JP4283753B2 - Multi-layer printed wiring board with built-in electrical components and method for manufacturing the same - Google Patents

Description

  The present invention relates to a multilayer printed wiring board in which electrical components are incorporated and a method for producing the multilayer printed wiring board with built-in electrical components.

  In recent years, with the demand for higher functionality and smaller size and thinner electronic devices, higher integration of semiconductors, shorter wiring distances, and smaller printed wiring boards are required. Such a printed wiring board is mounted with a chip-shaped electrical component such as a semiconductor device, a bare chip, a chip-shaped capacitor, or a chip-shaped inductor as an electrical component.

However, since such an electrical component is mounted only on the outer layer circuit of the printed wiring board, there is a limit to the amount of electrical component mounted on the printed wiring board, and the electrical component protrudes from the outer surface of the printed wiring board. Therefore, the printed wiring board is hindered from being miniaturized. Further, when the mounting position of the electrical components is only the outermost layer of the wiring board, the degree of freedom of wiring design was also intended thereby Tsu low kuna.

Therefore, in order to solve such a problem, there is provided a technique capable of reducing the size of the wiring board by increasing the mounting amount of the electrical component by incorporating the electrical component in the insulating layer (for example, , See Patent Document 1).
JP 2003-204167 A

  However, in the technique described in Patent Document 1, it is necessary to use a transfer substrate when manufacturing a wiring board with built-in electrical components, which is complicated. That is, in this case, it is necessary to form a circuit once on the transfer substrate, then transfer the circuit to the insulating layer, and then peel off only the transfer substrate, which makes the manufacturing process complicated. It becomes.

  The present invention has been made in view of the above points, and a method capable of easily producing a multilayer printed wiring board with built-in electrical components, as compared with a conventional method using a transfer substrate, and such a method. It is an object of the present invention to provide a multilayer printed wiring board with a built-in electric component.

According to a first aspect of the present invention, there is provided a method of manufacturing a multilayer printed wiring board with a built-in electrical component, in which a metal layer 2 is provided on one surface of a rigid substrate 1 containing a substrate and an inner layer circuit 3 is formed on the other surface. By mounting the electrical component 4, the electrical component mounting substrate 5 is overlapped with the step of producing the electrical component mounting substrate 5, and the mounting surface 7 of the electrical component mounting substrate 5 is superimposed on both surfaces of the resin sheet 6 without the base material. A step of producing a laminated body 9 in which the electrical component 4 is embedded in the insulating layer 8 of the resin sheet 6 without a base material by stacking and integrating via the resin sheet 6 without a base material, and the inner layer circuit 3 A via hole 10 is formed by drilling with a laser so as to be exposed on the bottom surface, and a through hole 11 is formed by drilling the laminated body 9 so as to penetrate in the laminating direction; Circuit for outer layer To form a 2, is characterized in that a step of plating 13 in the via hole 10 and the through-hole 11.

  The invention of claim 2 is characterized in that, in claim 1, the method further comprises a step of filling the via hole 10 subjected to the plating 13 with the conductive paste 14.

According to a third aspect of the present invention, there is provided a method for manufacturing a multilayer printed wiring board with a built-in electrical component, wherein a through hole 15 is provided in a rigid substrate 1 containing a base material provided with a metal layer 2 on both sides, and a conductive paste is provided in the through hole 15 After filling 14 or plating 13, forming the inner layer circuit 3 on one side of the rigid substrate 1 containing the base material and mounting the electric component 4 to produce the electric component mounting substrate 5, superposed mounting surface 7 of the electrical component mounting board 5 on both surfaces of the resin sheet 6 without substrate, by laminating and integrating the electrical component mounting board 5 together through the resin sheet 6 without substrate, no substrate The laminate 9 in which the electrical component 4 is embedded in the insulating layer 8 of the resin sheet 6 is manufactured, and the outer layer circuit 12 is formed on both sides of the laminate 9, and the laminate 9 is penetrated in the stacking direction. Drilling like It is characterized in that a step of plating 13 on the through hole 11 to form a through hole 11 to go.

