alleviates the stress concentration due to the difference in thermal expansion coefficient between the component parts, and therefore has excellent reliability. In order to fill the gap between the opening provided in the wiring circuit board and the electronic part having the opening of the embedded resin of the present invention, any conventional injection method or coating method may use, for example, an injection method using a dispersant, a screen A screen printing method and a ro 1 1 coating method. As for the opening, a perforation made in a substrate, a recess formed by a multilayer technique, or the like can be used. As the substrate, so-called core substrates such as F R-, 4, F R-5 and B T can be used. A substrate obtained by forming an opening by sandwiching a core substrate formed of, for example, a thermoplastic resin of pTFE having a copper foil having a thickness of about 35 micrometers can be used. Alternatively, an assembly layer consisting of an insulating layer and a wiring layer replaceable laminate on at least one side of a core substrate is formed, and an opening is formed through the core substrate and the assembly layer to obtain an Substrate. In this setup, as shown in Figure 丨 5, even the multilayer wiring circuit board of the capacitor is also beneficial to reduce the thickness of the so-called glass-epoxy composite material (insulating substrate) to about ordinary products (just micron) The half of the board has the following advantages to reduce its height / capacitance. The wiring adhesion can be reduced to prevent large currents from flowing in the power supply wiring that is formed by the disputes embedded in it. For other examples, it is possible to form a wiring circuit board (see Figure 3) with electronic components embedded in the core 2: or a wiring circuit board (see Figure 1 4) embedded in a PCB. In the wiring circuit board ψ of the present invention, the embedded resin can be roughened on the surface where one of the wires touches the wiring. This is because the surface is slightly flat on a rough surface C: \ 2D-C0DE \ 91-04 \ 91100717.ptd Page 1245593

Tando will play a role in improving the fixing effect of the embedded resin on the adhesive force.哕 # ^: The wiring of Cheng Zhi is about 15 «Half :: It is better to adjust it to have a surface roughness ranging from 0.1 micrometer to 15 Ω, which accounts for 1 η this =. Also live in the U.S. 5 to 10 microns, particularly preferably 1 to less than 8 microns, and more preferably 3 microns to:

Meters to 7 microns. The 蝮 蝮 佳 麻 麻 所 u # 丄, the bamboo ⑴ 疋 b U 4 division line is privately held by shells with unevenness on the rough surface. This is because Dou Xi's eight-dimensional ^ 疋 疋 匈 匈 匈 耩 匈 匈 匈 匈 匈 耩 on the Hun Lingbei can not beat the sound of the wiring, the wiring has a small gap or incomplete adhesion Qiu, born in the reliability test. ^ The wiring circuit board of the present invention is preferably manufactured in the following method (FIG. 3 and FIGS. 6 to 13). FIG. 3 is an example of a conventional application of the wiring circuit board of the present invention to a B (jA substrate. First, a core substrate (1) is punched through a die to form a pre-shaped opening (2). As shown in FIG. As shown in FIG. 6, a backing strip (3) is applied to one side of the core substrate to prevent leakage of an embedded resin. The core substrate is then disposed to face the backing strip side facing downward. As shown in FIG. 7, the The electronic component (4) is then inserted into the opening from the other side, and is set in the position of the adhesive side of the back strip using the opening of a chip mounter. As shown in FIG. The gap between the walls is filled with the embedding resin (6) of the present invention using a dispersant. In the case of using an epoxy resin, the substrate is heated to a temperature of 110 ° C to 180 ° t to thermally harden the embedding. Resin. This thermal hardening is preferably achieved in two stages, for example, the first heating step is performed at a temperature of 80 ° C to 120 ° C, and the second heating step is performed at 120 ° C to 18 ° C. This is because the first heating step allows between Between the wall and the opening of the sub-components between the captured between the electrodes and effective removal of the foam, and the second plus

