JP4899904B2 - Manufacturing method of circuit component built-in module and circuit component built-in module - Google Patents

Description

  TECHNICAL FIELD The present invention relates to a method for manufacturing a circuit component built-in module and the circuit component built-in module, and more specifically, releases water staying in a layer containing circuit components in the manufacturing process to the outside, and prevents water from staying thereafter. Related to the structure. In the present application, the “via” is a plated via hole for electrically conducting a conductive film layer and a wiring pattern layer, which will be described later, and the “bottom hole” is a plating for forming the via. It is a hole with a bottom before being given.

  2. Description of the Related Art Conventionally, in the field of various electronic component modules, various circuit component built-in modules having a component built-in multilayer substrate structure have been proposed in order to meet demands for miniaturization and low profile (see, for example, Patent Document 1).

  In general, this type of circuit component built-in module includes steps “1-1” to “1-4” shown in FIGS. 11A to 11D and steps “1-” shown in FIGS. 12A to 12D. 5 ”to“ 1-8 ”.

  First, the process “1-1” in FIG. 11 prepares the first structure 3 formed by placing various circuit components 2 on the surface of the wiring pattern layer 1 of a conductive metal such as copper (Cu). It is a process to do. The wiring pattern layer 1 is formed on the surface of the base plate 4 by electrolytic plating, electroless plating, sputtering, or the like, and the circuit component 2 is placed on the required electrode 1a via, for example, solder bumps 5.

  In the step “1-2”, an electrically insulating substrate body 8 having a structure in which a copper foil conductive film layer 7 is integrally formed on the surface of an insulating layer 6 made of a thermosetting resin is prepared, and a prepreg (semi-cured) is prepared. The insulating layer 6 in the state) is pressed and pressure-bonded to the first component 3 from above, and the circuit component 2 is embedded in the electrically insulating substrate 8 with the back surface of the wiring pattern layer 1 in contact with the base plate 4. It is a process to do.

Step “1-3” is a step of forming holes 9 at the positions of the respective bottomed holes, which will be described later, of the conductive film layer 7 by, for example, patterning using a known conformal mask method.

  Step “1-4” is a step of forming the bottomed hole 10 a in the insulating layer 6 immediately below each hole 9 by laser processing indicated by an arrow line. Each bottomed hole 10a has the bottom surface of the surface of the wiring pattern layer 1, more precisely, the surface of the intended electrode 1a of the wiring pattern layer 1.

  The process “1-5” is a known desmear process, in which the electrically insulating substrate body 8 in which each bottomed hole 10a is formed is immersed in a chemical solution, a chemical solution is sprayed on the electrically insulating substrate body 8, and the like. Then, the smear called smear generated by the formation of the bottomed hole 10a is removed, and the fixing of plating in the subsequent plating process is promoted.

  In the step “1-6”, each bottomed hole 10a is formed in the via 10b so that the conductor film layer 7 and the intended electrode 1a of the wiring pattern layer 1 are electrically connected to each other through each bottomed hole 10a. In the step of forming the second structure 11 by processing, in the electrically insulating substrate body 8 after the desmear treatment, the surface of the conductor film layer 7, the peripheral surface and the bottom surface of each bottomed hole 10a are uniformly formed. A covering plating layer 12 is formed, and each bottomed hole 10a is processed into a via 10b.

  Step “1-7” is a step of filling each bottomed hole 10 a after forming the plating layer 12, that is, the hole of each via 10 b with the nonconductive paste 13.

Step “1-8” is a step of heating the second component 11 filled with the non-conductive paste 13 to cure the non-conductive paste 13, and the heating temperature is about 180 ° C., for example. A circuit component built-in module is manufactured through the above steps.
JP 2000-36659 A JP-A-10-303334

  In the case of this type of conventional circuit component built-in module formed through the steps 1-1 to 1-8, the hole 9 is formed in the step “1-3”, and the bottomed hole 10a is formed in the step “1-4”. As a result, the insulating layer 6 of the electrically insulating substrate body 8 is exposed to the outside air, and moisture is absorbed by the electrically insulating substrate body 8 (precisely, the insulating layer 6). The Further, by applying the desmear process of the step “1-5”, a larger amount of moisture is absorbed and accumulated in the electrically insulating substrate body 8 as indicated by the arrow line in FIG.

