CN115997484B - 层叠基板 - Google Patents

层叠基板

Info

Publication number
CN115997484B
CN115997484B CN202180044784.6A CN202180044784A CN115997484B CN 115997484 B CN115997484 B CN 115997484B CN 202180044784 A CN202180044784 A CN 202180044784A CN 115997484 B CN115997484 B CN 115997484B
Authority
CN
China
Prior art keywords
thermoplastic resin
connection conductor
interlayer connection
resin layer
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180044784.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN115997484A (zh
Inventor
岛村隆之
上坪祐介
水上隆达
福武素直
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of CN115997484A publication Critical patent/CN115997484A/zh
Application granted granted Critical
Publication of CN115997484B publication Critical patent/CN115997484B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0707—Shielding
    • H05K2201/0715—Shielding provided by an outer layer of PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09363—Conductive planes wherein only contours around conductors are removed for insulation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
CN202180044784.6A 2020-06-30 2021-06-23 层叠基板 Active CN115997484B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020-113184 2020-06-30
JP2020113184 2020-06-30
PCT/JP2021/023697 WO2022004504A1 (ja) 2020-06-30 2021-06-23 積層基板

Publications (2)

Publication Number Publication Date
CN115997484A CN115997484A (zh) 2023-04-21
CN115997484B true CN115997484B (zh) 2025-08-12

Family

ID=79316203

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180044784.6A Active CN115997484B (zh) 2020-06-30 2021-06-23 层叠基板

Country Status (4)

Country Link
US (1) US12167545B2 (https=)
JP (1) JPWO2022004504A1 (https=)
CN (1) CN115997484B (https=)
WO (1) WO2022004504A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN120323089A (zh) * 2023-06-06 2025-07-15 株式会社村田制作所 伸缩性设备
JPWO2025134699A1 (https=) * 2023-12-22 2025-06-26
TWI909716B (zh) * 2024-09-26 2025-12-21 國立臺灣大學 基板間的訊號傳輸電路

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102256452A (zh) * 2010-04-02 2011-11-23 株式会社电装 具有内置半导体芯片的电路板以及制造该电路板的方法
CN108925132A (zh) * 2016-04-11 2018-11-30 Ａｇｃ株式会社 层叠体、印刷基板和层叠体的制造方法

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5248530A (en) 1991-11-27 1993-09-28 Hoechst Celanese Corp. Heat sealable coextruded lcp film
US5719354A (en) 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
JP2005175279A (ja) * 2003-12-12 2005-06-30 Nippon Mektron Ltd 多層回路基板とその製造方法
JP2006093439A (ja) * 2004-09-24 2006-04-06 Denso Corp 多層基板及びその製造方法
JP2009065009A (ja) * 2007-09-07 2009-03-26 Mitsubishi Plastics Inc 多層配線基板
JP2015070175A (ja) * 2013-09-30 2015-04-13 大日本印刷株式会社 配線層の接続構造体
WO2016163436A1 (ja) 2015-04-09 2016-10-13 株式会社村田製作所 複合伝送線路および電子機器
JP6696996B2 (ja) * 2015-11-10 2020-05-20 株式会社村田製作所 樹脂多層基板およびその製造方法
WO2018037434A1 (ja) * 2016-08-24 2018-03-01 パナソニックＩｐマネジメント株式会社 回路基板の製造方法
JP2021007115A (ja) * 2017-08-17 2021-01-21 株式会社村田製作所 多層基板
WO2020071473A1 (ja) * 2018-10-04 2020-04-09 株式会社村田製作所 積層体及びその製造方法
JP7229725B2 (ja) * 2018-10-31 2023-02-28 日鉄ケミカル＆マテリアル株式会社 金属張積層板、回路基板、多層回路基板及びその製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102256452A (zh) * 2010-04-02 2011-11-23 株式会社电装 具有内置半导体芯片的电路板以及制造该电路板的方法
CN108925132A (zh) * 2016-04-11 2018-11-30 Ａｇｃ株式会社 层叠体、印刷基板和层叠体的制造方法

Also Published As

Publication number Publication date
JPWO2022004504A1 (https=) 2022-01-06
US12167545B2 (en) 2024-12-10
CN115997484A (zh) 2023-04-21
US20230118261A1 (en) 2023-04-20
WO2022004504A1 (ja) 2022-01-06

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