Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B27/00—Layered products comprising a layer of synthetic resin
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B32—LAYERED PRODUCTS
  • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
  • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
  • B32B7/02—Physical, chemical or physicochemical properties
  • B32B7/027—Thermal properties
• • H—ELECTRICITY
  • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
  • H05K1/00—Printed circuits
  • H05K1/02—Details
  • H05K1/03—Use of materials for the substrate

Definitions

• the present invention relates to a laminated substrate.
• Patent Document 1 discloses a laminate comprising a thermoplastic first resin layer, a conductor pattern formed on one main surface of the first resin layer, and a thermoplastic second resin layer, in which the first resin layer is softer than the second resin layer and has a lower dielectric constant than the second resin layer, and the conductor pattern has a portion that contacts the first resin layer along the layer direction of the first resin layer and a portion that contacts the first resin layer along the layering direction of the first resin layer, the second resin layer, and the conductor pattern.
• the first resin layer is made of a fluororesin that is prone to dimensional changes (e.g., has a large thermal expansion coefficient) when heated, and is arranged in a layered manner. Therefore, the laminate described in Patent Document 1 is configured such that the first resin layer is prone to dimensional changes. Furthermore, in the laminate described in Patent Document 1, it is considered that the conductor pattern is less prone to dimensional changes (e.g., has a small thermal expansion coefficient) than the first resin layer.
• the first resin layer is prone to dimensional changes, and further, the first resin layer and the conductor pattern undergo different dimensional changes, which may cause the adhesion between the first resin layer and the conductor pattern to decrease and the laminate to warp.
• the present invention has been made to solve the above problems, and aims to provide a laminated substrate that has excellent adhesion between the resin layer and the conductor layer and suppresses warping.
• the laminated substrate of the present invention comprises a first resin layer having a first main surface and a second main surface opposed to each other in a thickness direction, a second resin layer having a third main surface and a fourth main surface opposed to each other in the thickness direction, the fourth main surface being disposed so as to face the first main surface, and a first conductor layer located between the first resin layer and the second resin layer and disposed so as to be in contact with the first main surface and the fourth main surface, wherein the first resin layer and the second resin layer each contain a first resin material made of a thermoplastic resin and a second resin material made of a thermoplastic resin and dispersed in the first resin material, If the melting point of the first resin material is Tm1 and the melting point of the second resin material is Tm2, then Tm1>Tm2; if the thermal expansion coefficient of the first resin material is CTE1, the thermal expansion coefficient of the second resin material is CTE2, and the thermal expansion coefficient of the first conductor layer is CTE3 in a plane direction perpendicular to the thickness
• the present invention provides a laminated substrate that has excellent adhesion between the resin layer and the conductor layer and suppresses warping.
• FIG. 1 is a cross-sectional view that illustrates a first cross section along a thickness direction of an example of a laminated substrate according to a first embodiment of the present invention.
• FIG. 2 is a cross-sectional view that illustrates a schematic view of an example of the laminated substrate according to the first embodiment of the present invention, taken along a second cross section perpendicular to the first cross section along the thickness direction.
• FIG. 3 is a cross-sectional view showing an enlarged schematic view of a portion of the laminated substrate shown in FIG. 1, and is a cross-sectional view for explaining a method of determining the presence ratio of the second resin material at the interface between the first resin layer and the first conductor layer.
• FIG. 1 is a cross-sectional view that illustrates a first cross section along a thickness direction of an example of a laminated substrate according to a first embodiment of the present invention.
• FIG. 2 is a cross-sectional view that illustrates a schematic view of an example of the laminated substrate according to the first
• FIG. 4 is a cross-sectional view that typically illustrates a step of producing a resin sheet with a conductor layer in an example of the method for producing the laminated substrate according to the first embodiment of the present invention.
• FIG. 5 is a cross-sectional view that typically shows a step of producing another resin sheet with a conductor layer in an example of the method for producing the laminated substrate according to the first embodiment of the present invention.
• FIG. 6 is a cross-sectional view that typically illustrates a step of laminating resin sheets with conductor layers in an example of the method for producing the laminated substrate according to the first embodiment of the present invention.
• FIG. 7 is an example of an enlarged cross-sectional image of the laminated substrate according to the first embodiment of the present invention.
• FIG. 8 is a cross-sectional view for explaining a method for determining the average thickness, average aspect ratio, and average inclination of the second resin material.
• FIG. 9 is an enlarged cross-sectional view illustrating a schematic view of another example of the laminated substrate according to the first embodiment of the present invention, as viewed from the second cross section.
• FIG. 10 is an enlarged cross-sectional view illustrating a schematic view of still another example of the laminated substrate according to the first embodiment of the present invention, as viewed from the second cross section.
• FIG. 11 is a cross-sectional view that illustrates a schematic view of an example of the laminated substrate according to the second embodiment of the present invention, as viewed from the second cross section.
• FIG. 9 is an enlarged cross-sectional view illustrating a schematic view of another example of the laminated substrate according to the first embodiment of the present invention, as viewed from the second cross section.
• FIG. 10 is an enlarged cross-sectional view illustrating a schematic view of still another example of the laminate
• FIG. 12 is a cross-sectional view that illustrates a schematic view of an example of the laminated substrate according to the third embodiment of the present invention, as viewed from a second cross section.
• FIG. 13 is a cross-sectional view that illustrates a schematic view of an example of the laminated substrate according to the fourth embodiment of the present invention, as viewed from the second cross section.
• FIG. 14 is a cross-sectional view that illustrates a first cross section of an example of a laminated substrate according to the fifth embodiment of the present invention.
• FIG. 15 is a cross-sectional view that illustrates a first cross section of an example of a laminated substrate according to a sixth embodiment of the present invention.
• the laminated substrate of the present invention will be described below. Note that the present invention is not limited to the configuration below, and may be modified as appropriate without departing from the gist of the present invention. In addition, a combination of multiple individual preferred configurations described below also constitutes the present invention.
• laminated substrate of the present invention In the following description, unless there is a need to distinguish between the various embodiments, they will simply be referred to as the "laminated substrate of the present invention.”
• the laminated substrate of the present invention comprises a first resin layer having a first main surface and a second main surface opposed to each other in a thickness direction, a second resin layer having a third main surface and a fourth main surface opposed to each other in the thickness direction, the fourth main surface being disposed so as to face the first main surface, and a first conductor layer located between the first resin layer and the second resin layer and disposed so as to be in contact with the first main surface and the fourth main surface, wherein the first resin layer and the second resin layer each contain a first resin material made of a thermoplastic resin and a second resin material made of a thermoplastic resin and dispersed in the first resin material, If the melting point of the first resin material is Tm1 and the melting point of the second resin material is Tm2, then Tm1>Tm2; if the thermal expansion coefficient of the first resin material is CTE1, the thermal expansion coefficient of the second resin material is CTE2, and the thermal expansion coefficient of the first conductor layer is CTE3 in a plane direction perpendicular to the thickness
• Fig. 1 is a cross-sectional view showing an example of the laminated substrate according to the first embodiment of the present invention, as viewed in a first cross section along a thickness direction.