  Then, since plating is performed so as to seal the bottomed hole 10a in the step “1-6”, the opportunity for releasing the moisture contained in the electrically insulating substrate body 8 is lost thereafter. Since the peripheral portion of the electrically insulating substrate body 8 is also subjected to a sealing process such as plating, moisture is not released from the peripheral portion of the electrically insulating substrate body 8.

Thereafter, the via 10b is filled with the non-conductive paste 13 in the step “1-7”, and the step “1-7”
The non-conductive paste 13 is cured by heating at 1-8 ". At that time, heat exceeding 100 ° C. (specifically, heat at about 180 ° C.) is applied to the entire electrically insulating substrate body 8 by the heat treatment. Therefore, the moisture contained in the electrically insulating substrate body 8 is vaporized and bubbles 15 are generated.

  Therefore, the copper foil of the conductive film layer 7 formed on the surface of the electrically insulating substrate body 8 and the plating layer 12 swell up by the bubble pressure accompanying the vaporization, so-called “popcorn phenomenon” occurs. As a result, the copper foil of the conductor film layer 7 and the plating layer 12 are peeled off from the electrically insulating substrate body 8.

  On the other hand, for example, in a plastic wiring substrate constituting an LSI BGA (Ball Grid Array) or PGA (Pin Grid Array), when a semiconductor chip is mounted on a solid pattern conductor layer and heated, It is known that part of the semiconductor chip mounted on the plastic wiring board is peeled off from the adhesive layer due to the “popcorn phenomenon” due to the vaporization of moisture, and the adhesive strength between the semiconductor chip and the adhesive layer is greatly reduced. It has been.

  In order to prevent the peeling due to the “popcorn phenomenon”, as shown in FIG. 13, in the plastic substrate 101 constituting the plastic wiring substrate 100, a solid pattern conductor at the center of the motherboard connecting surface 102 on which the semiconductor chip is mounted. It has been proposed to form an opening 103a for releasing moisture in the layer 103 (see, for example, Patent Document 2). In FIG. 13, 104 is a through hole, 104a is a conductor layer, and 105a is a solder ball pad.

  However, even if the “popcorn phenomenon” is prevented by allowing the water to evaporate from the opening 103a, the water easily enters and exits from the opening 103a due to a change in the external environment. There is a problem of being affected.

  The present invention prevents the occurrence of the “popcorn phenomenon” due to heating during manufacturing in this type of circuit component built-in module, and improves moisture resistance by preventing moisture from entering again after the heating, thereby improving characteristics. For the purpose.

In order to achieve the above-described object, a method for manufacturing a circuit component built-in module according to the present invention includes a step A for preparing a first component formed by placing a circuit component on a wiring pattern layer, and an insulator layer An electrically insulating substrate body having a structure in which a conductor film layer is integrally formed on the surface is prepared, and the circuit component is disposed on the electrically insulating substrate body in a state where the wiring pattern layer is exposed on the back surface side of the insulator layer. A step B of embedding in the substrate, a step C of forming a bottomed hole with the surface of the wiring pattern layer as a bottom surface in the electrically insulating substrate body, and forming the opening in the conductor film layer to form the insulator layer And forming the second structure by processing the bottomed hole into a via so that the conductor film layer and the wiring pattern layer are electrically connected to each other through the bottomed hole. A step E of forming, a step F of heating the second component to a predetermined temperature, and And a step G to integrally form an electrode layer that seals busy covering at least the opening after the serial heating the surface of the electrically insulating substrate material, the step E, the surface of the conductive film layer, Forming a plating layer that uniformly covers a peripheral surface and a bottom surface of the bottomed hole and the surface of the insulator layer exposed from the opening; and a non-conductive paste in the bottomed hole after the formation of the plating layer Filling the non-conductive paste and polishing the surface of the plating layer to peel off the plating layer on the surface of the insulator layer located in the opening, and through the opening the insulation And the step of exposing the body layer, wherein the non-conductive paste is cured by heating in the step F (claim 1).

Further, in the method for manufacturing a circuit component built-in module of the present invention, the step D, it is preferable the opening is a step of forming the upper position of the circuit components embedded in the insulating layer (claim 2 The predetermined temperature in the step F is preferably a temperature above the temperature at which water inside the second component evaporates (Claim 3 ).

