JPWO2023189794A1 - - Google Patents

Info

Publication number
JPWO2023189794A1
JPWO2023189794A1 JP2024511860A JP2024511860A JPWO2023189794A1 JP WO2023189794 A1 JPWO2023189794 A1 JP WO2023189794A1 JP 2024511860 A JP2024511860 A JP 2024511860A JP 2024511860 A JP2024511860 A JP 2024511860A JP WO2023189794 A1 JPWO2023189794 A1 JP WO2023189794A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024511860A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023189794A1 publication Critical patent/JPWO2023189794A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
JP2024511860A 2022-03-31 2023-03-20 Pending JPWO2023189794A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022060071 2022-03-31
PCT/JP2023/010803 WO2023189794A1 (ja) 2022-03-31 2023-03-20 金属張積層板及びその製造方法

Publications (1)

Publication Number Publication Date
JPWO2023189794A1 true JPWO2023189794A1 (https=) 2023-10-05

Family

ID=88201054

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024511860A Pending JPWO2023189794A1 (https=) 2022-03-31 2023-03-20

Country Status (3)

Country Link
JP (1) JPWO2023189794A1 (https=)
TW (1) TW202404808A (https=)
WO (1) WO2023189794A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN121712830A (zh) * 2023-12-07 2026-03-20 富士高分子工业株式会社 氟树脂片材、其制造方法及包含其的覆金属氟树脂基板
JPWO2025134699A1 (https=) * 2023-12-22 2025-06-26
JP2026008847A (ja) 2024-06-28 2026-01-19 日鉄ケミカル&マテリアル株式会社 樹脂フィルム、多層フィルム、金属張積層板及びその製造方法、樹脂組成物、回路基板、電子デバイス並びに電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5413234B2 (ja) * 2009-12-02 2014-02-12 東亞合成株式会社 接着剤組成物並びにこれを用いたカバーレイフィルム及びフレキシブル銅張積層板
JP6590568B2 (ja) * 2015-07-22 2019-10-16 株式会社カネカ 絶縁性フィルム、絶縁性フィルムの製造方法、および金属張積層板の製造方法
JP7824027B2 (ja) * 2019-10-29 2026-03-04 株式会社レゾナック フッ素樹脂基板積層体

Also Published As

Publication number Publication date
WO2023189794A1 (ja) 2023-10-05
TW202404808A (zh) 2024-02-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20260219