In the method for manufacturing a multilayer printed wiring board with built-in electric parts according to claim 4 of the present invention, the non-through hole 17 is formed by irradiating a laser from one surface of the rigid substrate 1 containing a base material provided with the metal layer 2 on both sides. The inner layer circuit 3 is formed on the surface 16 after the plating 13 is applied to the non-through holes 17, the conductive paste 14 is filled, or the plating 13 is filled and the paste is filled. In addition, by mounting the electrical component 4 together, the process of producing the electrical component mounting substrate 5 and the mounting surface 7 of the electrical component mounting substrate 5 are superposed on both surfaces of the resin sheet 6 without a base material , the by integrally laminated via a resin sheet 6 without substrate, a process of forming a stack 9 of the electrical component 4 in the insulating layer 8 according to the resin sheet 6 without substrate are embedded, stack 9 Through the stacking direction The through hole 11 is formed by performing a sea urchin drilling, to form the outer layer circuit 12 on both sides of the stack 9, it is characterized in that a step of plating 13 in the through hole 11.

In the multilayer printed wiring board with built-in electric parts according to claim 5 of the present invention, the insulating layers 18 made of the rigid substrate 1 containing the base material are laminated and integrated on both sides of the base material-free insulating layer 8 in which the electric parts 4 are embedded. The outer layer circuits 12 formed on the surfaces of the insulating layers 18 on both sides are connected to each other through the through-holes 11, and the electrical component 4 and the outer layer circuit 12 are connected to each other through the via holes 10. It is characterized by.

  According to the present invention, it is possible to easily manufacture a multilayer printed wiring board with built-in electrical components as compared with a conventional method using a transfer substrate.

  Embodiments of the present invention will be described below.

  The multilayer printed wiring board with built-in electric parts according to the present invention can be manufactured by three methods. Hereinafter, these methods will be described with reference to the drawings.

  FIG. 1 shows an example of the first manufacturing method, which has the following steps.

First, in the first step, as shown in FIG. 1A, the metal layer 2 is provided on one surface of the rigid substrate 1, the inner layer circuit 3 is formed on the other surface, and the electrical component 4 is mounted. Thus, the electric component mounting substrate 5 is produced. Here, as the rigid substrate 1, a base material such as a glass base material is impregnated with a thermosetting resin composition such as an epoxy resin and the like, and is dried to be in a completely cured state (C stage). It is use things. The thickness of the rigid substrate 1 is preferably as thin as possible, and is, for example, 5 to 200 μm. For example, the metal layer 2 can be provided on one surface of the rigid substrate 1 or the inner layer circuit 3 can be formed on the other surface, for example, as follows. That is, after metal foil such as copper foil is overlapped on both sides of the prepreg, and this is laminated and integrated to be completely cured, a metal-clad laminate is produced, and then one side of the metal-clad laminate is subtractive. This can be done by forming a circuit. Thus, the inner layer circuit 3 is formed, and the inner layer circuit 3 includes a pad (land) to which the terminal of the electric component 4 is attached and connected. As the electrical component 4, a semiconductor device, a bare chip, a chip capacitor, a chip inductor, or the like can be used. The electrical component 4 can be mounted by soldering terminals to pads.

  Next, in the second step, as shown in FIG. 1B, the mounting surface 7 of the electric component mounting substrate 5 (the surface on which the electric component 4 is mounted) is superimposed on both surfaces of the resin sheet 6 to mount the electric component. By laminating and integrating the substrates 5 via the resin sheet 6, a laminated body 9 in which the inner layer circuit 3 and the electrical component 4 are embedded in the insulating layer 8 by the resin sheet 6 is produced.

Here, as the resin sheet 6, the thing without a base material is used, For example, what shape | molded the following resin compositions in the sheet form of the semi-hardened state can be used. That is, the resin composition forming the resin sheet 6 contains a thermoplastic resin or a thermosetting resin as a resin component, and contains an inorganic filler in order to improve the heat dissipation of the electrical component 4, or more Depending on the type, a compounding agent such as a curing agent, a curing accelerator, a surface treatment agent, or the like can be used. When a thermosetting resin is used as the resin component, a solvent can be blended for adjusting the viscosity.