Next, the circuit component built-in module of the present invention is provided integrally with the wiring pattern layer on which the circuit component is placed, the insulator layer, and the surface of the insulator layer, and the insulator layer is partially exposed. An electrically insulating substrate body having a conductive film layer having an opening formed therein, wherein the circuit component is embedded in the insulator layer in a state where the wiring pattern layer is exposed on a back surface side of the insulator layer; A via hole that is formed by processing a bottomed hole of the electrically insulating substrate body having the surface of the wiring pattern layer as a bottom surface, and electrically connects the conductor film layer and the wiring pattern layer; An electrode layer formed on the surface of the electrically insulating substrate so as to cover and seal at least the opening, and the via covers a peripheral surface and a bottom surface of the bottomed hole with a plating layer, Fill the bottomed hole covered with layers with non-conductive paste It is characterized by being formed Te (claim 4).

Then, in the circuit component built-in module of the present invention, the opening of the front Symbol conductive film layer is preferably formed on the buried position above the circuit component on the insulating layer (claim 5).

  According to the first aspect of the present invention, in step D prior to step F of heating the second component, an opening is formed in the conductive film layer of the electrically insulating substrate body, and vaporized by heating in step F. The moisture of the electrically insulating substrate body evaporates to the outside from the opening formed in the conductor film layer, thereby preventing the “popcorn phenomenon” from occurring.

  In addition, since the opening formed in the conductor film layer is covered and sealed by the electrode layer by the process G after the process F, even if the humidity change of the external environment occurs after the heat treatment of the process F, Moisture does not enter and exit from the opening formed in the conductor film layer into the electrically insulating substrate, and the electrically insulating substrate does not become wet.

  Therefore, in this type of circuit component built-in module, it is possible to prevent the occurrence of a “popcorn phenomenon” due to heating during manufacturing, and to improve moisture resistance by preventing moisture from entering again after the heating, thereby improving characteristics. it can.

Further, according to the invention of claim 2, in the step D, the opening of the conductive film layer is located above the circuit component in which water in the insulator layer is likely to collect water and the vaporization pressure is likely to be increased by heating in the step F. Therefore, the occurrence of the “popcorn phenomenon” can be extremely effectively prevented, and the characteristics of this type of circuit component built-in module can be further improved.

According to the invention of claim 3 , the predetermined temperature in the step F is a temperature above the temperature at which the water inside the second component evaporates, and is extremely specific and practical.

Next, according to the invention of claim 4 , since the opening part for partially exposing the insulator layer is formed in the conductive film layer of the electrically insulating substrate body, after the opening part is formed at the time of manufacture. The moisture of the electrically insulating substrate body that has been vaporized by heating can be evaporated from the opening to the outside, thereby preventing the “popcorn phenomenon” from occurring.

  In addition, since the electrode layer formed on the surface of the electrically insulating substrate covers and seals at least the opening, the moisture resistance is improved by preventing moisture from entering again after the heating and improving the characteristics. Can be achieved.

  Therefore, a new built-in circuit component module that prevents the occurrence of “popcorn phenomenon” due to heating during manufacturing, improves moisture resistance by preventing moisture from entering again after the heating, and improves characteristics is provided. can do.

Furthermore, according to the invention of claim 5, since the opening of the conductor film layer is located above the circuit component embedded in the insulator layer, the occurrence of the “popcorn phenomenon” is extremely effectively prevented. Therefore, it is possible to provide a circuit component built-in module having further excellent characteristics.

  Next, in order to describe the present invention in more detail, embodiments will be described in detail with reference to FIGS.

(First embodiment)
A first embodiment will be described with reference to FIGS.

  FIG. 1 is a cross-sectional view of a circuit component built-in module Ma, and FIGS. In these drawings, the same reference numerals as those in FIGS. 11 and 12 denote the same or corresponding elements.

(Structure of the circuit component built-in module Ma)
The circuit component built-in module Ma is provided integrally with the wiring pattern layer 1 on which the circuit component 2 is placed, the insulator layer 6, and the surface of the insulator layer 6, and an opening that partially exposes the insulator layer 6. And an electrically insulating substrate body in which the circuit component 2 is embedded in the insulator layer 6 with the wiring pattern layer 1 exposed on the back side of the insulator layer 6. 8, a via 10 b that electrically connects the conductor film layer 7 and the wiring pattern layer 1, and an electrode layer 17 that is formed so as to cover and seal at least the opening 16 on the surface of the electrically insulating substrate 8. And a structure provided with.