C: \ 2D-CODE \ 91-04 \ 91100717.ptd Page 12 1245593 Description ~~ The thermal step then allows the embedded resin to harden in a good state without foam.槪 As shown in FIG. 9, the surface of the thus hardened embedded resin is then rough polished using an f-shaped silicon grinder, and polished by overlapping polishing to smooth it with f to form a smooth surface (6 〇). As shown in Figure 丨, the surface of the embedded resin is then irradiated with a carbon dioxide gas laser or YAg laser, so that it can be partially removed to form a through hole (7) for transportation, which will allow the embedded in the embedded The electrodes of resin electronic parts are exposed. A wiring can be obtained from the electrodes of the electronic component. The roughening of the smooth surface (60) of the resin is performed by using a roughening step using an oxidation step. As for the thorium oxide to be used in the crude saccharification step, any conventional oxidant may be used, such as a permanganate-based oxidant (such as KMη04, HMn〇4), a chromate-based oxidant (such as 3.K2Cr2〇7, K2Cr04, KCr03Cl, Cr02Cl2), nitrate-based oxidants (such as HN〇3, N2 04, N2 03, N20, Cu (N03) 2, Pb (N03) 2, AgN03, KNH4N03) , Halogen-based oxidants (such as dagger, C1g, Brs, I.), peroxide-based oxidants (such as Zr%, Na202,

Ba02, (C6H5C0) 202), peracid-based oxidants (such as

Na2S2 08, Na2S05, K2S2 08, K2S05, HCQ3H, CH3C03H, C6H5C03H, c6h4 (cooh) co3h, cf3co3h), sulfate-based oxidants (such as hot concentrated sulfuric acid, fuming sulfuric acid + concentrated nitric acid), and oxo acids (Oxygen acid) -based oxidants (such as NaC10, KBrO, NaBr〇, KIO, NaIO, KC103, NaC103, KBr04, NaBr04, KI04, NaI04, HI04, Na3N2106), metal oxidants (such as FeCl3, Cus〇4 ,

Cu (CH3COO) 2, CuCl2, Hg (CH3COO) 2, Bi (CH3COO) 3,

C: \ 2D-C0DE \ 91-04 \ 91】 00717.ptd Page 13 1245593 V. Description of the invention (η)

Pb (CH3COO) 4), oxygen-based oxidants (such as two :: oxide-based oxidants (such as c two θ 3, 〇 called, vice 4, Se〇2, _, A4). Special 豳-^ Practices such as oxidants based on permanganate, chromic acid I and Hr as oxidants, chromate-sulfate-vaporized sodium as main lamella, and bromofluorate-dichromate Oxide mixed with oxygenate as the main oxidant :: because it can completely use the epoxy resin two, two before and after the roughening of the access to the resin's polished surface with 1 to 1! The soluble resin or soluble organic filler, such as the component (30) dissolved in the oxidant of the resin (6) into the resin (6), is formed by using ::: to form an elution portion (32). Therefore, the rough surface (61) formed by the micro unevenness is formed on the exposed surface of the embedded resin, and the electric energy will play a fixed role, so that it can provide a process for passing through the cloth and the box. And then the formation of the liquid makeup II # shaking 4 adhesive resin embedded. The embedded resin preferably contains a resin or an inorganic filler, which is incorporated here as a substantially insoluble component of the emulsifier to adjust its thermal expansion coefficient or prevent it from leaving itself after being roughened. Beard shape. The rough surface (61) is activated with a chemical containing the solution, and the electroless plating film (not shown) is made of copper. Subsequently, the rough surface (6)) is electroless-plated with copper to form a panel stack as shown in FIG. 丨 (nel deposit) (9). Because copper is used to fill the vias in the plating step) to form a contact conductor (via c〇nduct〇rK8) as shown in Figure 11 Page 14 C: \ 2D-CODE \ 91-04 \ 91100717.ptd 1245593 V. Invention Description (13) Similar. In addition to using the enumerated core substrates obtained by panel plating after roughening, a copper-plated core substrate plated with copper foil in advance can be used to accomplish the object of the present invention. The thickness of the substrate is not particularly limited, but is preferably almost equal to or slightly larger than the thickness of the electronic component. In the example of manufacturing a multi-layer wiring circuit board, an insulating layer to be used for a conventional assembly method or a lamination method may be used. A thermosetting resin, a thermoplastic resin, a photosensitive resin, or a mixture or modified product thereof may be used. Specific examples of these resins include epoxy resins such as bisphenol-type epoxy resins and thermoplastic phenol-type resins, epoxy resins, epoxy acrylate resins, Teflon resins, liquid crystalline polymers, PPS resins, and PPE Resin. Examples of the electronic component include a chip resistor, a chip resistor, and a chip inductor. These electronic parts are preferably in ceramic-laminated form because they have sufficient capacity even in small-sized forms. The protrusion d (element number 50 in FIG. 5) extending from the surface of the ceramic material of the electrode of the electronic component embedded in the resin to the surface of the embedded resin is preferably at least on the side where the semiconductor is provided. 20 microns to 150 microns. Preferably, for the electrodes on both sides of the electronic part, the protrusion d is 20 μm to 150 μm. This is because the embedded resin can completely flow through the gap between the electrodes on both sides of the electronic part. When the electrode protrusions fall below this range, the filler embedded in the resin is captured by the gap ', making it difficult to fill the gap. On the contrary, when the protrusion of the electrode exceeds this range, the generated stress will cause the electrode itself to be easily detached, which is not conducive to reliability.