  Although it does not specifically limit as a thermosetting resin, A well-known epoxy resin, a phenol resin, cyanate resin etc. can be used, Among these, only 1 type is used individually or in mixture of 2 or more types. be able to. Further, when an additive-type flame retardant is further blended, flame retardancy can be obtained. However, when a part or all of the thermosetting resin is brominated or phosphorus-modified, heat resistance and Flame retardancy can be improved while sufficiently maintaining the mechanical strength.

  It does not specifically limit as a hardening | curing agent or a hardening accelerator, According to the thermosetting resin to be used, it can select from a well-known thing suitably and can be used. For example, when an epoxy resin is used as the thermosetting resin, a curing agent such as phenol novolac resin or dicyandiamide can be blended as the curing agent, and 2-ethyl-4-methylimidazole as the curing accelerator. And a curing accelerator such as triphenylphosphine can be blended.

  As the surface treatment agent, a coupling agent such as a silane coupling agent or a titanate coupling agent, or a dispersing agent such as a phosphate ester dispersant or an ether amine dispersant can be used. Thereby, the dispersibility of the inorganic filler in a resin composition can be improved.

  As the solvent, it is preferable to use a solvent having a low boiling point such as methyl ethyl ketone or acetone. This is because when such a low boiling point solvent is used, the shape of the surface of the resin sheet 6 after drying becomes good. On the other hand, when a high-boiling solvent is used, there is a high possibility that the solvent does not volatilize sufficiently during drying, and it may remain, which may cause a decrease in electrical insulation and mechanical strength of the insulating layer 8 after curing.

  When the inorganic filler is highly filled in the resin composition, the thermal expansion coefficient of the resin sheet 6 formed from the resin composition is reduced, and the thermal expansion coefficient of the inner layer circuit 3 and the electrical component 4 is matched. Can do. It is preferable that the compounding quantity of an inorganic filler is 80-95 mass% with respect to the resin composition whole quantity (however, except a solvent). At this time, the coefficient of thermal expansion of the cured insulating layer 8 is 20 ppm / ° C. or less, and the above-described matching can be further enhanced. When subjected to heat load, the insulating layer 8 and the inner layer circuit 3 It is possible to prevent the occurrence of defects such as peeling, breakage of the electrical component 4, and disconnection.

As the inorganic filler, aluminum oxide (Al ₂ O ₃ ), magnesium oxide (MgO), boron nitride (BN), aluminum nitride (AlN), silica (SiO ₂ ), titanium oxide (TiO ₂ ), aluminum borate (9Al ₂ O ₃ .2B ₂ O ₃ ) or the like can be used, and among these, only one type can be used alone or two or more types can be mixed and used.

  In addition, in order to adjust the fluidity of the insulating layer 8 at the time of molding, or to prevent the insulating layer 8 from being cracked after curing, a thermoplastic resin such as a phenoxy resin can be blended in the resin composition. .

  The resin composition can be obtained by kneading each of the above components into a slurry using a kneader and adjusting the viscosity to an optimum viscosity.

  Next, the resin composition thus obtained is applied to the surface of a carrier substrate (for example, a PET film, a rolled copper foil, etc.), and this is heated and dried to thereby form a B-stage sheet-like resin layer. Can be obtained. The heating and drying conditions at this time depend on the composition of the resin composition, but are preferably heated at 130 to 170 ° C. for 2 to 10 minutes. The resin layer preferably has a thickness of 50 to 300 μm. The B-stage resin layer obtained as described above can be used as the resin sheet 6 by being peeled off from the carrier substrate.

Next, in the third step, as shown in FIG. 1C, a via hole 10 is formed by drilling with a laser so that the inner layer circuit 3 is exposed on the bottom surface. Here, as the laser, for example, a CO ₂ laser, an Nd: YAG laser, an excimer laser, or the like can be used. Moreover, it is preferable that the thickness of the rigid substrate 1 is as thin as 5 to 200 μm because laser processing can be easily performed. Further, a through hole 11 is formed by making a hole so as to penetrate the laminated body 9 in the laminating direction. The through hole 11 can be formed by laser processing or drilling.