  The wiring pattern layer 1 is formed on the surface of a base plate 4 made of an insulating substrate or a SUS transfer plate, and the circuit component 2 is placed on a required electrode 1a constituting the wiring pattern layer 1 via, for example, solder bumps 5. It is placed. The circuit component 2 can also be formed on a required electrode 1a by a reflow method.

  In the case of this embodiment, the insulator layer 6 is formed of a practical thermosetting resin such as an epoxy resin, but may be formed of an ultraviolet curable resin or the like.

  Further, as will be described later, the via 10b is formed by processing a bottomed hole 10a having the wiring pattern layer 1 as a bottom surface. Specifically, the peripheral surface and the bottom surface of the bottomed hole 10a are covered with a plating layer 18 and plated. The bottomed hole 10a covered with the layer 18 is filled with a non-conductive paste 13 made of an inexpensive thermosetting resin.

  In addition, the opening 16 extremely effectively prevents the “popcorn phenomenon” from occurring, so that the vaporization pressure of moisture is likely to increase due to heating, that is, the position above the circuit component 2, that is, the electrically insulating substrate body 8. It is formed in a range that overlaps with circuit components as viewed from the main surface direction.

(Method for manufacturing circuit component built-in module Ma)
Next, a specific method for manufacturing the circuit component built-in module Ma will be described with reference to FIGS.

  The manufacturing method of the present embodiment is roughly illustrated in steps “2-1” to “2-4” in FIGS. 2A to 2D and steps “2-5” in FIGS. 3A to 3C. “2-7”, comprising steps “2-8” to “2-10” of FIGS. 4A to 4C.

  The process “2-1” is the same as the process “1-1” in FIG. 11, and forms the process A of the present invention. Various processes are performed on the surface of the wiring pattern layer 1 made of a conductive metal such as copper (Cu). The first component 3 formed by placing the circuit component 2 is prepared. The wiring pattern layer 1 is formed on a base plate 4 that is a transfer plate made of a substrate or SUS.

  The process “2-2” is the same process as the process “1-2” in FIG. 11, forming the process B of the present invention, and integrally forming the conductor film layer 7 of copper foil on the surface of the insulator layer 6. An electrically insulating substrate body 8 having a structure is prepared. Further, in the case of this embodiment in which the insulating layer 6 is made of a thermosetting resin, the prepreg (semi-cured state) insulating layer 6 is used as the first component 3. The circuit component 2 is electrically insulated by pressing from above and crimping, with the back surface of the wiring pattern layer 1 exposed on the back surface side of the insulator layer 6 and the back surface of the wiring pattern layer 1 in contact with the base plate 4. Embed in the body 8.

  The process “2-3” is a process including the processes “1-3” and “1-4” of FIG. 11 and forms the process C of the present invention. For example, the hole 9 is formed by patterning using a known conformal mask method. Then, a bottomed hole 10a is formed in the insulator layer 6 immediately below each hole 9 by laser processing indicated by an arrow line. Each bottomed hole 10a has the bottom surface of the surface of the wiring pattern layer 1, more precisely, the surface of the intended electrode 1a of the wiring pattern layer 1.

  Process “2-4” is an unprecedented process, forming process D of the present invention, and forming opening 16 for evaporating moisture in conductor film layer 7 before heating electrically insulating substrate body 8. Then, the insulator layer 6 is partially exposed. The opening 16 can be formed by various wet or dry etching processes.

  In the case of the present embodiment, as described above, in order to prevent the occurrence of the “popcorn phenomenon” very effectively, it is formed at a position above the circuit component 2 where the vaporization pressure of moisture tends to increase due to heating. . It should be noted that the number, size, formation position, shape, and the like of the openings 16 may be any suitable values for preventing the occurrence of the “popcorn phenomenon”, and may be set appropriately by experiments or the like. If it is formed above the component 2, a high effect can be obtained.

  The process “2-5” is the same desmear process as the process “1-5” in FIG. 12, and the electrically insulating substrate body 8 in which each bottomed hole 10a and the opening 16 are formed is immersed in a chemical solution, Smear generated by the formation of the bottomed hole 10a is removed by spraying a chemical solution on the electrically insulating substrate body 8 to promote fixing of plating in the subsequent plating process.

  During the processes “2-3” and “2-4”, the insulating layer 6 of the electrically insulating substrate body 8 is exposed to the outside air, and moisture is applied to the electrically insulating substrate body 8. In addition to being easily absorbed, in the desmear process of this process “2-5”, a larger amount of moisture is absorbed by the electrically insulating substrate body 8 and accumulated in the insulating layer 6 as shown by the arrow line in the figure. Is done. The desmear process 2-6 may be omitted.