• Fig. 2 is a cross-sectional view showing an example of the laminated substrate according to the first embodiment of the present invention, as viewed in a second cross section perpendicular to the first cross section along a thickness direction.
• the laminate substrate 1 shown in Figures 1 and 2 has a first resin layer 10a, a second resin layer 10b, and a first conductor layer 20a.
• the first resin layer 10a has a first main surface 10aa and a second main surface 10ab that face each other in the thickness direction.
• the second resin layer 10b has a third main surface 10ba and a fourth main surface 10bb that face each other in the thickness direction.
• the fourth main surface 10bb of the second resin layer 10b faces the first main surface 10aa of the first resin layer 10a.
• the fourth main surface 10bb of the second resin layer 10b contacts the first main surface 10aa of the first resin layer 10a except at the location where it contacts the first conductor layer 20a.
• the first resin layer 10a and the second resin layer 10b each contain a first resin material 11a and a second resin material 11b.
• the first resin material 11a is made of a thermoplastic resin.
• LCP liquid crystal polymer
• TPI thermoplastic polyimide
• PPS polyphenylene sulfide
• PEEK polyether ether ketone
• the liquid crystal polymer constituting the first resin material 11a contains a copolymer of p-hydroxybenzoic acid (HBA) and 6-hydroxy-2-naphthoic acid (HNA).
• HBA p-hydroxybenzoic acid
• HNA 6-hydroxy-2-naphthoic acid
• each monomer that makes up the liquid crystal polymer can be analyzed using reactive pyrolysis gas chromatography mass spectrometry (reactive pyrolysis GC-MS method).
• thermoplastic resin constituting the second resin material 11b examples include perfluoroalkoxyalkane (PFA) (fluorine-containing resin), thermoplastic polyimide (TPI), polyphenylene sulfide (PPS), polyether ether ketone (PEEK), polyphenylene ether (PPE), polymethylpentene (PMP), cross-linked polyethylene (XLPE), polynorbornene (PNB), etc.
• PFA perfluoroalkoxyalkane
• TPI thermoplastic polyimide
• PPS polyphenylene sulfide
• PEEK polyether ether ketone
• PPE polyphenylene ether
• PMP polymethylpentene
• XLPE cross-linked polyethylene
• PBN polynorbornene
• the second resin material 11b is preferably made of perfluoroalkoxyalkane, thermoplastic polyimide, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polymethylpentene, cross-linked polyethylene, or polynorbornene.
• the second resin material 11b is more preferably made of perfluoroalkoxyalkane, polymethylpentene, or polynorbornene.
• perfluoroalkoxyalkanes have a lower relative dielectric constant than liquid crystal polymers
• the dielectric properties of the laminated substrate 1 in the high frequency range are more likely to be improved.
• perfluoroalkoxyalkanes have low hygroscopicity like liquid crystal polymers
• the dielectric properties of the laminated substrate 1 are less likely to change due to moisture absorption.
• perfluoroalkoxyalkanes have a high heat resistance temperature of 260°C or higher
• the laminated substrate 1 is less likely to be damaged, for example, when the laminated substrate 1 is incorporated into an electronic device by reflow soldering.
• the dielectric properties of the laminated substrate 1 in the high frequency range are improved by making the second resin material 11b of polymethylpentene. Since polymethylpentene has low hygroscopicity, similar to perfluoroalkoxyalkanes, the dielectric properties of the laminated substrate 1 are less likely to change due to moisture absorption by making the second resin material 11b of polymethylpentene. Furthermore, since polymethylpentene has a smaller thermal expansion coefficient than perfluoroalkoxyalkanes, the laminated substrate 1 is less likely to change in dimensions by making the second resin material 11b of polymethylpentene.
• polymethylpentene has a higher tensile strength (e.g., tensile elongation at break) than perfluoroalkoxyalkanes, the strength of the laminated substrate 1 is increased by making the second resin material 11b of polymethylpentene.
• the dielectric properties of the laminated substrate 1 in the high frequency range are improved by making the second resin material 11b from polynorbornene. Furthermore, since polynorbornene has low hygroscopicity, similar to perfluoroalkoxyalkanes, the dielectric properties of the laminated substrate 1 are less likely to change due to moisture absorption when the second resin material 11b is made from polynorbornene.
• the laminated substrate 1 is less likely to change in dimensions when the second resin material 11b is made from polynorbornene. Furthermore, since polynorbornene has a higher tensile modulus than perfluoroalkoxyalkanes, the bending rigidity of the laminated substrate 1 is increased when the second resin material 11b is made from polynorbornene.
• the type of resin material present in the resin layer is identified as follows. First, the laminated substrate is polished to expose a cross section along the thickness direction (e.g., a first cross section). Then, the cross section of the laminated substrate is analyzed using a Fourier transform infrared microscope (FT-IR microscope) to identify the type of resin material present in the resin layer.
• FT-IR microscope Fourier transform infrared microscope
• the second resin material 11b is dispersed in the first resin material 11a. This allows the second resin material 11b to function as a filler for the first resin material 11a, making it easier for the second resin material 11b to be bound by the first resin material 11a.
• the first resin layer 10a and the second resin layer 10b may each further contain materials other than the first resin material 11a and the second resin material 11b (e.g., resin materials).
• the content of the first resin material 11a is the largest in each of the first resin layer 10a and the second resin layer 10b, and the content of the second resin material 11b is the next largest.
• the content of the resin material is determined, for example, by using image analysis software to measure the area ratio of the resin material in a cross-sectional image (e.g., an image of the first cross-section) along the thickness direction of the resin layer.
• the first conductor layer 20a is located between the first resin layer 10a and the second resin layer 10b, and is provided so as to be in contact with the first main surface 10aa of the first resin layer 10a and the fourth main surface 10bb of the second resin layer 10b. In this way, no other layers such as adhesive layers are provided between the first resin layer 10a and the first conductor layer 20a, and between the second resin layer 10b and the first conductor layer 20a.
• the first conductor layer 20a is preferably provided across the interface between the first resin layer 10a and the second resin layer 10b.
• the interface between the first resin layer 10a and the first conductor layer 20a and the interface between the second resin layer 10b and the first conductor layer 20a are shifted in the thickness direction from the interface between the first resin layer 10a and the second resin layer 10b, thereby suppressing peeling at the interface between the first resin layer 10a and the first conductor layer 20a and the interface between the second resin layer 10b and the first conductor layer 20a.
