JPWO2025134699A1 - - Google Patents

Info

Publication number
JPWO2025134699A1
JPWO2025134699A1 JP2025565176A JP2025565176A JPWO2025134699A1 JP WO2025134699 A1 JPWO2025134699 A1 JP WO2025134699A1 JP 2025565176 A JP2025565176 A JP 2025565176A JP 2025565176 A JP2025565176 A JP 2025565176A JP WO2025134699 A1 JPWO2025134699 A1 JP WO2025134699A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025565176A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2025134699A1 publication Critical patent/JPWO2025134699A1/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
JP2025565176A 2023-12-22 2024-11-26 Pending JPWO2025134699A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023216733 2023-12-22
PCT/JP2024/041729 WO2025134699A1 (ja) 2023-12-22 2024-11-26 積層基板

Publications (1)

Publication Number Publication Date
JPWO2025134699A1 true JPWO2025134699A1 (https=) 2025-06-26

Family

ID=96138221

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025565176A Pending JPWO2025134699A1 (https=) 2023-12-22 2024-11-26

Country Status (2)

Country Link
JP (1) JPWO2025134699A1 (https=)
WO (1) WO2025134699A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100968278B1 (ko) * 2008-03-28 2010-07-06 삼성전기주식회사 절연시트 및 그 제조방법과 이를 이용한 인쇄회로기판 및그 제조방법
WO2020095988A1 (ja) * 2018-11-08 2020-05-14 株式会社クラレ 熱可塑性液晶ポリマーフィルムおよびそれを用いた回路基板
CN114174062A (zh) * 2019-08-06 2022-03-11 株式会社村田制作所 树脂片及树脂多层基板
JPWO2022004504A1 (https=) * 2020-06-30 2022-01-06
WO2023189794A1 (ja) * 2022-03-31 2023-10-05 日鉄ケミカル＆マテリアル株式会社 金属張積層板及びその製造方法

Also Published As

Publication number Publication date
WO2025134699A1 (ja) 2025-06-26

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