  Thereafter, in the fourth step, as shown in FIG. 1D, outer layer circuits 12 are formed on both sides of the laminate 9. Here, the outer layer circuit 12 can be formed by forming circuits on these surfaces by a subtractive method or the like because the metal layer 2 exists on both surfaces of the laminate 9. Further, the plating 13 such as copper plating is applied to the via hole 10 and the through hole 11 formed in the third step. As shown in FIG. 1D, the plating 13 may be applied only to the inner surface of the via hole 10, but if the diameter of the via hole 10 is small, the via hole 10 may be filled with the plating 13.

  And after passing through the above process, an electrical component built-in multilayer printed wiring board can be obtained.

  Furthermore, the conductive paste 14 may be filled in the via hole 10 that has been plated 13 as described above. Thereby, while being able to improve conduction | electrical_connection reliability, the surface can be made flat. Further, since conduction is ensured by the plating 13, the paste filling the via hole 10 may be a non-conductive paste. The through hole 11 may be filled with the conductive paste 14. Here, as the conductive paste 14, for example, a paste in which conductive fine particles such as carbon, silver, and copper are mixed in a binder having a high concentration and viscosity can be used.

  And after passing through the above process, an electrical component built-in multilayer printed wiring board as shown in FIG.1 (d) can be obtained.

  Next, the second manufacturing method will be described. FIG. 2 shows an example of this method, which has the following steps.

  First, in the first step, as shown in FIG. 2A, a through hole 15 for a via hole 10 is provided by a laser or a drill in a rigid substrate 1 provided with a metal layer 2 on both sides, and the through hole 15 is electrically conductive. Fill with paste 14. Here, as the rigid board | substrate 1 with which the metal layer 2 was provided in both surfaces, the metal-clad laminated board mentioned above can be used, for example. The same laser and conductive paste 14 as those described above can be used. Also in this case, it is preferable that the thickness of the rigid substrate 1 is as thin as 5 to 200 μm so that laser processing can be easily performed. After that, as shown in FIG. 2B, the inner component circuit 3 is formed on one surface of the rigid substrate 1 and the electric component 4 is mounted, thereby producing the electric component mounting substrate 5. Here, the inner layer circuit 3 can be formed by forming the circuit on either side by the subtractive method or the like since the metal layer 2 exists on both sides of the rigid substrate 1. Thus, the inner layer circuit 3 is formed, and the inner layer circuit 3 includes a pad (land) to which the terminal of the electric component 4 is attached and connected. Moreover, as the electrical component 4, the thing similar to what was mentioned above can be used. The electrical component 4 can be mounted by soldering terminals to pads.

  Next, in the second step, as shown in FIG. 2C, the mounting surface 7 of the electric component mounting substrate 5 (the surface on which the electric component 4 is mounted) is superimposed on both surfaces of the resin sheet 6 to mount the electric component. By laminating and integrating the substrates 5 via the resin sheet 6, a laminated body 9 in which the inner layer circuit 3 and the electrical component 4 are embedded in the insulating layer 8 of the resin sheet 6 is produced. Here, as the resin sheet 6, the thing similar to what was mentioned above can be used. Thereafter, outer layer circuits 12 are formed on both sides of the laminate 9 produced as described above. Here, the outer layer circuit 12 can be formed by forming circuits on these surfaces by a subtractive method or the like because the metal layer 2 exists on both surfaces of the laminate 9.

  Thereafter, in the third step, as shown in FIG. 2D, a through hole 11 is formed by drilling with a laser or a drill so as to penetrate the laminated body 9 in the laminating direction. Plating 13 such as copper plating is applied. At this time, plating 13 is also applied to the outer layer circuit 12 other than the through hole 11, and in particular, in the outer layer circuit 12 where the conductive paste 14 is filled, the exposed conductive paste 14 is covered. The lid plating 13a is applied as described above.