  The process “2-6” is the same process as the process “1-6” in FIG. 12, forms the process E of the present invention, and the conductor film layer 7 and the wiring pattern layer 1 pass through the bottomed hole 10a. Then, the bottomed hole 10a is processed into a via 10b so as to be electrically connected to form a second component 17 corresponding to the second component 11 in the step “1-6”.

  Specifically, in the case of the present embodiment, a plating layer 18 that uniformly covers the surface of the conductor film layer 7, the peripheral and bottom surfaces of the bottomed holes 10 a, and the surface of the insulator layer 6 exposed from the opening 16 is provided. Then, each bottomed hole 10a is processed into a via 10b. At this time, the plating layer 18 is formed by first metallizing the surface of the electrically insulating substrate 8 uniformly by electroless plating and forming an electrolytic plating layer thereon. In this case, since the electroplating can be formed thick, the conductive film layer 7 on the upper surface of the electrically insulating substrate body 8 and the wiring pattern layer 1 on the bottom surface of the electrically insulating substrate body 8 through the electroplating layer. Very good electrical continuity can be obtained.

  The process “2-7” is the same process as the process “1-7” in FIG. 12, and is a second process included in the process E of the present invention. Then, after the plating layer 18 is formed, the non-conductive paste 13 is filled in the via 10b. This filling is merely for filling holes, and a conductive paste can be used instead of the non-conductive paste 13 as will be described later, but the conductive paste is expensive, so this embodiment Is filled with an inexpensive non-conductive paste 13.

  Moreover, in this process "2-7", in order to semi-harden the paste 13, after filling with the nonelectroconductive paste 13, temporary drying is given as needed. In addition, it is preferable to temporarily dry at about 80 degreeC so that grinding | polishing of process "2-8" mentioned later can be performed.

  At this time, since the open portion 16 is covered with the plating layer 18 and the insulating layer 6 of the electrically insulating substrate body 8 is not exposed, moisture contained in the electrically insulating substrate body 8 by temporary drying. The temperature of the temporary drying is kept at a temperature lower than 100 ° C. at which water does not evaporate so that the water does not inadvertently evaporate. By doing so, the “popcorn phenomenon” does not occur by temporary drying.

  The process “2-8” is a third process included in the process E of the present invention. The surface of the plating layer 18 is polished after the non-conductive paste 13 is filled and temporarily dried, and the polishing protrudes from the via 10b. The nonconductive paste 13 is removed and the surface is flattened. At this time, the plating layer 18 on the surface of the conductor film layer 7 is removed, and at the same time, the plating layer 18 on the surface of the insulating layer 6 located in the shallow opening 16 is peeled off and removed, and the insulating layer is passed through the opening 16. 6 is exposed.

  Then, instead of preparing a dedicated process for re-exposing the insulating layer 6 in the opening 16 covered with the plating layer 18, the surface of the electrically insulating substrate body 8 is polished and protruded from the via 10b. Since the insulating layer 6 in the opening 16 can be exposed at the same time in the polishing step of removing the conductive paste 13, there is an advantage that the number of steps does not increase.

  Step “2-9” forms Step F of the present invention, and the second component 17 is heated to a predetermined temperature to cure the non-conductive paste 13.

  At this time, the non-conductive paste 13 made of a thermosetting resin is cured by heating to about 180 ° C.

  And the temperature of the heating for this hardening is high temperature more than the temperature (usually 100 degreeC which is the boiling point of water) at which the water inside the 2nd structure 17 evaporates, and an electrically insulating board | substrate by the heating The water in the body is surely evaporated and transpires from the opening 16 to the outside as shown by the arrow line in FIG.

  Therefore, the “popcorn phenomenon” does not occur even by the main drying.

  Step “2-10” forms Step G of the present invention, and the lid-plated electrode layer 19 that covers and seals at least the opening 16 is formed on the surface of the electrically insulating substrate body 8 after the heating of the main drying. It is formed integrally. The electrode layer 19 may be of a size that covers and seals the opening 16, but in the present embodiment, the entire surface of the electrical insulator layer 8 is formed for the purpose of simplifying the process and forming a shield. The electrode layer 19 is formed so as to uniformly cover the surface.