• Examples of materials that can be used to form the first conductor layer 20a include copper, silver, aluminum, stainless steel, nickel, gold, and alloys that contain at least one of these metals.
• the thickness of the first conductor layer 20a is preferably 1 ⁇ m or more and 35 ⁇ m or less, and more preferably 6 ⁇ m or more and 18 ⁇ m or less.
• the melting point of the resin material present in the resin layer is determined as follows. First, the conductor layer is removed from the laminated substrate by peeling, etching, or other methods to extract the resin layer. Then, the target resin material (e.g., the first resin material or the second resin material) is extracted from the resin layer by scraping or other methods. After that, the melting point of the target resin material is measured using a differential scanning calorimeter (DSC). Note that if the melting point of the target resin material cannot be clearly measured using the above-mentioned method, or if the target resin material is an amorphous resin material, the glass transition temperature (Tg) may be used instead.
• DSC differential scanning calorimeter
• the thermal expansion coefficient of the first resin material 11a is CTE1
• the thermal expansion coefficient of the second resin material 11b is CTE2
• the thermal expansion coefficient of the first conductor layer 20a is CTE3, then
• CTE1 ⁇ CTE2 In the laminate substrate 1, it is preferable that CTE1 ⁇ CTE2. In this case, it is preferable that the difference between CTE1 and CTE2 is 20 ppm/°C or more and 120 ppm/°C or less.
• CTE1 ⁇ CTE3 In the laminate substrate 1, it is preferable that CTE1 ⁇ CTE3. In this case, it is preferable that the difference between CTE1 and CTE3 is 2 ppm/°C or more and 10 ppm/°C or less.
• CTE3 is approximately 16 ppm/°C.
• the thermal expansion coefficient in the plane direction of the resin material present in the resin layer is determined as follows. First, the target resin layer (for example, the first resin layer) is taken out by removing the conductor layer, etc. from the laminated substrate by a method such as peeling or etching. Then, the thermal expansion coefficient in the plane direction of the target resin layer is measured by a thermomechanical analysis (TMA) method.
• TMA thermomechanical analysis
• a sample of the resin layer with a length of 20 mm and a width of 4 mm is cut out, and the sample of the resin layer is heated once and then cooled under the measurement conditions of the measurement mode being a tensile mode, the chuck distance being 10 mm, the load being 5 g, the heating rate being 40°C/min, and the heating rate being 10°C/min, and the temperature is lowered, and the change in the chuck distance in the temperature range from 100°C to 50°C during the temperature lowering process is measured to obtain the thermal expansion coefficient in the plane direction of the sample of the target resin layer.
• the elastic modulus of the sample of the target resin layer is measured by the tensile mode of dynamic viscoelasticity measurement (DMA).
• the type of resin material present in the target resin layer sample is identified for a cross section (e.g., a first cross section) along the thickness direction of the target resin layer sample by the above-mentioned method. Then, for example, using image analysis software, the area ratio of the target resin material (e.g., the first resin material or the second resin material) in the cross section of the target resin layer sample is measured. Also, the elastic modulus of the target resin material in the cross section of the target resin layer sample is measured by the elastic modulus measurement mode of a scanning probe microscope (SPM).
• SPM scanning probe microscope
• the thermal expansion coefficient in the plane direction of the target resin material is calculated according to the area ratio and elastic modulus of the target resin material from the thermal expansion coefficient in the plane direction of the target resin layer sample.
• the thermal expansion coefficient in the plane direction of the first resin material 11a is CTE1 (unit: ppm/°C)
• the thermal expansion coefficient in the plane direction of the second resin material 11b is CTE2 (unit: ppm/°C)
• the thermal expansion coefficient in the plane direction of the sample of the first resin layer 10a is CTEt (unit: ppm/°C)
• the elastic modulus of the first resin material 11a is E1 (unit: GPa)
• the elastic modulus of the second resin material 11b is E2 (unit: GPa)
• the elastic modulus of the sample of the first resin layer 10a is Et (unit: GPa)
• the area ratio of the first resin material 11a is V
• CTE1 ⁇ E1 ⁇ V1+CTE2 ⁇ E2 ⁇ V2 CTEt ⁇ Et ⁇ (V1+V2)...(A)
• CTEt, E1, E2, Et, V1, and V2 are measured by the above-mentioned method.
• CTE2 is measured by the following method. First, the sample of the first resin layer 10a is treated with a strong alkali to remove the first resin material 11a from the sample of the first resin layer 10a. Then, the second resin material 11b (a mass of a plurality of irregular shapes) taken out from the sample of the first resin layer 10a is subjected to a hot press process (pressure is set to, for example, 2 MPa or more and 3 MPa or less) at a temperature 20° C.
• a hot press process pressure is set to, for example, 2 MPa or more and 3 MPa or less
• the thermal expansion coefficient of the conductor layer in the planar direction is determined as follows. First, the target conductor layer is removed from the laminated substrate by a method such as peeling. Then, the thermal expansion coefficient of the target conductor layer in the planar direction is measured by thermomechanical analysis. When measuring the thermal expansion coefficient of the conductor layer in the planar direction, the same measurement conditions are used as when measuring the thermal expansion coefficient of the resin layer in the planar direction, for example.
• the proportion of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a (hereinafter also referred to as the "proportion of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a") is 40% or more and 70% or less.
• the proportion of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is determined as follows.
• FIG. 3 is a schematic enlarged cross-sectional view of a portion of the laminate substrate shown in FIG. 1, illustrating a method for determining the proportion of the second resin material at the interface between the first resin layer and the first conductor layer.
• the laminated substrate 1 is polished to expose a first cross section along the thickness direction as shown in FIG. 1.
• the first cross section of the laminated substrate 1 is imaged at a magnification of 500 times using a scanning electron microscope (SEM).
• SEM scanning electron microscope
• the imaging range includes at least a part of the interface between the first resin layer 10a and the first conductor layer 20a, and has a dimension K in the thickness direction of 100 ⁇ m and a dimension L in the surface direction of 200 ⁇ m.
• the interface between the first resin layer 10a and the first conductor layer 20a can be confirmed by a scanning electron microscope.
• the dimension in the surface direction of the part (exposed part) in contact with the interface between the first resin layer 10a and the first conductor layer 20a is determined.
• 100 x "total dimension in the planar direction of the portion of the second resin material 11b that contacts the interface between the first resin layer 10a and the first conductor layer 20a (the main surface of the first conductor layer 20a on the first resin layer 10a side)" / "dimension L in the planar direction of the imaging range" is calculated; in the example shown in FIG. 3, 100 x (L1 + L2 + L3 + L4 + L5 + L6) / L is calculated, and this is determined as the abundance ratio (unit: %) of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a.
• the proportion of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is 40% or more and 70% or less, thereby realizing a laminate substrate with excellent adhesion between the first resin layer 10a and the first conductor layer 20a and suppressed warping.