C: \ 2D-CODE \ 91-04 \ 91100717.ptd

1245593

The electrode protrusion is preferably 30 :: fluid; and makes the gap between the embedded human & Tuxing electronic parts become usable. The surface of the electrode of the two sub-parts has 0.3 micrometers to 2 micrometers, meters. In this case, it is preferably 0.5 μm to 10 μm, ^; a. This is because the embedding resin can fix the adhesive force through the better surface of the electrode. The method for controlling the roughness is not particularly limited. Any conventional method such as micro-etching and blackening can be used. The wiring circuit board is allowed to be placed-the semiconductor is almost the same as the word "almost on" (substantially on) used by the electron here to indicate that it contains not only the semiconductor just above the electronic part The state of sadness also includes the concept that the semiconductor is disposed only just above the periphery of an electrode of an electronic component connected to the semiconductor. This is because when the half :: φ ΐ 'and thus its face # can be reduced. For example, by inserting a chip capacitor into the rewiring circuit board so that it is combined with the wiring circuit board to form a decoupling capacitor, 'the length of the wiring from the power supply layer and the ground layer to the decoupling capacitor can be reduced, so that Reduces additional inductance (1 nductance) and makes it possible to effectively reduce switching noise. When the electrodes of the conductor and the electrodes of the electronic component are in place so that the electrodes can be connected almost perpendicularly to each other via the contact conductor, the effects described in the preceding paragraph can be obtained. A multilayer including a substrate can be manufactured by, for example, the following method (FIGS. 15 to 29)

1245593 V. Description of the invention (15) Wiring circuit board, and the substrate is formed by forming an alternating laminate of an insulating layer and a wiring layer on at least one side of a core substrate, and forming the core substrate and the build-up layer through An opening to get. This manufacturing method will be described below with reference to a specific example of the so-called "FC-PGA" substrate shown in FIG. 15. As shown in FIG. 16, a FR-5 double-sided copper-plated core substrate plated with a copper foil (200) having a thickness of 18 microns and an insulating substrate (100) having a thickness of 0.4 microns was manufactured. Regarding the properties of the core substrate used here, the Tg (glass transition point) defined by TMA is 175 t :, the CTE (coefficient of thermal expansion) along the surface of the substrate is 16 ppm / ° C, and the The CTE (coefficient of thermal expansion) in the direction of the surface was 50 ppm / ° C, the dielectric constant ε at 1 MHz was 4.7, and the tan 6 at 1 MHz was 0.018. The core substrate is exposed to light through a photoresist film that has been adhered thereto, and then developed to form an opening having a diameter of 600 micrometers and an opening having a shape corresponding to a predetermined shape of the wiring ( Not shown). The copper foil exposed to the opening of the photoresist film is then removed by etching with an etching solution containing sodium sulfite and sulfuric acid. The photoresist film is then peeled from the core substrate to obtain a core substrate having an exposed portion (300) as shown in FIG. 7 and an exposure having a predetermined shape with respect to the wiring formed thereon. Section (not shown). The core substrate was then etched using a commercially available etching device (CZ-treated Li manufactured by MEC Corporation), so that the steel foil was roughened on its surface. An insulating film having a thickness of 35 microns and mainly composed of epoxy resin is then adhered to both sides of the core substrate. Accepted for u hours of hardening at this temperature to form on it =