  The electrode layer 19 is formed immediately after the completion of the main drying step 2-9, and the opening 16 is covered and sealed with the electrode layer 19, whereby the electrically insulating substrate body 8 has the insulator layer 6 disposed outside. Therefore, the electrically insulating substrate body 8 will not absorb moisture thereafter. In addition, the electrically insulating substrate body 8 is electrically shielded by the electrode layer 19.

  After the electrode layer 19 is formed, the circuit component built-in module Ma is completed by peeling off the transfer plate of the base plate 4 as necessary.

  In this case, since the opening 16 is formed in the conductive film layer 7 of the electrically insulating substrate body 8 in the process D before the process F of heating the second component 17, the high temperature of the main drying in the process F is high. The moisture of the electrically insulating substrate body 8 vaporized by heating is evaporated to the outside from the opening 16 formed in the conductor film layer 7, and the occurrence of the “popcorn phenomenon” is prevented.

  Further, since the opening 16 formed in the conductor film layer 7 is covered and sealed by the electrode layer 19 in the process G immediately after the process F, a change in humidity of the external environment occurs after the heat treatment in the process F. However, moisture does not enter or leave the electrically insulating substrate body 8 from the opening 16 formed in the conductor film layer 7, and the electrically insulating substrate body 8 may be in a moist state with a lot of moisture. Absent.

  Therefore, the circuit component built-in module Ma prevents the occurrence of the “popcorn phenomenon” due to the main drying heating at the time of manufacture, and increases moisture resistance by preventing moisture from entering again after the heating. An electrical shield is also formed, and can be manufactured with improved layer characteristics.

(Second Embodiment)
A second embodiment will be described with reference to FIGS.

  In this embodiment as well, the circuit component built-in module Ma of FIG. 1 is manufactured, but the manufacturing method is different from that of the first embodiment.

  5-7 is explanatory drawing of the manufacturing method, In those drawings, the same code | symbol as FIGS. 1-4 shows the same or equivalent thing.

  In the case of the present embodiment, the circuit component built-in module Ma includes steps “3-1” to “3-4” in FIGS. 5A to 5D and steps “3-5” to “3-” in FIG. 7 ”and steps“ 3-8 ”to“ 3-10 ”in FIG.

  At this time, the steps “3-1” and “3-2” are the same steps as the steps “2-1” and “2-2” in FIG. 2, the first component 3 is prepared, and the wiring pattern layer 1 is prepared. The circuit component 2 is embedded in the electrically insulating substrate body 8 in a state where is exposed on the back side of the insulator layer 6.

  The process “3-3” is a process unique to the present embodiment and corresponds to the process D of the present invention. As shown by the arrow line in the drawing, the opening 16 together with the hole 9 is formed by patterning of the conformal mask method, for example. Form. By doing in this way, a process becomes fewer than the case where the hole 9 and the opening part 16 are formed separately.

  The process “3-4” corresponds to the process “2-3” in FIG. 2, and the bottomed hole 10a is formed in the insulator layer 6 immediately below each opening 9 by laser processing indicated by an arrow line.

  6 and FIG. 7 after forming the bottomed hole 10a in the step “3-4” are the steps “2-5” to “3-10” in FIG. 3 and FIG. “2-10” is the same processing step.

  Therefore, in the case of the present embodiment, the opening 16 is formed at the same time by the patterning process for forming the holes 9, thereby further simplifying the work of the process and the like as in the first embodiment. Can play.

(Third embodiment)
A third embodiment will be described with reference to FIGS. In these drawings, the same reference numerals as those in FIGS. 1 to 7 denote the same or corresponding elements.

  In this embodiment, steps “4-1” to “4-4” in FIGS. 8A to 8D, steps “4-5” and “4-6” in FIGS. 9A and 9B are performed. ”, Steps“ 4-7 ”to“ 4-9 ”in FIGS. 10A to 10C are performed.

  Then, the bottomed hole 10a is filled with the conductive paste 20 of FIGS. 9 and 10 to form a via 10c corresponding to the via 10b of FIG. 1, and the plating layer 18 of FIG. ) Of the circuit component built-in module Mb.

  Specifically, the processes “4-1” to “4-4” in FIG. 8 are performed in the same manner as steps “3-1” to “3-4” in FIG. The bottomed hole 10a, the opening 16 and the like are formed in the bottom. Steps “4-1”, “4-2”, “4-3”, and “4-4” are steps A, B, D, and C of the present invention.