• the mechanism by which the laminate substrate 1 achieves the above effects is explained below, showing an example of a method for manufacturing the laminate substrate 1.
• the laminated substrate 1 is manufactured, for example, as follows.
• FIG. 4 is a cross-sectional view that typically illustrates a step of producing a resin sheet with a conductor layer in an example of the method for producing the laminated substrate according to the first embodiment of the present invention.
• the first resin material 11a and the second resin material 11b are mixed together to prepare a resin composition.
• the first resin material 11a and the second resin material 11b are finely ground and then dispersed in a dispersion medium to prepare a paste-like or slurry-like resin composition.
• a dispersion medium for example, butanediol, water, ethanol, a mixture containing at least two of these, or the like is used.
• the resin composition is used to produce a first resin sheet 110a containing a first resin material 11a and a second resin material 11b.
• the first resin sheet 110a is produced, for example, by a method of applying the resin composition and then drying it (to evaporate the dispersion medium), or a method of making the resin composition into paper and then drying it (to evaporate the dispersion medium), etc.
• sheet is synonymous with film, and there is no distinction between the two based on thickness.
• a first resin sheet 210a with a conductor layer is produced as shown in FIG. 4, in which a first resin sheet 110a has a first main surface 110aaa and a second main surface 110ab opposed to each other in the thickness direction, and a conductor layer 20x is adjacent to the second main surface 110ab side of the first resin sheet 110a.
• the conductor layer 20x is pressed against the second main surface 110ab of the first resin sheet 110a, thereby producing the first resin sheet 210a with a conductor layer.
• the laminate of the first resin sheet 110a and the conductor layer 20x is heated and pressed in the thickness direction to perform a hot press process.
• the temperature during the hot press process is preferably equal to or higher than the melting point of the second resin material 11b and equal to or lower than the melting point of the first resin material 11a (i.e., Tm2 or higher and Tm1 or lower), and more preferably equal to or higher than the melting point of the second resin material 11b and equal to or lower than a temperature 10°C lower than the melting point of the first resin material 11a (i.e., Tm2 or higher and (Tm1-10) or lower).
• the temperature rise rate during the hot press process is preferably 5°C/min or higher, and more preferably 5°C/min or higher and 50°C/min or lower.
• the hot press process is performed under the above temperature conditions, for example, as shown in FIG. 4, the second resin material 11b melts and connects in the planar direction, making it easier to form a flat shape (layer) along the planar direction, and furthermore, it is easier to have a flat shape on the first main surface 110aa of the first resin sheet 110a.
• the conductor layer 20x may be patterned by etching after it is pressed onto the first resin sheet 110a.
• FIG. 5 is a cross-sectional view that shows a schematic diagram of a process for producing a resin sheet with another conductor layer in an example of a method for producing a laminated substrate according to embodiment 1 of the present invention.
• the second resin sheet 210b with a conductor layer as shown in FIG. 5 is produced, in which the first conductor layer 20a is adjacent to the fourth main surface 110bb side of the second resin sheet 110b having a third main surface 110ba and a fourth main surface 110bb that face each other in the thickness direction.
• a hot press process for example, under the above-mentioned temperature conditions, as shown in FIG.
• the second resin material 11b melts and connects in the surface direction, making it easier to form a flat shape (layered) along the surface direction, and furthermore, it is easier to exist in a flat shape on the third main surface 110ba of the second resin sheet 110b.
• FIG. 6 is a cross-sectional view that typically illustrates a step of laminating resin sheets with conductor layers in an example of the method for producing the laminated substrate according to the first embodiment of the present invention.
• the first resin sheet 210a with a conductor layer and the second resin sheet 210b with a conductor layer are laminated in the thickness direction.
• the first resin sheet 210a with a conductor layer and the second resin sheet 210b with a conductor layer are laminated in the thickness direction so that the surface of the first resin sheet 210a with a conductor layer facing the first resin sheet 110a and the surface of the second resin sheet 210b with a conductor layer facing the first conductor layer 20a are in contact with each other.
• FIG. 6 shows the resin sheets with conductor layers spaced apart from each other.
• the obtained laminate is subjected to a hot press process by applying heat and pressure in the thickness direction.
• the first resin sheet 210a with the conductor layer and the second resin sheet 210b with the conductor layer are pressed together, and the first resin sheet 110a and the second resin sheet 110b become the first resin layer 10a and the second resin layer 10b, respectively.
• the temperature during the hot press processing is preferably equal to or higher than the melting point of the second resin material 11b and equal to or lower than the melting point of the first resin material 11a (i.e., Tm2 or higher and Tm1 or lower), and more preferably equal to or higher than the melting point of the second resin material 11b and equal to or lower than a temperature 10°C lower than the melting point of the first resin material 11a (i.e., Tm2 or higher and (Tm1-10) or lower).
• the temperature rise rate during the hot press processing is preferably 5°C/min or higher, and more preferably 5°C/min or higher and 50°C/min or lower.
• the hot press process can be performed at a temperature equal to or higher than Tm2 and equal to or lower than Tm1.
• the fluidity of the second resin material 11b present at (or in the vicinity of) the interface between the first resin layer 10a and the first conductor layer 20a increases, shortening the distance between the second resin material 11b in the first resin layer 10a and the first conductor layer 20a.
• the proportion of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is 40% or more, so the adhesion between the second resin material 11b in the first resin layer 10a and the first conductor layer 20a is high. As a result, the adhesion between the first resin layer 10a and the first conductor layer 20a is excellent.
• the hot press processing is performed at a temperature equal to or lower than Tm1
• the fluidity of the first resin material 11a is not increased, and the aggregation of the second resin material 11b by the first resin material 11a is suppressed.
• the second resin material 11b it is possible for the second resin material 11b to exist while maintaining a flat shape along the surface direction.
• the presence ratio of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is 70% or less, the dimensional change of the second resin material 11b is suppressed by the first resin material 11a, which is less susceptible to dimensional change relative to the first conductor layer 20a, at the interface between the first resin layer 10a and the first conductor layer 20a.
• the thermal expansion coefficient in the planar direction of the first resin layer 10a which contains the first resin material 11a and the second resin material 11b, approaches the thermal expansion coefficient in the planar direction of the first conductor layer 20a, so warping caused by the difference in the thermal expansion coefficient in the planar direction of the first resin layer 10a and the first conductor layer 20a, that is, the difference in the dimensional change of the first resin layer 10a and the first conductor layer 20a, is suppressed.
• the conductor layer 20x is removed by a method such as peeling or etching. Note that the conductor layer 20x may be removed before performing the hot press processing.
• FIG. 7 is an example of an enlarged cross-sectional image of a laminated substrate according to embodiment 1 of the present invention.