  And after passing through the above process, an electrical component built-in multilayer printed wiring board as shown in FIG.2 (d) can be obtained.

  Next, another example of the second manufacturing method will be described. The method shown in FIG. 3 includes the following steps.

  First, in the first step, as shown in FIG. 3A, a through hole 15 for a via hole 10 is provided in a rigid substrate 1 having a metal layer 2 on both sides by a laser or a drill, and a copper hole is provided in the through hole 15. Plating 13 such as plating is applied. Here, as the rigid board | substrate 1 with which the metal layer 2 was provided in both surfaces, the metal-clad laminated board mentioned above can be used, for example. Also, the same laser as described above can be used. In this case as well, the thickness of the rigid substrate 1 is preferably as thin as 5 to 200 μm so that laser processing can be easily performed. Thereafter, as shown in FIG. 3B, the inner component circuit 3 is formed on one side of the rigid substrate 1 and the electric component 4 is mounted, thereby producing the electric component mounting substrate 5. Here, the inner layer circuit 3 can be formed by forming a circuit on either side by a subtractive method or the like because the metal layer 2 exists on both sides of the rigid substrate 1. Thus, the inner layer circuit 3 is formed, and the inner layer circuit 3 includes a pad (land) to which the terminal of the electric component 4 is attached and connected. Moreover, as the electric component 4, the thing similar to what was mentioned above can be used. The electrical component 4 can be mounted by soldering terminals to pads.

  Next, in the second step, as shown in FIG. 3C, the mounting surface 7 of the electric component mounting substrate 5 (the surface on which the electric component 4 is mounted) is superimposed on both surfaces of the resin sheet 6 to mount the electric component. By laminating and integrating the substrates 5 via the resin sheet 6, a laminated body 9 in which the inner layer circuit 3 and the electrical component 4 are embedded in the insulating layer 8 of the resin sheet 6 is produced. At this time, the resin of the resin sheet 6 flows and fills the through holes 15 where the plating 13 is applied. Here, as the resin sheet 6, the thing similar to what was mentioned above can be used. Thereafter, outer layer circuits 12 are formed on both sides of the laminate 9 produced as described above. Here, the outer layer circuit 12 can be formed by forming circuits on these surfaces by a subtractive method or the like because the metal layer 2 exists on both surfaces of the laminate 9.

  Thereafter, in the third step, as shown in FIG. 3D, a through hole 11 is formed by drilling with a laser or a drill so as to penetrate the laminated body 9 in the laminating direction. Plating 13 such as copper plating is applied. At this time, plating 13 is also applied to the outer layer circuit 12 other than the through hole 11, and the exposed resin is covered especially in the outer layer circuit 12 at the location of the through hole 15 filled with the resin. The lid plating 13a is applied as described above.

  And after passing through the above process, an electrical component built-in multilayer printed wiring board as shown in FIG.3 (d) can be obtained.

  Next, the third manufacturing method will be described. FIG. 4 shows an example of this method, which has the following steps.

  First, in the first step, via holes 10 are formed such that the metal layer 2 provided on the other surface is exposed on the bottom surface by irradiating a laser from one surface of the rigid substrate 1 provided with the metal layers 2 on both surfaces. A non-through hole 17 is provided. Here, as the rigid board | substrate 1 with which the metal layer 2 was provided in both surfaces, the metal-clad laminated board mentioned above can be used, for example. As the laser, the same laser as described above can be used. The non-through holes 17 may be provided at a time by laser irradiation, but may be provided in two stages by a conformal mask method. Also in this case, it is preferable that the thickness of the rigid substrate 1 is as thin as 5 to 200 μm so that laser processing can be easily performed. Next, as shown in FIG. 4B, the non-through holes 17 are filled with the conductive paste 14. Here, as the conductive paste 14, the same paste as described above can be used. Although not shown in the drawing, the non-through hole 17 may be plated with copper 13 or the like, and the non-through hole 17 may be plated with copper 13 or the like and then filled with paste. May be. In the latter case, since the conduction is ensured by the plating 13, a non-conductive paste can be used. However, from the viewpoint of further improving the conduction reliability, it is preferable to use the conductive paste 14. Next, the inner layer circuit 3 is formed on the surface 16 on the side where the non-through hole 17 is provided. Here, the inner layer circuit 3 can be formed by forming a circuit by a subtractive method or the like because the metal layer 2 exists on both surfaces of the rigid substrate 1. Thus, the inner layer circuit 3 is formed, and the inner layer circuit 3 includes a pad (land) to which the terminal of the electric component 4 is attached and connected. Thereafter, the electric component mounting board 5 is manufactured by mounting the electric component 4 on the surface 16 on which the inner layer circuit 3 is formed. Here, as the electrical component 4, the same one as described above can be used. The electrical component 4 can be mounted by soldering terminals to pads.