  Moreover, the same desmear process as the process “3-5” of FIG. 6 is performed by the process “4-5” of FIG. 9A.

  Next, a step corresponding to the step of forming the plating layer 18 in FIG. 6B is omitted, and FIG. 9B is substituted for the filling process of the non-conductive paste 13 in the step “3-7” in FIG. The conductive paste 20 is filled into the bottomed hole 10a of the electrically insulating substrate body 8 by the process “4-6”.

  Then, if necessary, the conductive paste 20 is semi-cured by temporary drying. Since the temperature of this temporary drying is maintained at a temperature lower than 100 ° C. at which water does not evaporate, the “popcorn phenomenon” does not occur depending on the temporary drying.

  Thereafter, the conductive paste 20 is polished and flattened by the step “4-7” of FIG.

  Steps “4-5” and “4-6” correspond to step E of the present invention.

  Then, the processes “4-8” and “4-9” in FIGS. 10B and 10C are the same as the processes “3-8” and “3-9” in FIGS. 7B and 7C. The main drying and the formation of the electrode layer 19 are performed, and the circuit component built-in module Mb is manufactured.

  Therefore, in this embodiment, the process of forming the plating layer 18 can be omitted, and the circuit component built-in module Mb can be manufactured with a small number of processes.

  Then, the opening 16 is formed to cure the conductive paste 20, and then the electrode layer 19 to be the lid plating is formed. As in the case of manufacturing the circuit component built-in module Ma, the main drying at the time of manufacturing is performed. The circuit prevents the occurrence of “popcorn phenomenon” by heating and increases moisture resistance by preventing moisture from entering again after the heating, and also forms an electrical shield by the electrode layer 19 to improve the layer characteristics. The component built-in module Mb can be manufactured.

  The present invention is not limited to the above-described embodiments, and various modifications other than those described above can be made without departing from the spirit thereof. For example, the first and second embodiments can be performed. In the embodiment, after the plated layer 18 is formed by the steps “2-6” and “3-6” and the bottomed hole 10a is processed into the via 10b, the steps “2-7” and “3-7” are performed. The via 10b is filled by filling the non-conductive paste 13, but the present invention is not limited to the structure manufactured in this way. For example, the steps "2-6" and "3-6" After the plating layer 18 is formed, the via 10b may be in a hollow state without filling the non-conductive paste 13. In this case, there is an advantage that the steps “2-7” and “3-7” for filling and curing the non-conductive paste 13 can be omitted. However, even in such a case, the surface of the electrically insulating substrate body 8 is polished to peel off the plating layer 18 on the surface of the insulating layer 6 located in the opening 16 to expose the insulating layer 6. Therefore, it is necessary to perform heat treatment. By performing the heat treatment, the plating layer 18 can be firmly fixed.

  In addition, the heating temperature of each embodiment, that is, the predetermined temperature of the present invention is not limited to 180 ° C., and the temperature at which water of the electrically insulating substrate body 8 evaporates and evaporates to the outside (usually 100 ° C.). Needless to say, the above temperature may be appropriate.

  Next, the circuit component 2 is disposed between the two bottomed holes 10a as illustrated in the embodiments, but the circuit component 2 and the bottomed hole 10a may not be in such an arrangement relationship. Of course. However, in the arrangement relationship in which the circuit component 2 is sandwiched between the two bottomed holes 10a, moisture does not easily escape from side to side, and the circuit component 2 is more likely to accumulate on the circuit component 2. It is a more preferable situation to provide 16.

  Further, for example, the transfer plate or the like is peeled off from the circuit component built-in module Ma obtained by the step “3-10” of the second embodiment, and another electrically insulating substrate body (this The substrate body has at least the wiring pattern layer 1 and the bottomed hole 10a, but the circuit component 2 may not be embedded) and is laminated to manufacture a circuit component built-in module having a multilayer structure. The present invention can be similarly applied.

  In the case of manufacturing a circuit component built-in module having such a multilayer structure, for example, the circuit component built-in module Ma obtained by the above-mentioned process “3-10” has a so-called shield electrode layer formed by the electrode layer 19. Often located in the uppermost layer, it may be located in the lowermost layer or the middle layer. The same applies to the circuit component built-in module Mb.

  And the constituent material of the insulator layer 6, the conductor film layer 7, the nonconductive paste 13, and the conductive paste 20 are not limited to those described in each embodiment. Moreover, those shapes, dimensions, etc. may be any.