• the presence ratio of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is preferably 50% or more and 70% or less. Also, from the viewpoint of suppressing warping of the laminated substrate 1, the presence ratio of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is preferably 40% or more and 60% or less.
• the presence ratio of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is preferably 50% or more and 60% or less.
• the presence ratio of the second resin material 11b at the interface between the second resin layer 10b and the first conductor layer 20a is preferably 40% or more and 70% or less. From the viewpoint of achieving excellent adhesion between the second resin layer 10b and the first conductor layer 20a, it is more preferable that the presence ratio of the second resin material 11b at the interface between the second resin layer 10b and the first conductor layer 20a is 50% or more and 70% or less.
• the presence ratio of the second resin material 11b at the interface between the second resin layer 10b and the first conductor layer 20a is 40% or more and 60% or less. Therefore, from the viewpoint of improving the adhesion between the second resin layer 10b and the first conductor layer 20a and suppressing warping of the laminated substrate 1, it is more preferable that the proportion of the second resin material 11b at the interface between the second resin layer 10b and the first conductor layer 20a is 50% or more and 60% or less.
• the average thickness of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is 5 ⁇ m or less.
• the thickness of the second resin material 11b which is prone to dimensional change relative to the first conductor layer 20a, is reduced at the interface between the first resin layer 10a and the first conductor layer 20a, so the first resin material 11a tends to suppress dimensional change in the second resin material 11b.
• the first resin layer 10a containing the first resin material 11a and the second resin material 11b has excellent dimensional stability.
• the average thickness of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a is 1 ⁇ m or more.
• the average aspect ratio of the second resin material 11b is 3 or more. In this case, even if a tensile stress is applied to the laminate substrate 1 by pulling the laminate substrate 1, the tensile stress is unlikely to concentrate at the interface between the first resin material 11a and the second resin material 11b, so that cracks originating from the interface between the first resin material 11a and the second resin material 11b are unlikely to occur.
• the bending stress is unlikely to concentrate at the interface between the first resin material 11a and the second resin material 11b, so that cracks originating from the interface between the first resin material 11a and the second resin material 11b are unlikely to occur.
• the tensile resistance and bending resistance of the laminate substrate 1 are excellent.
• the average aspect ratio of the second resin material 11b is 50 or less.
• the average inclination of the second resin material 11b with respect to the surface direction (hereinafter also referred to as the "average inclination of the second resin material 11b") is preferably 15° or less. In this case, even if a tensile stress is applied to the laminate substrate 1 by pulling the laminate substrate 1, the tensile stress is unlikely to concentrate at the interface between the first resin material 11a and the second resin material 11b, so that cracks originating from the interface between the first resin material 11a and the second resin material 11b are unlikely to occur.
• the bending stress is unlikely to concentrate at the interface between the first resin material 11a and the second resin material 11b, so that cracks originating from the interface between the first resin material 11a and the second resin material 11b are unlikely to occur.
• the tensile resistance and bending resistance of the laminate substrate 1 are excellent.
• the average inclination of the second resin material 11b relative to the surface direction may be 0° or more.
• the average aspect ratio of the second resin material 11b is 3 or more and that the average inclination of the second resin material 11b with respect to the surface direction is 15° or less.
• the second resin material 11b is said to have a flat shape along the surface direction.
• the second resin material 11b has a flat shape along the surface direction, even if a tensile stress is applied to the laminate substrate 1 in the surface direction, the number of locations that can become the starting point of cracks is likely to decrease at the interface between the first resin material 11a and the second resin material 11b, which have different elastic moduli (e.g., Young's modulus) in the surface direction. As a result, the tensile resistance of the laminate substrate 1 is improved.
• the average thickness, average aspect ratio, and average slope of the second resin material 11b are determined as follows:
• Figure 8 is a cross-sectional view illustrating a method for determining the average thickness, average aspect ratio, and average slope of the second resin material.
• a method for determining the average thickness of the second resin material 11b will be described.
• a rectangle P with a minimum area circumscribing the second resin material 11b is drawn using image analysis software as shown in FIG. 8.
• the rectangle P is composed of a short side P1 extending in the thickness direction and a long side P2 extending in the surface direction.
• the dimension of the short side P1 of the rectangle P is measured and this is determined as the thickness of the second resin material 11b.
• the thickness of each of the 50 or more second resin materials 11b present on the first main surface 10aa of the first resin layer 10a is measured in the cross-sectional image of the laminated substrate 1, and the average value of these is determined as the average thickness of the second resin material 11b.
• an ellipse Q with the minimum area circumscribing the second resin material 11b is drawn using image analysis software as shown in FIG. 8. Then, for the ellipse Q, the dimension of the major axis Q2/the dimension of the minor axis Q1 are measured, and this is determined as the aspect ratio of the second resin material 11b. In this way, the aspect ratios of 50 or more second resin materials 11b are measured in the cross-sectional image of the laminated substrate 1, and the average value of these is determined as the average aspect ratio of the second resin material 11b.
• the second resin material 11b contacts a portion of the main surface of the first conductor layer 20a facing the first resin layer 10a.
• the elastic modulus e.g., Young's modulus
• the second resin material 11b is in contact with a portion of the main surface of the first conductor layer 20a facing the first resin layer 10a, except for both ends of the main surface of the first conductor layer 20a facing the first resin layer 10a, but the embodiment may be other than that shown in FIG. 2.
• FIG. 9 is an enlarged schematic cross-sectional view of another example of a laminated substrate according to embodiment 1 of the present invention, as viewed from the second cross section.
• the second resin material 11b is in contact with one end of the main surface of the first conductor layer 20a facing the first resin layer 10a.
• FIG. 10 is an enlarged schematic cross-sectional view of yet another example of the laminated substrate of embodiment 1 of the present invention, as viewed from the second cross section.
• the second resin material 11b contacts both ends of the main surface of the first conductor layer 20a facing the first resin layer 10a.
• the relative dielectric constant of the first resin material 11a is Dk1 and the relative dielectric constant of the second resin material 11b is Dk2, it is preferable that Dk1 > Dk2.
• the relative dielectric constant of the resin material present in the resin layer is determined as follows. For example, when the first resin layer 10a containing the first resin material 11a and the second resin material 11b is used as a sample, the first resin layer 10a is first treated with a strong alkali to extract the second resin material 11b. The extracted second resin material 11b is then molded into a sheet having a thickness of 50 ⁇ m or more and 500 ⁇ m or less to obtain a resin sheet sample, and the relative dielectric constant of the second resin material 11b is measured by a dielectric resonator method (mode: TE011 mode, frequency range: 12 GHz or more and 60 GHz or less).
• mode TE011 mode, frequency range: 12 GHz or more and 60 GHz or less.
• the relative dielectric constant of the first resin layer 10a is measured by the dielectric resonator method under the same conditions as above.
