JPWO2022004504A1 - - Google Patents

Info

Publication number
JPWO2022004504A1
JPWO2022004504A1 JP2022533900A JP2022533900A JPWO2022004504A1 JP WO2022004504 A1 JPWO2022004504 A1 JP WO2022004504A1 JP 2022533900 A JP2022533900 A JP 2022533900A JP 2022533900 A JP2022533900 A JP 2022533900A JP WO2022004504 A1 JPWO2022004504 A1 JP WO2022004504A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022533900A
Other languages
Japanese (ja)
Other versions
JPWO2022004504A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022004504A1 publication Critical patent/JPWO2022004504A1/ja
Publication of JPWO2022004504A5 publication Critical patent/JPWO2022004504A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022533900A 2020-06-30 2021-06-23 Pending JPWO2022004504A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020113184 2020-06-30
PCT/JP2021/023697 WO2022004504A1 (ja) 2020-06-30 2021-06-23 積層基板

Publications (2)

Publication Number Publication Date
JPWO2022004504A1 true JPWO2022004504A1 (https=) 2022-01-06
JPWO2022004504A5 JPWO2022004504A5 (https=) 2023-01-04

Family

ID=79316203

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022533900A Pending JPWO2022004504A1 (https=) 2020-06-30 2021-06-23

Country Status (4)

Country Link
US (1) US12167545B2 (https=)
JP (1) JPWO2022004504A1 (https=)
CN (1) CN115997484B (https=)
WO (1) WO2022004504A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120323089A (zh) * 2023-06-06 2025-07-15 株式会社村田制作所 伸缩性设备
JPWO2025134699A1 (https=) * 2023-12-22 2025-06-26
TWI909716B (zh) * 2024-09-26 2025-12-21 國立臺灣大學 基板間的訊號傳輸電路

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175279A (ja) * 2003-12-12 2005-06-30 Nippon Mektron Ltd 多層回路基板とその製造方法
JP2009065009A (ja) * 2007-09-07 2009-03-26 Mitsubishi Plastics Inc 多層配線基板
JP2015070175A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 配線層の接続構造体
WO2017081981A1 (ja) * 2015-11-10 2017-05-18 株式会社村田製作所 樹脂多層基板およびその製造方法
WO2019035384A1 (ja) * 2017-08-17 2019-02-21 株式会社村田製作所 多層基板および多層基板の製造方法
WO2020071473A1 (ja) * 2018-10-04 2020-04-09 株式会社村田製作所 積層体及びその製造方法
JP2020072198A (ja) * 2018-10-31 2020-05-07 日鉄ケミカル＆マテリアル株式会社 金属張積層板、回路基板、多層回路基板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5248530A (en) 1991-11-27 1993-09-28 Hoechst Celanese Corp. Heat sealable coextruded lcp film
US5719354A (en) 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
JP2006093439A (ja) * 2004-09-24 2006-04-06 Denso Corp 多層基板及びその製造方法
JP5077448B2 (ja) * 2010-04-02 2012-11-21 株式会社デンソー 半導体チップ内蔵配線基板及びその製造方法
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
KR102340434B1 (ko) * 2016-04-11 2021-12-16 에이지씨 가부시키가이샤 적층체, 프린트 기판, 및 적층체의 제조 방법
WO2018037434A1 (ja) * 2016-08-24 2018-03-01 パナソニックＩｐマネジメント株式会社 回路基板の製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005175279A (ja) * 2003-12-12 2005-06-30 Nippon Mektron Ltd 多層回路基板とその製造方法
JP2009065009A (ja) * 2007-09-07 2009-03-26 Mitsubishi Plastics Inc 多層配線基板
JP2015070175A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 配線層の接続構造体
WO2017081981A1 (ja) * 2015-11-10 2017-05-18 株式会社村田製作所 樹脂多層基板およびその製造方法
WO2019035384A1 (ja) * 2017-08-17 2019-02-21 株式会社村田製作所 多層基板および多層基板の製造方法
WO2020071473A1 (ja) * 2018-10-04 2020-04-09 株式会社村田製作所 積層体及びその製造方法
JP2020072198A (ja) * 2018-10-31 2020-05-07 日鉄ケミカル＆マテリアル株式会社 金属張積層板、回路基板、多層回路基板及びその製造方法

Also Published As

Publication number Publication date
US12167545B2 (en) 2024-12-10
CN115997484A (zh) 2023-04-21
US20230118261A1 (en) 2023-04-20
WO2022004504A1 (ja) 2022-01-06
CN115997484B (zh) 2025-08-12

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