It is sectional drawing of the circuit component built-in module of 1st Embodiment. FIG. 7 is an explanatory diagram of a part of the manufacturing process of the circuit component built-in module of FIG. 1. FIG. 12 is an explanatory diagram of another part of the manufacturing process of the circuit component built-in module of FIG. 1. FIG. 12 is an explanatory view of still another part of the manufacturing process of the circuit component built-in module of FIG. 1. It is explanatory drawing of a part of manufacturing process of the circuit component built-in module of 2nd Embodiment. It is explanatory drawing of the other part of manufacturing process of the circuit component built-in module of 2nd Embodiment. FIG. 12 is an explanatory view of still another part of the manufacturing process of the circuit component built-in module according to the second embodiment. It is explanatory drawing of a part of manufacturing process of the circuit component built-in module of 3rd Embodiment. It is explanatory drawing of the other part of manufacturing process of the circuit component built-in module of 3rd Embodiment. It is explanatory drawing of a part of others of the manufacturing process of the circuit component built-in module of 3rd Embodiment. It is explanatory drawing of a part of manufacturing process of the conventional module. It is explanatory drawing of other one part of the manufacture process of the conventional module. It is a top view of the conventional plastic wiring board.

Explanation of symbols

Ma, Mb Circuit component built-in module 1 Wiring pattern layer 2 Circuit component 3 First component 6 Insulator layer 7 Conductive film layer 8 Electrically insulating substrate body 10a Bottomed hole 10b, 10c Via 13 Non-conductive paste 17 2nd Component 18 Plating layer 19 Electrode layer

Claims (5)

Preparing a first component formed by placing circuit components on the wiring pattern layer; and
An electrically insulating substrate having a structure in which a conductor film layer is integrally formed on the surface of an insulator layer is prepared, and the circuit component is electrically connected with the wiring pattern layer exposed on the back side of the insulator layer. Step B for embedding in an insulating substrate body;
Forming a bottomed hole having a bottom surface of the surface of the wiring pattern layer in the electrically insulating substrate body; and
Forming an opening in the conductor film layer to partially expose the insulator layer; and
Forming the second structure by processing the bottomed hole into a via so that the conductor film layer and the wiring pattern layer are electrically connected through the bottomed hole; and
Heating the second component to a predetermined temperature; and
A step G of integrally forming an electrode layer covering and sealing at least the opening on the surface of the electrically insulating substrate body after the heating;
Equipped with a,
The step E includes a step of forming a plating layer that uniformly covers the surface of the conductor film layer, the peripheral and bottom surfaces of the bottomed hole, and the surface of the insulator layer exposed from the opening, and the plating layer Filling the bottomed hole with a non-conductive paste after the formation of the non-conductive paste, and polishing the surface of the plating layer after the non-conductive paste is filled to form the surface of the insulator layer located in the opening Peeling the plating layer and exposing the insulator layer through the opening,
The method of manufacturing a circuit component built-in module, wherein the non-conductive paste is cured by heating in the step F. 2. The method of manufacturing a circuit component built-in module according to claim 1 , wherein the step D is a step of forming the opening at a position above the circuit component embedded in the insulator layer. 3. The method for manufacturing a circuit component built-in module according to claim 1, wherein the predetermined temperature in the step F is a temperature equal to or higher than a temperature at which water inside the second component evaporates. A wiring pattern layer on which circuit components are placed;
An insulating layer, and a conductor film layer provided integrally on a surface of the insulating layer and having an opening that partially exposes the insulating layer; and the wiring pattern layer is formed of the insulating layer. An electrically insulating substrate body in which the circuit component is embedded in the insulator layer in a state exposed on the back surface side;
A via hole that is formed by processing a bottomed hole of the electrically insulating substrate body having the surface of the wiring pattern layer as a bottom surface, and electrically connects the conductor film layer and the wiring pattern layer;
An electrode layer formed so as to cover and seal at least the opening on the surface of the electrically insulating substrate;
With
The via is formed by covering a peripheral surface and a bottom surface of the bottomed hole with a plating layer, and filling the bottomed hole covered with the plating layer with a non-conductive paste. built-in modules. 5. The circuit component built-in module according to claim 4 , wherein the opening of the conductor film layer is formed at a position above the circuit component embedded in the insulator layer. 6.

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