Page 18 1245593 V. Description of Invention (16) ----- $. With regard to the properties of this hardened insulating layer, the (glass transition point) measured by TMA is 155 (: the D2 (glass transition point) measured by 1 ^ is 20.0 CTE (4 know service Coefficient) is 66, its dielectric coefficient ε is 1 · 7 at 1 MHz, tan 5 is 0.0 33 at 1 MHz, and the weight reduction rate at 3 0 0 t is 10.1%, water absorption The rate is 0.8%, the moisture absorption rate is 1%, the Young's modulus is 3 GHz, the tensile strength is 63 million Pa and the elongation is 4.6%. The substrate is irradiated with a laser beam of carbon dioxide gas to form a through hole (500) in the insulating layer (400) for intermediate layer connection. The through hole has a thickness of 20 μm on the upper portion thereof. The diameter of the cone form, and the bottom is a cone form with a diameter of 60 microns. By increasing the output of the carbon dioxide gas laser, through the insulation layer and the core substrate to open a perforation with a diameter of 300 microns (60. 〇). The inner wall of the perforation has the characteristics of undulation (not shown) of laser treatment. The substrate is immersed in a catalytic activation containing palladium chloride And then electroless copper plating (not shown) on its entire surface. Next, the substrate is subjected to copper panel plating (700) to a thickness of 18 microns. A through hole is formed to electrically connect the substrates. Layer of the contact conductor (800). A through-hole conductor (900) for electrically connecting the surface of the substrate and the other surface is also formed in the through hole. A commercially available bird engraving is used. Device (via the CZ processor manufactured by MEC), the substrate is then engraved so that the copper deposit is roughened on its surface. In the following, the copper deposit is rust-prevented by a rust preventer manufactured by MEC. (Trade name: c Z treatment) to form a hydrophobic surface and complete hydrophobicity.

\\ 312 \ 2d-code \ 91-04 \ 91100717.ptd Page 19 1245593 5. Description of the invention (17) The contact angle 2 of the hydrophobic surface of the conductive layer of water 2 Θ is then measured by using a contact angle The meter (trade name: CA-A, manufactured by Kyowa Interface Science) was measured by a liquid dropping method. Therefore, the contact angle 2 Θ is 1 0 1. . A non-fiber paper is then placed on a pedestal equipped with a vacuum suction device. The uranium substrate is then placed on a pedestal. A stainless steel filled escutcheon with perforations in place relative to its perforations is placed on the substrate. Next, a paste containing copper filler for filling the perforations is placed on the cover. The perforations are then filled with the paste under the pressure of a roll rubber roller. As shown in FIG. 19, the paste (100 000) used to fill the perforations and filled with the perforations is temporarily hardened for 20 minutes at a temperature of 120 ° C. Next, as shown in FIG. 20, the surface of the core substrate is polished using a belt sander (rough polishing), and then buff fing (complete polishing) is performed to make it smooth (unfinished). display). The paste was then hardened at a temperature of 15 ° C for 5 hours' to complete the filling step. The part of the substrate that has been completed in the filling step is used for the evaluation test of the filling property. As shown in FIG. 21, a perforation (丨 丨 〇) having a size of 8 mm square is formed using a mold (not shown). As shown in FIG. 22, a guard strip (丨 20) is adhered to one side of the substrate. Next, as shown in FIG. 23, the 8-layer wafer electric valley device (130) is placed on a purlin exposed to a perforation (110) using a wafer device. The dedicated laminated chip capacitors are each made of a laminated material (15) having dimensions of 1.2 mm x 0.6 mm x 0.4 mm. An electrode (140) protruding from the laminated material is 70 microns. θ

1245593 V. Description of the invention (18) As shown in FIG. 24, the perforation provided with the laminated chip capacitor is filled with a disperser (not shown) with the embedded resin of the present invention. The embedded resin was subjected to a first heating step at a temperature of 80 ° C for 3 hours, and then a second heating at a temperature of 1 70 ° C for 6 hours to perform defoaming and heat curing. As shown in Fig. 25, the surface of the hardened embedded resin is thus rough-polished using a belt sander, and then polished by overlapping polishing. The end face of the electrode of the chip capacitor is exposed to the polished surface of the embedded resin. Next, the temporarily hardened insert resin was hardened at a temperature of 150 ° C for 5 hours. In the following, the polishing surface of the ‘50 helium resin is roughened with a solvent solution and a KMn0 4 solution. The rough surface of the embedded resin was activated by a Pd catalyst, electroless plating was performed using copper, and copper was then used to deposit the metal. As shown in FIG. 26, the deposit formed on the embedded resin is electrically connected to the end face of the electrode of the chip capacitor. An anti-light money agent is formed on the surface of the electric money which is invaded into the tree. Regarding the light-resistant agent, a predetermined wiring pattern is formed on the plating surface of the embedded resin. The unnecessary copper is removed by using No. 8 / concentrated sulfuric acid. The anti-light money agent is peeled off by the pulled-in resin to complete the wiring formation as shown in FIG. Using a commercially available etching device (CZ processor manufactured by MEC Corporation), the embedded resin was then subjected to etching so that the copper-plated wiring was roughened on its surface. A thin film (9o), which is an insulating film, is laminated on the rough surface of the copper-plated wiring, followed by thermal curing. The insulating film is based on dioxide