  Next, in the second step, as shown in FIG. 4C, the mounting surface 7 of the electric component mounting substrate 5 (the surface on which the electric component 4 is mounted) is superimposed on both surfaces of the resin sheet 6 to mount the electric component. By laminating and integrating the substrates 5 via the resin sheet 6, a laminated body 9 in which the inner layer circuit 3 and the electrical component 4 are embedded in the insulating layer 8 of the resin sheet 6 is produced. Here, as the resin sheet 6, the thing similar to what was mentioned above can be used.

  Thereafter, in the third step, as shown in FIG. 4D, a through hole 11 is formed by drilling with a laser or a drill so as to penetrate the laminate 9 in the laminating direction, and outer layers are formed on both sides of the laminate 9. The circuit 12 is formed, and plating 13 such as copper plating is applied to the through hole 11. Here, the outer layer circuit 12 can be formed by forming circuits on these surfaces by a subtractive method or the like because the metal layer 2 exists on both surfaces of the laminate 9.

  And after passing through the above process, an electrical component built-in multilayer printed wiring board as shown in FIG.4 (d) can be obtained.

  No matter which of the three methods described above is used, there is no need to use a transfer substrate as in the prior art, and therefore a multilayer printed wiring board with built-in electrical components can be easily manufactured. . And as for the multilayer printed wiring board with a built-in electrical component manufactured in this way, as shown in FIG.1 (d), FIG.2 (d), FIG.4 (d), the electrical component 4 was embedded. On both sides of the insulating layer 8, an insulating layer 18 made of a rigid substrate is laminated and integrated.

Thus , when using a rigid substrate with a base material, the insulating layer 8 in which the electric component 4 is embedded can be reinforced from both sides with the insulating layer 18 with the base material. As compared with the conventional wiring board, sufficient rigidity can be secured. Further, the outer layer circuits 12 formed on the surface of the insulating layer 18 on both sides of the insulating layer 8 in which the electric component 4 is embedded are electrically connected through the through hole 11. Thus, since the insulating layer 18 on which the outer layer circuit 12 is formed is reinforced by the base material, the conduction reliability by the through-hole 11 is improved as compared with the case where the insulating layer is formed only by the cured resin. It is something that can be done. Further, the inner layer circuit 3 on which the electrical component 4 is mounted and the outer layer circuit 12 are electrically connected through the via hole 10. Since the insulating layer 18 between the inner layer circuit 3 and the outer layer circuit 12 is reinforced by the base material, the conduction reliability by the via hole 10 is improved as compared with the case where the insulating layer is formed only by the cured resin. It is something that can be done.

  In the case where the rigid substrate 1 containing a base material is used and its thickness is extremely large, for example, when it exceeds 400 μm, the via hole 10 cannot be formed as shown in FIG. There is a fear. In this case, the electrical connection between the electrical component 4 embedded in the insulating layer 8 and the external circuit 12 for the outer layer can be ensured even though the conduction reliability by the through hole 11 can be ensured while ensuring sufficient rigidity. Both must be performed through the through hole 11. As a result, the circuit length between the electrical component 4 that exists farther away from the through hole 11 and the outer layer circuit 12 becomes longer, and the degree of freedom of circuit connection becomes lower.