• an X-ray CT scanner is used to identify the three-dimensional structure of the first resin material 11a and the second resin material 11b in the first resin layer 10a, and then analysis software is used to measure the volume ratio of the first resin material 11a and the second resin material 11b in the first resin layer 10a.
• the relative dielectric constant of the first resin material 11a is calculated according to the volume ratio of the first resin material 11a and the second resin material 11b in the first resin layer 10a.
• the dielectric tangent of the first resin material 11a is Df1 and the dielectric tangent of the second resin material 11b is Df2, it is preferable that Df1 > Df2.
• the dielectric loss tangent of the resin material present in the resin layer is determined as follows. For example, when the first resin layer 10a containing the first resin material 11a and the second resin material 11b is used as a sample, the first resin layer 10a is first treated with a strong alkali to extract the second resin material 11b. The extracted second resin material 11b is then molded into a sheet having a thickness of 50 ⁇ m or more and 500 ⁇ m or less to obtain a resin sheet sample, and the dielectric loss tangent of the second resin material 11b is measured by a dielectric resonator method (mode: TE011 mode, frequency range: 12 GHz or more and 60 GHz or less).
• mode TE011 mode, frequency range: 12 GHz or more and 60 GHz or less.
• the dielectric loss tangent of the first resin layer 10a is measured by the dielectric resonator method under the same conditions as above.
• an X-ray CT scanner is used to identify the three-dimensional structure of the first resin material 11a and the second resin material 11b in the first resin layer 10a, and then analysis software is used to measure the volume ratio of the first resin material 11a and the second resin material 11b in the first resin layer 10a.
• the dielectric tangent of the first resin material 11a is calculated according to the volume ratio of the first resin material 11a and the second resin material 11b in the first resin layer 10a from the dielectric tangent of the first resin layer 10a and the dielectric tangent of the second resin material 11b measured by the above-mentioned method.
• the adhesion (e.g., tensile elongation at break) between the second resin materials 11b is higher than the adhesion (e.g., tensile elongation at break) between the first resin materials 11a.
• the adhesion strength between the resin layers of the laminated substrate 1 is likely to be improved.
• the magnitude relationship of the adhesion (e.g., tensile elongation at break) between resin materials of the same type present in a resin layer is determined as follows. First, in the laminated substrate, a tensile stress is applied to the resin layer by pulling the resin layer. At this time, for example, after removing the resin layer from the laminated substrate, a tensile test of the resin layer is performed in accordance with "JIS K 7127-1999". Then, when tensile stress is applied to the resin layer, it is confirmed which resin material breaks first.
• a tensile stress is applied to the resin layer by pulling the resin layer.
• the adhesion e.g., tensile elongation at break
• the adhesion e.g., tensile elongation at break
• the laminated substrate 1 When the laminated substrate 1 is used as a circuit board, the laminated substrate 1 may have a first conductor layer 20a as a signal line for transmitting signals, forming a transmission line.
• the laminate substrate 1 has the first conductor layer 20a as a signal line that transmits signals and forms a transmission line, if Dk1>Dk2 as described above, coupled with the presence of the second resin material 11b at the interface between the first resin layer 10a and the first conductor layer 20a being 40% or more and 70% or less, the high frequency characteristics of the laminate substrate 1 will be excellent.
• the laminated substrate according to the second embodiment of the present invention constitutes a stripline type transmission line.
• FIG. 11 is a cross-sectional view that shows a schematic view of an example of a laminated substrate according to embodiment 2 of the present invention, as viewed from the second cross section.
• the laminated substrate 2 shown in FIG. 11 has a first resin layer 10a, a second resin layer 10b, a third resin layer 10c, a fourth resin layer 10d, a first conductor layer 20a, a second conductor layer 20b, and a third conductor layer 20c.
• Laminate substrate 2 has the same configuration as laminate substrate 1, except that it is provided with third resin layer 10c, fourth resin layer 10d, second conductor layer 20b, and third conductor layer 20c.
• the third resin layer 10c has a fifth main surface 10ca and a sixth main surface 10cb that face each other in the thickness direction.
• the fifth main surface 10ca of the third resin layer 10c faces the second main surface 10ab of the first resin layer 10a.
• the fifth main surface 10ca of the third resin layer 10c contacts the second main surface 10ab of the first resin layer 10a.
• the third resin layer 10c contains the first resin material 11a and the second resin material 11b. Furthermore, in the laminated substrate 2, when viewed in a cross section along the thickness direction, it is preferable that the presence ratio of the second resin material 11b is 40% or more and 70% or less on the fifth main surface 10ca of the third resin layer 10c.
• the dimensional change of the second resin material 11b is suppressed by the first resin material 11a, which is resistant to dimensional change, on the fifth main surface 10ca of the third resin layer 10c, so warping due to dimensional change of the third resin layer 10c is suppressed.
• the fifth main surface 10ca of the third resin layer 10c here the interface between the first resin layer 10a and the third resin layer 10c, can be easily confirmed using a fluorescent microscope in addition to a scanning electron microscope.
• the presence ratio of the second resin material 11b on the fifth main surface 10ca of the third resin layer 10c is 40% or more and 70% or less.
• the presence ratio of the second resin material 11b on the fifth main surface 10ca of the third resin layer 10c may be 40% or more and 70% or less.
• the fourth resin layer 10d has a seventh principal surface 10da and an eighth principal surface 10db that face each other in the thickness direction.
• the eighth principal surface 10db of the fourth resin layer 10d faces the third principal surface 10ba of the second resin layer 10b.
• the eighth principal surface 10db of the fourth resin layer 10d contacts the third principal surface 10ba of the second resin layer 10b.
• the fourth resin layer 10d contains the first resin material 11a and the second resin material 11b. Furthermore, in the laminated substrate 2, when viewed in a cross section along the thickness direction, it is preferable that the presence ratio of the second resin material 11b is 40% or more and 70% or less on the eighth main surface 10db of the fourth resin layer 10d.
• the first resin material 11a which is resistant to dimensional change, suppresses dimensional change in the second resin material 11b on the eighth main surface 10db of the fourth resin layer 10d, thereby suppressing warping due to dimensional change in the fourth resin layer 10d.
• the eighth main surface 10db of the fourth resin layer 10d here the interface between the second resin layer 10b and the fourth resin layer 10d, can be easily confirmed using a fluorescent microscope in addition to a scanning electron microscope.
• the presence ratio of the second resin material 11b is 40% or more and 70% or less on the eighth main surface 10db of the fourth resin layer 10d.
• the presence ratio of the second resin material 11b may be 40% or more and 70% or less on the eighth main surface 10db of the fourth resin layer 10d.
• the presence ratio of the second resin material 11b is 40% or more and 70% or less on the third main surface 10ba of the second resin layer 10b.