1245593

A carbon gas laser beam is irradiated to form a through-hole for insertion into the connection. The surface of the insulating layer is roughened with the same oxidant used above. A predetermined wiring (201) is formed in the same manner as described above. A dry film as a solder resist layer is then laminated on the uppermost layer of the wiring circuit board. The dry film is exposed to light via a pattern of the semiconductor device, and is then cultured to complete the formation of a solder resist layer (2o). A predetermined wiring (230) and a solder-resistant layer (24) are also formed on the surface of the wiring circuit board. There are mounting leads provided thereon to obtain a multilayer without the leads shown in FIG. 28. A printed circuit board. A terminal electrode (20 丨) on which a semiconductor is mounted is charged by N 丨 and then plated with Au (not shown). A solder paste made of a low-solubility solder is then printed on the wiring circuit board. The wiring circuit board is then passed through a solder reflow furnace to form a solder bump (220) for mounting a semiconductor. In other words, "a solder paste made of a highly soluble solder is printed on the surface of the wiring circuit board" and the surface is opposite to the surface on which the semiconductor is mounted. The wiring circuit board is then passed through a solder reflow oven to a solder bump (2 60) for mounting leads. The wiring circuit board is then simultaneously placed on a lead (25) mounted on a fixture (not shown) through a solder reflow oven 'to mount leads (not shown) therein. Therefore, as shown in FIG. 29, an FC-PGA type multilayer printed circuit board is obtained, which is ready to be mounted with a semiconductor element. An error of the position of the device relative to the front end of the lead of the area filled with the embedded resin is measured from the predetermined position using a projector. The result is no more than 0 · 丨 mm. Even when using a large

1245593, Description of the invention (20) The current is repeatedly supplied with energy, and the wiring of ^ has not experienced defects such as that formed on the embedded resin and used for power supply separation. The semiconductor element (27) is mounted on the mounting surface of the board. The cloth green cloth 6 is placed in a position where the wiring circuit is decomposed, and is connected by a soldering circuit board to only a low-solubility solder melt component. The installation part is connected to the semiconductor device filled with nj filled material and then thermally hardened = the generation of the semiconductor element in it-"PΑΓ ^ 夕 ^^ 行行 3" There are laments of PAG type multilayer printed circuit boards Device, as shown in Figure 15. | wElectronically confused cow V body J hair :: Take the following example to make a further-step narrative. Embedding the ΐ: You can precisely measure such as in the table The various constituents proposed in 1 are mixed with the above-mentioned constituents, and then the above-mentioned mixture is kneaded by a device of a grinder having three sets of rollers. The details described in Table 丨 are as follows. Epoxy Resin * Liquid BPA: Bisphenol A epoxy resin (YL980, manufactured by Japan Epoxy Resin Co., Ltd.) * πLiquid BPF1 '· Bisphenol F epoxy resin (YL983U, manufactured by Japan Epoxy Resin Co., Ltd. (Manufactured by the company) * "Semi-solid evaluation": naphthalene-type epoxy resin (1 ^ -40320, manufactured by 〇 person 01 ?? (made by INK & CHEMICALS) * solid CN ": acetol thermoplastic phenolic type Epoxy resin (EOCN103, manufactured by NIPPON KAYAKU Co., Ltd.) + solvent (Ethylene glycol dimethyl ether)

C: \ 2D-0QDE \ 91-04 \ 91100717.ptd Page 23 1245593 V. Description of the invention (21) * The above-mentioned solvent components are not included in the one-hundred-eighth specific concentration described in Table 1. 77 Hardener * S Anhydride: An acid anhydride-based hardener (E picure Υ Η 3 0 7 manufactured by Japan Epoxy Resin Co., Ltd.) Hardening accelerator * πimisal π •• Based on imidazole Hardener (2E4MZ-CN, manufactured by SHIKOKU Chemical Co., Ltd.) Organic filler * Π Rubber filler π •• Rubber-based filler (XER-91, manufactured by JSR) Liquid rubber * π has been changed Epoxy ”: Modified epoxy butadiene rubber (E-1OO00_8. 〇, manufactured by NIPPON Petrochemical Co., Ltd.) Inorganic filler * π silica (diameter Φ: 24 microns ) Π: Silane-coated fumed silicon (Tasumori PLV-6, the largest particle diameter in terms of particle size distribution: 24 microns) * "Silicon oxide (mixture) π ·· Silane-coated silicon oxide (7 : 3 (weight ratio), which is a mixture of MS-35 and SO-C5. MS-35 is manufactured by DENKI KAGAKU K0GY0 Κ · Κ · and S0-C5 is manufactured by Tatsumori Co., Ltd. in particle size distribution. In terms of the largest particle diameter: not less than 200 microns )

