JPWO2022004504A5 - - Google Patents
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- Publication number
- JPWO2022004504A5 JPWO2022004504A5 JP2022533900A JP2022533900A JPWO2022004504A5 JP WO2022004504 A5 JPWO2022004504 A5 JP WO2022004504A5 JP 2022533900 A JP2022533900 A JP 2022533900A JP 2022533900 A JP2022533900 A JP 2022533900A JP WO2022004504 A5 JPWO2022004504 A5 JP WO2022004504A5
- Authority
- JP
- Japan
- Prior art keywords
- thermoplastic resin
- connection conductor
- conductor layer
- layer
- interface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 description 8
- 229920005992 thermoplastic resin Polymers 0.000 description 8
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020113184 | 2020-06-30 | ||
| PCT/JP2021/023697 WO2022004504A1 (ja) | 2020-06-30 | 2021-06-23 | 積層基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2022004504A1 JPWO2022004504A1 (https=) | 2022-01-06 |
| JPWO2022004504A5 true JPWO2022004504A5 (https=) | 2023-01-04 |
Family
ID=79316203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022533900A Pending JPWO2022004504A1 (https=) | 2020-06-30 | 2021-06-23 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US12167545B2 (https=) |
| JP (1) | JPWO2022004504A1 (https=) |
| CN (1) | CN115997484B (https=) |
| WO (1) | WO2022004504A1 (https=) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120323089A (zh) * | 2023-06-06 | 2025-07-15 | 株式会社村田制作所 | 伸缩性设备 |
| JPWO2025134699A1 (https=) * | 2023-12-22 | 2025-06-26 | ||
| TWI909716B (zh) * | 2024-09-26 | 2025-12-21 | 國立臺灣大學 | 基板間的訊號傳輸電路 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5248530A (en) | 1991-11-27 | 1993-09-28 | Hoechst Celanese Corp. | Heat sealable coextruded lcp film |
| US5719354A (en) | 1994-09-16 | 1998-02-17 | Hoechst Celanese Corp. | Monolithic LCP polymer microelectronic wiring modules |
| JP2005175279A (ja) * | 2003-12-12 | 2005-06-30 | Nippon Mektron Ltd | 多層回路基板とその製造方法 |
| JP2006093439A (ja) * | 2004-09-24 | 2006-04-06 | Denso Corp | 多層基板及びその製造方法 |
| JP2009065009A (ja) * | 2007-09-07 | 2009-03-26 | Mitsubishi Plastics Inc | 多層配線基板 |
| JP5077448B2 (ja) * | 2010-04-02 | 2012-11-21 | 株式会社デンソー | 半導体チップ内蔵配線基板及びその製造方法 |
| JP2015070175A (ja) * | 2013-09-30 | 2015-04-13 | 大日本印刷株式会社 | 配線層の接続構造体 |
| WO2016163436A1 (ja) | 2015-04-09 | 2016-10-13 | 株式会社村田製作所 | 複合伝送線路および電子機器 |
| JP6696996B2 (ja) * | 2015-11-10 | 2020-05-20 | 株式会社村田製作所 | 樹脂多層基板およびその製造方法 |
| KR102340434B1 (ko) * | 2016-04-11 | 2021-12-16 | 에이지씨 가부시키가이샤 | 적층체, 프린트 기판, 및 적층체의 제조 방법 |
| WO2018037434A1 (ja) * | 2016-08-24 | 2018-03-01 | パナソニックＩｐマネジメント株式会社 | 回路基板の製造方法 |
| JP2021007115A (ja) * | 2017-08-17 | 2021-01-21 | 株式会社村田製作所 | 多層基板 |
| WO2020071473A1 (ja) * | 2018-10-04 | 2020-04-09 | 株式会社村田製作所 | 積層体及びその製造方法 |
| JP7229725B2 (ja) * | 2018-10-31 | 2023-02-28 | 日鉄ケミカル＆マテリアル株式会社 | 金属張積層板、回路基板、多層回路基板及びその製造方法 |
-
2021
- 2021-06-23 JP JP2022533900A patent/JPWO2022004504A1/ja active Pending
- 2021-06-23 WO PCT/JP2021/023697 patent/WO2022004504A1/ja not_active Ceased
- 2021-06-23 CN CN202180044784.6A patent/CN115997484B/zh active Active
-
2022
- 2022-12-16 US US18/082,619 patent/US12167545B2/en active Active
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