  However, since the thickness that can be drilled by laser is currently about 200 μm, the via hole 10 can be formed as shown in FIGS. 1 to 4 as long as the thickness of the rigid substrate does not exceed 200 μm. Then, in the case of using the rigid substrate 1 with a base material, it is possible to ensure conduction reliability while ensuring sufficient rigidity, and for the electrical component 4 embedded in the insulating layer 8 and the external layer for the outside. Since the electrical connection with the circuit 12 can be performed not only through the through hole 11 but also through the via hole 10, the circuit length between the electrical component 4 and the outer layer circuit 12 can be shortened, The degree of freedom of circuit connection can be increased.

An example of embodiment of this invention is shown and (a)-(d) is sectional drawing. The other example of embodiment of this invention is shown, (a)-(d) is sectional drawing. The further another example of embodiment of this invention is shown, (a)-(d) is sectional drawing. The further another example of embodiment of this invention is shown, (a)-(d) is sectional drawing. It is sectional drawing which shows the electrical component built-in multilayer printed wiring board in which the via hole is not formed.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Rigid board 2 Metal layer 3 Inner layer circuit 4 Electrical component 5 Electrical component mounting board 6 Resin sheet 7 Mounting surface 8 Insulating layer 9 Laminated body 10 Via hole 11 Through hole 12 Circuit for outer layer 13 Plating 14 Conductive paste

Claims (5)

A process for producing an electrical component mounting board by providing a metal layer on one surface of a rigid substrate containing a base material , forming an inner layer circuit on the other surface and mounting the electrical component, and a resin without a base material superposed mounting surface of the electrical component mounting board on both sides of the sheet, by laminating and integrating the electrical component mounting board to each other through the resin sheet without substrate, the electrical components in the insulating layer by the resin sheet without substrate A step of producing an embedded laminated body, and forming a via hole by drilling with a laser so that the inner layer circuit is exposed on the bottom surface, and forming a through hole so as to penetrate the laminated body in the laminating direction. And forming a circuit for an outer layer on both sides of the laminate, and plating the via hole and the through hole. Method of manufacturing a door wiring board.   2. The method of manufacturing a multilayer printed wiring board with built-in electric parts according to claim 1, further comprising a step of filling the plated via hole with a conductive paste. A through hole is formed in a rigid substrate with a base material provided with a metal layer on both sides, and a conductive paste is filled or plated in the through hole, and then a circuit for an inner layer is formed on one side of the rigid substrate with the base material. At the same time, by mounting the electrical components, the process of manufacturing the electrical component mounting substrate and the mounting surface of the electrical component mounting substrate on both sides of the resin sheet without the base material are overlapped, and the electrical component mounting substrates are made without the base material. A step of forming a laminated body in which electrical components are embedded in an insulating layer made of a resin sheet without a substrate by laminating and integrating via a resin sheet, and forming an outer layer circuit on both sides of the laminated body, and And forming a through-hole so as to penetrate the laminated body in the laminating direction and plating the through-hole. Method of manufacturing a line plate. Irradiate a laser from one side of a rigid substrate with a metal layer on both sides to provide a non-through hole, and apply plating to the non-through hole, fill with a conductive paste, or apply plating. After applying or filling the paste, forming the inner layer circuit on this surface and mounting the electrical component to produce the electrical component mounting substrate and the electrical surface on both sides of the resin sheet without the substrate superposed mounting surface of the component mounting board, by stacking integrated via the resin sheet without substrate electrical component mounting boards, laminated electrical component is embedded in the insulating layer by the resin sheet without substrate And forming a through hole by penetrating the laminated body in the laminating direction, forming an outer layer circuit on both sides of the laminated body, and plating the through hole. Method of manufacturing an electro-component-embedded multilayer printed wiring board according to claim Rukoto. An insulating layer made of a rigid substrate with a base material is formed on both sides of an insulating layer without a base material in which electrical components are embedded, and the outer layer circuits formed on the surface of the insulating layer on both sides are through. An electrical component built-in multilayer printed wiring board, wherein the electrical component and the outer layer circuit are electrically connected by a via hole.

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