C: \ 2D-GODE \ 91-04 \ 91100717.ptd Page 24 1245593 V. Description of the invention (22) Table 1 (ς)? = LS φ) & ^ base

Els

Ifi I (0Z.) £ ^ < ΝΦ) ^ Α3 > Base (0 卜)? ^ Γνιφ) / ί! § > «ss (s 蘅 枳 ® 酸 逖 (ΙΌ)

(s ^ KTHsHilJ (S base Kiy ^ il) (ΙΌ) in # (Γ0) 勃 # (ld) 博 # (ΙΌ) 鄯 # (ΙΌ) 赵 # (% i s) ®

(ς) I (H) felg § i (s) fe 趑 (s) Hg 氍 (Η) & 趑 (e) UHda 嫠 (e) vdas ^ (edNil store and £ dds cloud (ool) vda cloud 観Neighbor unloading * (rvll) Kuis picture 1 cut * (n) Kus picture C: \ 2D-CODE \ 91 > 04 \ 91100717.ptd Page 25 1245593 V. Description of the invention (23) As the core of the above A Bτ substrate used in the substrate has a thickness of 0.8 mm. Using a mold, a perforation with a predetermined size can be subsequently formed in the above-mentioned core substrate. Next, a back strip is bonded = one of the above-mentioned core substrates On the surface. Then, the above-mentioned core substrate is provided with the side of the moon bar of the above-mentioned moon bar facing down. Next, a chip capacitor is inserted into the opening from the other side of the core substrate. A chip mounter is used to set a predetermined position on the adhesive side of the back strip in the above-mentioned opening. Then, a dispenser is used to flow the embedded resin expressed in Table 1 into the wafer valley in the above-mentioned opening. And the gap between the seed and the opening. The first heating step was performed for 3 hours at a temperature of 80 t, and then the second and under heating step was performed at a temperature of 1 70 ° C for 6 hours to undergo foam removal and heat hardening treatment. Therefore, use A booklet polisher was used to perform rough Z polishing on the surface of the treated embedded resin, and the polishing process was completed using overlapping polishing. Then, the above embedded resin was irradiated with a laser beam of carbon dioxide gas to form a through hole. Holes are inserted into the resin so that the electrodes of the chip capacitors are exposed. After the insertion, the polished surface of the embedded resin is subjected to a rough chaining step with KMnO4 solution. The above tree entry = liquid roughening The surface can be activated by a -Pd catalyst, by electroless plating and / or by electroplating with copper. A layer of photoresist is formed on the surface of the above-mentioned embedded layer after electroplating. On the surface of the above-mentioned embedded resin after plating, anti-predetermined wiring patterns. Use NaAW / conc. 0717.ptd 1245593 V. Description of the invention (24) — Copper. The photoresist is stripped from the embedded resin, and the wire is formed. A cloth is laminated to the steel as a layer of insulation. 3 on the roughened surface 'Next, the above-mentioned copper plating u ;; ... hardening treatment. Use a laser beam to irradiate the above-mentioned insulation to form a through hole so that the intermediate layer can be connected. Next, use =, in the text The same oxidant is used to enter the surface of the insulating layer, and a predetermined wiring is formed in the manner described above. However, = chemical broadcasting: a dry film is laminated on the uppermost layer of the wiring circuit board under light, and then, the above-mentioned dry film y-path forming step is developed. A 70-degree anti-solder layer is provided with a semiconductor element on the terminal electrode, wherein the electrode is first plated with Ni, and then Au power ore. The above-mentioned end-pass solder reflow furnace is used to form a kind of installation part for installing a G body ut warp: a device to fill the above with an unfilled material to obtain an evaluation sample filling material and then heat curing treatment to . . ί: Let C let the evaluation sample obtained by t go through thermal cycle test (-55 cf 2 c · m cycles) and pcT (Meili 55 cooker) test (i2KCx? Female $ tired · ". P essure evaluation sample Surface energy and · hours). Observed and tested; = The result is judged to be good. The results can be expressed in Table 2. Mino. The above page 27 C: \ 2D- OODE \ 91-O4 \ 91100717.ptd 1245593 V. Description of the invention (25) In order to measure the thermal expansion coefficient of the above-mentioned embedded resin, the above-mentioned embedded resin can be made into a sheet having a thickness of 100 microns. The above sheet is in 1 The first heating step was performed at a temperature of 20 ° C for 1 hour and then the second heating step was performed at a temperature of 170 ° C for 5 hours to undergo a thermal curing process. Then, the above sheet was cut into A sample with a size of 4 mm x 20 mm. The sample prepared above can then be measured by using a coefficient of thermal expansion. In some details, the above sample was once cooled to -60 ° C. Temperature and then at a heating rate of 2 ° C per minute The above samples were measured in the thermal expansion coefficient falls within the above measured -. 5 0 ° C to + 1 3 0 ° C the above-described results are shown in Table 2.