• the fluidity of the second resin material 11b present in the vicinity of the third main surface 10ba of the second resin layer 10b is increased, and coupled with the shortening of the distance between the second resin material 11b in the second resin layer 10b and the second resin material 11b in the fourth resin layer 10d, the adhesion between the second resin layer 10b and the fourth resin layer 10d is excellent.
• the dimensional change of the second resin material 11b is suppressed by the first resin material 11a, which is resistant to dimensional change, on the third main surface 10ba of the second resin layer 10b, so warping due to dimensional change of the second resin layer 10b is suppressed.
• the third main surface 10ba of the second resin layer 10b in this case the interface between the second resin layer 10b and the fourth resin layer 10d, can be easily confirmed using a fluorescent microscope in addition to a scanning electron microscope.
• the presence ratio of the second resin material 11b on the third main surface 10ba of the second resin layer 10b is shown to be 40% or more and 70% or less.
• the presence ratio of the second resin material 11b on the third main surface 10ba of the second resin layer 10b may be 40% or more and 70% or less.
• the second conductor layer 20b is in contact with the sixth main surface 10cb of the third resin layer 10c. In this way, no other layers, such as an adhesive layer, are provided between the third resin layer 10c and the second conductor layer 20b.
• the second conductor layer 20b may be in the form of a surface extending over the entire sixth main surface 10cb of the third resin layer 10c, or may be in the form of a pattern such as wiring patterned on a portion of the sixth main surface 10cb of the third resin layer 10c.
• the third conductor layer 20c is in contact with the seventh main surface 10da of the fourth resin layer 10d. In this way, no other layers, such as an adhesive layer, are provided between the fourth resin layer 10d and the third conductor layer 20c.
• the constituent materials of the first conductor layer 20a, the second conductor layer 20b, and the third conductor layer 20c may be the same as each other, may be different from each other, or may be partially different.
• the laminated substrate 2 constitutes a stripline type transmission line.
• the laminated substrate 2 has a first conductor layer 20a as a signal line, and a second conductor layer 20b and a third conductor layer 20c as ground electrodes.
• the second conductor layer 20b and the third conductor layer 20c may be electrically connected via an interlayer connection conductor (not shown) that penetrates the first resin layer 10a, the second resin layer 10b, the third resin layer 10c, and the fourth resin layer 10d in the thickness direction.
• the second conductor layer 20b and the third conductor layer 20c do not have to be electrically connected.
• the second resin material 11b be present in an amount of 40% or more and 70% or less on the third main surface 10ba of the second resin layer 10b, the fifth main surface 10ca of the third resin layer 10c, and the eighth main surface 10db of the fourth resin layer 10d while maintaining a flat shape along the surface direction.
• Laminated substrate 3 has the same configuration as laminated substrate 1, except that it has conductor layer 20x.
• the constituent materials of the first conductor layer 20a and the conductor layer 20x may be the same as each other or different from each other.
• the thicknesses of the first conductor layer 20a and the conductor layer 20x may be the same as each other or may be different from each other.
• Laminated substrate 3 is manufactured in the same manner as laminated substrate 1, except that, for example, conductor layer 20x is not removed.
• the laminated substrate according to the fourth embodiment of the present invention constitutes a coplanar transmission line.
• FIG. 13 is a cross-sectional view that shows a schematic view of an example of a laminated substrate according to embodiment 4 of the present invention, as viewed from the second cross section.
• the conductor layer 20y is located between the first resin layer 10a and the second resin layer 10b, and is provided so as to be in contact with the first main surface 10aa of the first resin layer 10a and the fourth main surface 10bb of the second resin layer 10b. In this way, no other layers such as adhesive layers are provided between the first resin layer 10a and the conductor layer 20y, and between the second resin layer 10b and the conductor layer 20y.
• the conductor layer 20y is preferably provided across the interface between the first resin layer 10a and the second resin layer 10b.
• the interface between the first resin layer 10a and the conductor layer 20y and the interface between the second resin layer 10b and the conductor layer 20y are shifted in the thickness direction from the interface between the first resin layer 10a and the second resin layer 10b, thereby suppressing peeling at the interface between the first resin layer 10a and the conductor layer 20y and the interface between the second resin layer 10b and the conductor layer 20y.
• the conductor layer 20z is located between the first resin layer 10a and the second resin layer 10b, and is provided so as to be in contact with the first main surface 10aa of the first resin layer 10a and the fourth main surface 10bb of the second resin layer 10b. In this way, no other layers such as an adhesive layer are provided between the first resin layer 10a and the conductor layer 20z, and between the second resin layer 10b and the conductor layer 20z.
• the conductor layer 20z is preferably provided across the interface between the first resin layer 10a and the second resin layer 10b.
• the interface between the first resin layer 10a and the conductor layer 20z and the interface between the second resin layer 10b and the conductor layer 20z are shifted in the thickness direction from the interface between the first resin layer 10a and the second resin layer 10b, suppressing peeling at the interface between the first resin layer 10a and the conductor layer 20z and the interface between the second resin layer 10b and the conductor layer 20z.
• the constituent materials of the first conductor layer 20a, the conductor layer 20y, and the conductor layer 20z may be the same as each other, may be different from each other, or may be partially different.
• the thicknesses of the first conductor layer 20a, the conductor layer 20y, and the conductor layer 20z may be the same as each other, may be different from each other, or may be partially different.
• the laminated substrate 4 constitutes a coplanar type transmission line. Specifically, the laminated substrate 4 has a first conductor layer 20a as a signal line, and conductor layers 20y and 20z as ground electrodes. In this configuration, the conductor layers 20y and 20z may be integrated by being connected in the planar direction.
• the laminate substrate 4 is manufactured in the same manner as the laminate substrate 1, except that, for example, when producing the second resin sheet 210b with a conductor layer (see FIG. 5), in addition to the first conductor layer 20a, the conductor layer 20y and the conductor layer 20z are provided adjacent to the fourth main surface 110bb side of the second resin sheet 110b.
• the laminated substrate according to the fifth embodiment of the present invention has a bent portion.
• FIG. 14 is a cross-sectional view that shows a schematic diagram of an example of a laminated substrate according to embodiment 5 of the present invention, as viewed from a first cross section.
• the laminate substrate 5 shown in FIG. 14 has a first resin layer 10a, a second resin layer 10b, a fourth resin layer 10d, a first conductor layer 20a, a third conductor layer 20c, and a conductor layer 20x.
• the conductor layer 20x is in contact with the second main surface 10ab of the first resin layer 10a. In this way, no other layers, such as an adhesive layer, are provided between the first resin layer 10a and the conductor layer 20x.
• the constituent materials of the first conductor layer 20a, the third conductor layer 20c, and the conductor layer 20x may be the same as each other, may be different from each other, or may be partially different.
• the laminated substrate 5 has a bent portion 30.
• the laminated substrate 5 has two bent portions 30.