\\ 312 \ 2d-code \ 91-04 \ 91100717.ptd Page 28 1245593 V. Description of the invention (26) 2 Table _ ^ _ (% «SJ HSBS Township N ^ lslud 拗 (SS State side) S9 001 001 55Ί 02 (®®, side) 09 (Kinjiri) IOOZ. 001 OS I551 02 _ ^ _ (% " Touch®) 001 ~ ^ Γ 001 02 is® s (Mirror Chuanghu «) 000 GO ^ E & wisI ^

lCN eeNNΤΓ

otN

Hi drawing ___1 C: \ 2D-OODE \ 91-04 \ 91100717.ptd Page 29 1245593 V. Description of the invention (27) Samples Nos. 1 to 4 and 6 contain a soluble organic filler or can be dissolved in a kind The soluble resin among the oxidants does not form a blistered copper metal layer for peeling after the pCT test and thus exhibits a good θ adhesion. In Sample No. 3, a semi-solid naphthalene-type epoxy resin was further included, which showed good results. <^ Conversely, samples Nos. 5 and 7 that do not contain soluble organic fillers or soluble resins that are soluble in an oxidant will be tested after the PCT (for example, refer to No. 29 in Figure 5). Foaming of the copper metal layer is generated or cracked in the above-mentioned embedded resin (for example, refer to No. 28 in Fig. 4) &lt;. &amp; In the above results, it can be found that the addition of a soluble organic filler or a soluble resin soluble in an oxidizing agent makes it possible to improve the adhesion of the embedded resin to the copper metal layer. It can also be said that an effect can be exerted to relax the above-mentioned pressure concentration and prevent the occurrence of cracking. Sample No. 6, which contains a solid epoxy resin ', can show voids due to a volatile solvent, which is added to deal with the increase in viscosity of the embedded resin. It can be found that the above-mentioned epoxy resin, if used, is preferably a kind of ^ -shaped epoxy resin. According to the present invention, it is possible to obtain a kind of good adhesion with a wiring made of copper or a similar material. An embedded resin and a wiring circuit board of the embedded electronic part including the embedded resin. By promoting the roughening of the surface of the embedded resin, a fixing effect is exerted to improve its adhesion to the wiring. Furthermore, a wiring circuit board with improved reliability in electrical connection can be obtained, ranging from the electronic parts embedded therein to being installed in almost

C: \ 2D-CODE \ 91-04 \ 911007l7.ptd

P.30 1245593 V. Description of the invention (29) 29 Transparent foam 30 Soluble component dissolved with oxidant 31 Insoluble component substantially insoluble in oxidant 3 2 Elution part 50 Projection of electrode of electronic part 60 Smooth surface 61 Thick chain surface 90 Scheduled wiring 100 Insulating substrate 110 Perforation 120 Guard strip 130 Laminated wafer capacitor 14 0 Electrode 150 Laminated material 190 Thin film 20 0 Copper foil 201 Scheduled wiring / terminal electrode 210 Anti-solder layer 230 Scheduled wiring 240 Anti-solder layer 25 0 Lead 260 Solder bump 270 Semiconductor element 3 0 0 Exposed part

C: \ 2D-CODE \ 91-04 \ 91100717.ptd Page 32 1245593 V. Description of the invention (30) 4 0 0 Insulating layer 5 0 0 Through hole 60 0 Perforation 7 0 0 Copper panel key 80 0 Contact conductor 90 0 Perforated conductor 1 0 0 0 Perforated paste

IlHilil Page 33 C: \ 2D-C0DE \ 91-04 \ 91100717.ptd 1245593 Brief description of the drawing Figure 1 is a diagram illustrating a specific example of the embedded resin of the present invention, which refers to the adjacent portion of its smooth surface; FIG. 2 is a diagram illustrating another specific example of the embedded resin of the present invention, which refers to the adjacent portion of the rough surface thereof. FIG. 3 is a diagram illustrating an embodiment of applying the wiring circuit board of the present invention to a BGA substrate Figure 4 is a diagram illustrating an example of a state of a crack generated in the embedded resin; Figure 5 is a diagram illustrating an example of a transparent foam (b 1 ister) of a wiring generated in an interface having the embedded resin Figure 6 is a diagram illustrating a specific example of a method for manufacturing a wiring circuit board of the present invention; Figure 7 is a diagram illustrating another specific example of a method for manufacturing a wiring circuit board of the present invention; Figure 8 is a diagram illustrating manufacturing a wiring of the present invention FIG. 9 is a diagram illustrating another specific example of a method for manufacturing a wiring circuit board of the present invention; FIG. 9 is a diagram illustrating another specific example of a method for manufacturing a wiring circuit board of the present invention; Example map 11 is an explanatory view of still another specific embodiment of the method of the present invention for producing a wiring circuit board; FIG. 12 is a diagram of a further method of the present invention for producing a wiring circuit board of the embodiment specifically described;

C: \ 2D-CODE \ 91-04 \ 91100717.ptd Page 34 1245593 Brief description of the diagram-Figure 13 is a diagram illustrating another specific example of the method for manufacturing a wiring circuit board of the present invention; FIG. 14 is an illustration FIG. 15 is a diagram illustrating an embodiment in which a wiring circuit board of the present invention is applied to a BGA substrate; FIG. 15 is a diagram illustrating a semiconductor device including an FC-PGA type multilayer printed circuit board as a specific example involved in the present invention; FIG. 1 6 is a schematic diagram illustrating a copper-plated core substrate having a thickness of 400 micrometers; FIG. 17 is a diagram illustrating a state of a patterned copper-plated core substrate having a thickness of 400 micrometers; 018 illustrates a via hole and A through hole is formed on a core substrate having an insulating layer formed on both sides thereof; FIG. 19 is a diagram illustrating the shape of a core substrate having an insulating layer formed on both sides of the core substrate Panel ore has been performed (pane 1-p 1 ated); Figure 20 is a diagram illustrating a substrate having a perforation filled therein; Figure 21 is a diagram illustrating a substrate having a perforation punched therein, Figure 2 2 To illustrate a masking tape) how to adhere to one side of a substrate with perforations in which it is punched; FIG. 23 is a diagram illustrating how a laminated chip capacitor is placed on a protective strip exposed to perforations; FIG. 24 is an illustration Figures of perforations filled with embedded resin; Figure 25 is a diagram illustrating a substrate that has been polished to smooth its surface; Figure 26 is a diagram illustrating how the substrate is made into a panel on its polished surface;

\\ 312 \ 2d-code \ 91-04 \ 91100717.ptd Page 35 1245593 Brief Description of Drawings Figure 27 is a diagram illustrating how to make a wiring patterning; Figure 28 is a diagram illustrating a build-up layer (build- up layer and a solder resist layer are formed on the substrate; and FIG. 29 is a diagram illustrating a FC-PGA type multilayer printed circuit board as a specific example of the present invention.

C: \ 2D-C0DE \ 91-04 \ 91100717.ptd Page 36

Claims (1)

1245593 6. The scope of patent application and an assembly layer are provided on at least one side surface of the core substrate and are formed by selectively laminating an insulating layer and a wiring layer, wherein the core substrate and the assembly layer have Penetrate the openings in between. 9. A method of manufacturing a wiring substrate, comprising: a fixing step of disposing an electronic component in an opening of a substrate; using a soluble resin containing at least one oxidizing agent as a soluble component and a soluble component An embedding step in which an organic filler is dissolved to fill a gap in the opening of the electronic component; an oxidizing agent is used to dissolve at least one soluble resin and the soluble inorganic filler contained in the embedded resin to Forming an elution portion, and forming a rough chaining step on a rough green surface on the exposed surface of the embedded resin; and forming a wiring forming step on the rough surface. \\ 312 \ 2d-code \ 91-04 \ 91100717.ptd Page 38