• the laminated substrate 5 may have one bent portion 30, or three or more bent portions 30.
• the position of the bent portion 30 is not particularly limited.
• the laminated substrate 5 Since the laminated substrate 5 has the bent portion 30, even if tensile stress is applied to the laminated substrate 5 by pulling the laminated substrate 5, the number of locations where the tensile stress is concentrated is reduced, making the laminated substrate 5 less likely to break. Also, even if bending stress is applied to the laminated substrate 5 by bending the laminated substrate 5, the number of locations where the bending stress is concentrated is reduced, making the laminated substrate 5 less likely to break. As a result, the laminated substrate 5 has excellent tensile resistance and bending resistance.
• the laminated substrate according to the sixth embodiment of the present invention has a recess in addition to the bent portion.
• FIG. 15 is a cross-sectional view that shows a schematic diagram of an example of a laminated substrate according to embodiment 6 of the present invention, as viewed from a first cross section.
• the laminate substrate 6 shown in FIG. 15 has a first resin layer 10a, a second resin layer 10b, a third resin layer 10c, a fourth resin layer 10d, a fifth resin layer 10e, a first conductor layer 20a, a second conductor layer 20b, a third conductor layer 20c, a fourth conductor layer 20d, and a conductor layer 20x.
• the fifth principal surface 10ca of the third resin layer 10c faces the second principal surface 10ab of the first resin layer 10a, with the conductor layer 20x sandwiched between them.
• the ninth principal surface 10ea of the fifth resin layer 10e faces the sixth principal surface 10cb of the third resin layer 10c, sandwiching the second conductor layer 20b therebetween.
• the fifth resin layer 10e preferably contains the first resin material 11a and the second resin material 11b. Furthermore, in the laminate substrate 6, when viewed in the first cross section, the presence ratio of the second resin material 11b at the interface between the fifth resin layer 10e and the second conductor layer 20b is preferably 40% or more and 70% or less. In this case, similar to the mechanism described above, the adhesion between the fifth resin layer 10e and the second conductor layer 20b is excellent, and further, warping caused by differences in dimensional changes between the fifth resin layer 10e and the second conductor layer 20b is suppressed.
• the fourth conductor layer 20d is in contact with the tenth principal surface 10eb of the fifth resin layer 10e. In this way, no other layers, such as an adhesive layer, are provided between the fifth resin layer 10e and the fourth conductor layer 20d.
• the constituent materials of the first conductor layer 20a, the second conductor layer 20b, the third conductor layer 20c, the fourth conductor layer 20d, and the conductor layer 20x may be the same as each other, may be different from each other, or may be partially different.
• the thicknesses of the first conductor layer 20a, the second conductor layer 20b, the third conductor layer 20c, the fourth conductor layer 20d, and the conductor layer 20x may be the same as each other, may be different from each other, or may be partially different.
• the laminated substrate 6 has bent portions 30.
• the laminated substrate 6 has two bent portions 30.
• the laminated substrate 6 has a bent portion 30, when it is used as a circuit board, it is possible to configure a transmission line in a bent state.
• the laminated substrate 6 has a recess 40 in addition to the bent portion 30.
• the recess 40 is provided so as to penetrate through the fourth conductor layer 20d, the fifth resin layer 10e, the second conductor layer 20b, and the third resin layer 10c in the thickness direction and reach the conductor layer 20x.
• the size (width, height, etc.) of the recess 40 is not particularly limited.
• the number of resin layers is not particularly limited, as long as it is two or more layers including the first resin layer and the second resin layer.
• Examples 1 to 10 The laminated substrates of Examples 1 to 10 were manufactured by the laminated substrate manufacturing method of the embodiment 1. The manufacturing conditions were as shown in Table 1.
• the "hot press processing" conditions shown in Table 1 are common to the ⁇ process for producing a resin sheet with a conductor layer> and the ⁇ process for laminating resin sheets with a conductor layer>.
• thermomechanical analyzer manufactured by Seiko Instruments Inc. with a chuck distance of 10 mm.
• the sample was heated to 170°C at a heating rate of 40°C/min while applying a load of 5 g, and then cooled to 30°C at a heating rate of 10°C/min.
• the change in the chuck distance in the temperature range from 100°C to 50°C during the cooling process was measured to obtain the thermal expansion coefficient in the surface direction of the first resin layer (referred to as "thermal expansion coefficient of the first resin layer" in Table 1).
• the laminate boards of Examples 1 to 10 which satisfy all of the following conditions: Tm1>Tm2,
• the proportion of the second resin material at the interface between the first resin layer and the first conductor layer is 40% or more and 70% or less
• the peel strength between the first resin layer and the first conductor layer is high, and therefore the adhesion between the two is excellent
• the laminate boards of Examples 2 to 10 in which the proportion of the second resin material at the interface between the first resin layer and the first conductor layer was 50% or more and 70% or less had superior adhesion between the first resin layer and the first conductor layer compared to the laminate board of Example 1 in which the proportion of the second resin material at the interface between the first resin layer and the first conductor layer was 40%.
• the laminate boards of Examples 1 to 10 Among the laminate boards of Examples 1 to 10, the laminate boards of Examples 1 to 3 and 5 to 10 in which the proportion of the second resin material at the interface between the first resin layer and the first conductor layer is 40% or more and 60% or less had less warping than the laminate board of Example 4 in which the proportion of the second resin material at the interface between the first resin layer and the first conductor layer was 70%.
• first resin layer having a first main surface and a second main surface opposed to each other in a thickness direction; a second resin layer having a third main surface and a fourth main surface opposed to each other in the thickness direction, the fourth main surface being opposed to the first main surface; a first conductor layer located between the first resin layer and the second resin layer and provided so as to be in contact with the first principal surface and the fourth principal surface,
• the first resin layer and the second resin layer each include a first resin material made of a thermoplastic resin and a second resin material made of a thermoplastic resin and dispersed in the first resin material, When the melting point of the first resin material is Tm1 and the melting point of the second resin material is Tm2, Tm1>Tm2; In a plane direction perpendicular to the thickness direction, the thermal expansion coefficient of the first resin material is CTE1, the thermal expansion coefficient of the second resin material is CTE2, and the thermal expansion coefficient of the first conductor layer is CTE3,
• the third resin layer includes the first resin material and the second resin material,
• ⁇ 16> The laminated substrate according to any one of ⁇ 1> to ⁇ 15>, wherein, when the relative dielectric constant of the first resin material is Dk1 and the relative dielectric constant of the second resin material is Dk2, Dk1>Dk2.
• the second resin material is selected from the group consisting of perfluoroalkoxyalkane, thermoplastic polyimide, polyphenylene sulfide, polyether ether ketone, polyphenylene ether, polymethylpentene, cross-linked polyethylene, and polynorbornene.

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